Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
The PLA110L can be used to replace mechanical
relays. It offers the superior reliability associated
with semiconductor devices, it has no moving parts,
and it offers faster, bounce-free switching in a more
compact surface mount or thru-hole package.
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Ordering Information
Part #
PLA110L
PLA110LS
PLA110LSTR
Description
6-Pin Dip (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1000/Reel)
PLA110L
Features
•
Current Limiting
•
3750V
rms
Input/Output Isolation
•
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
No Moving Parts
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
No EMI/RFI Generation
•
Small 6-Pin Package
•
Machine Insertable, Wave Solderable
•
Surface Mount and Tape & Reel Version Available
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook, Pocket
Size)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment-Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Pin Configuration
AC/DC Configuration
+ Control
– Control
NC
1
2
3
6
5
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
– Control
NC
1
2
3
6
5
4
+ Load
– Load
Switching Characteristics of
Normally Open Devices
Form-A
I
F
90%
I
LOAD
t
on
10%
t
off
Pb
DS-PLA110L-R05
e
3
www.ixysic.com
1
I
NTEGRATED
C
IRCUITS
D
IVISION
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage Input to Output
Operational Temperature
Storage Temperature
1
2
PLA110L
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Ratings
400
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current, Continuous
AC/DC Configuration
DC Configuration
Peak
On-Resistance
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Load Current Limiting
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
Conditions
Symbol
Min
Typ
Max
Units
-
10ms
I
L
=150mA
I
L
=250mA
V
L
=400V
P
I
F
=5mA, V
L
=10V
V
L
=50V, f=1MHz
-
I
L
=150mA
-
I
F
=5mA
V
R
=5V
-
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
I
CL
I
F
I
F
V
F
I
R
C
I/O
-
-
-
-
-
-
-
-
-
190
-
0.4
0.9
-
-
-
-
-
-
-
-
-
-
25
235
-
0.7
1.2
-
3
150
250
-
25
9
-
1
0.25
-
280
5
-
1.4
10
-
mA
rms
/ mA
DC
mA
DC
mA
µA
ms
ms
pF
mA
mA
mA
V
µA
pF
2
www.ixysic.com
R05
I
NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=150mA
DC
)
PLA110L
35
30
25
20
15
10
5
0
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=150mA
DC
)
Device Count (N)
Device Count (N)
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
Device Count (N)
0.15
0.21
0.27
0.33
0.39
0.45
0.05
0.07
0.09
0.11
0.13
0.15
Turn-On Time (ms)
Turn-Off Time (ms)
25
20
15
10
5
0
Typical I
F
for Switch Operation
(N=50, I
L
=150mA
DC
)
Typical I
F
for Switch Dropout
(N=50)
25
20
15
10
5
0
35
30
Device Count (N)
25
20
15
10
5
0
0.75
1.05
1.35
1.65
1.95
2.25
Typical On-Resistance Distribution
(N=50, I
F
=5mA, I
L
=150mA
DC
)
Device Count (N)
Device Count (N)
0.75
1.05
1.35
1.65
1.95
2.25
13.1
13.7
14.3
14.9
15.5
16.1
LED Current (mA)
LED Current (mA)
On-Resistance ( )
Typical Blocking Voltage Distribution
(N=50)
35
30
Device Count (N)
25
20
15
10
5
0
441.5 450.5
459.5
468.5
477.5
486.5
Blocking Voltage (V
P
)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
Turn-On Time (ms)
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
0
5
Typical Turn-On Time
vs. LED Forward Current
(I
L
=150mA
DC
)
0.12
0.10
Turn-Off Time (ms)
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=150mA
DC
)
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
0.08
0.06
0.04
0.02
0
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
10
15
20
25
30
35
40
45
50
0
5
10
15
20
25
30
35
40
45
50
Forward Current (mA)
Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R05
www.ixysic.com
3
I
NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical Turn-On Time
vs. Temperature
(I
L
=150mA
DC
)
Turn-Off Time (ms)
PLA110L
3.0
2.5
Turn-On Time (ms)
2.0
1.5
1.0
0.5
0
-40
-20
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
120
Typical Turn-Off Time
vs. Temperature
(I
F
=5mA, I
L
=150mA
DC
)
On-Resistance ( )
25
20
15
10
5
0
Typical On-Resistance
vs. Temperature
(I
F
=5mA, I
L
=150mA
DC
)
I
F
=5mA
I
F
=10mA
I
F
=20mA
0
20
40
60
80
100
Temperature (ºC)
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
3.0
2.5
LED Current (mA)
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=150mA
DC
)
3.0
2.5
LED Current (mA)
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=150mA
DC
)
Load Current (mA)
150
100
50
0
-50
-100
Typical Load Current vs. Load Voltage
(I
F
=5mA)
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
-150
-2.5 -2.0 -1.5 -1.0 -0.5
0
0.5 1.0 1.5 2.0 2.5
Load Voltage (V)
Maximum Load Current
vs. Temperature
300
Blocking Voltage (V
P
)
Load Current (mA)
250
200
150
100
50
0
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
I
F
=20mA
I
F
=10mA
I
F
=5mA
Typical Blocking Voltage
vs. Temperature
480
475
470
465
460
455
450
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Typical Leakage vs. Temperature
Measured Across Pins 4&6
0.035
0.030
Leakage ( A)
0.025
0.020
0.015
0.010
0.005
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Energy Rating Curve
1.2
1.0
Load Current (A)
0.8
0.6
0.4
0.2
0
10 s 100 s 1ms 10ms 100ms
Time
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
www.ixysic.com
R05
I
NTEGRATED
C
IRCUITS
D
IVISION
Manufacturing Information
Moisture Sensitivity
PLA110L
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
PLA110L / PLA110LS
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
PLA110L / PLA110LS
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
