| 型号 |
VSP3200Y-2K |
VSP3200Y/2K |
VSP3200Y/2KG4 |
| 描述 |
Data Acquisition ADCs/DACs - Specialized 16-Bit 8Msps Signal Processor |
Data Acquisition ADCs/DACs - Specialized 16-Bit 8Msps Signal Processor |
Data Acquisition ADCs/DACs - Specialized 16-Bit 8Msps Signal Processor |
| 是否Rohs认证 |
- |
符合 |
符合 |
| 厂商名称 |
- |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
| 零件包装代码 |
- |
QFP |
QFP |
| 包装说明 |
- |
1.40 MM HEIGHT, MS-026BBC, LQFP-48 |
1.4 MM HEIGHT, GREEN, MS-026-BBC, LQFP-48 |
| 针数 |
- |
48 |
48 |
| Reach Compliance Code |
- |
unknown |
unknown |
| Is Samacsys |
- |
N |
N |
| 商用集成电路类型 |
- |
CONSUMER CIRCUIT |
CONSUMER CIRCUIT |
| JESD-30 代码 |
- |
S-PQFP-G48 |
S-PQFP-G48 |
| 长度 |
- |
7 mm |
7 mm |
| 功能数量 |
- |
1 |
1 |
| 端子数量 |
- |
48 |
48 |
| 最高工作温度 |
- |
85 °C |
85 °C |
| 封装主体材料 |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| 封装代码 |
- |
LFQFP |
LFQFP |
| 封装等效代码 |
- |
QFP48,.35SQ,20 |
QFP48,.35SQ,20 |
| 封装形状 |
- |
SQUARE |
SQUARE |
| 封装形式 |
- |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
| 峰值回流温度(摄氏度) |
- |
NOT SPECIFIED |
NOT SPECIFIED |
| 电源 |
- |
5 V |
5 V |
| 认证状态 |
- |
Not Qualified |
Not Qualified |
| 座面最大高度 |
- |
1.6 mm |
1.6 mm |
| 最大供电电压 (Vsup) |
- |
5.3 V |
5.3 V |
| 最小供电电压 (Vsup) |
- |
4.7 V |
4.7 V |
| 表面贴装 |
- |
YES |
YES |
| 技术 |
- |
CMOS |
CMOS |
| 温度等级 |
- |
OTHER |
OTHER |
| 端子形式 |
- |
GULL WING |
GULL WING |
| 端子节距 |
- |
0.5 mm |
0.5 mm |
| 端子位置 |
- |
QUAD |
QUAD |
| 处于峰值回流温度下的最长时间 |
- |
NOT SPECIFIED |
NOT SPECIFIED |
| 宽度 |
- |
7 mm |
7 mm |
| Base Number Matches |
- |
1 |
1 |