型号 |
TPS2066ADRG4 |
TPS2066ADRBRG4 |
TPS2066ADRBTG4 |
描述 |
Power Switch ICs - Power Distribution 2Ch Crnt-Ltd Pwr Dist Sw |
Power Switch ICs - Power Distribution 2Ch Crnt-Ltd Pwr Dist Sw |
Power Switch ICs - Power Distribution 2Ch Crnt-Ltd Pwr Dist Sw |
是否无铅 |
不含铅 |
不含铅 |
不含铅 |
是否Rohs认证 |
符合 |
符合 |
符合 |
厂商名称 |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
零件包装代码 |
SOIC |
SON |
SON |
包装说明 |
SOP, |
HVSON, |
GREEN, PLASTIC, SON-8 |
针数 |
8 |
8 |
8 |
Reach Compliance Code |
unknow |
unknow |
unknow |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
可调阈值 |
NO |
NO |
NO |
模拟集成电路 - 其他类型 |
POWER SUPPLY SUPPORT CIRCUIT |
POWER SUPPLY SUPPORT CIRCUIT |
POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 |
R-PDSO-G8 |
S-PDSO-N8 |
S-PDSO-N8 |
JESD-609代码 |
e4 |
e4 |
e4 |
长度 |
4.9 mm |
3 mm |
3 mm |
湿度敏感等级 |
1 |
1 |
1 |
信道数量 |
2 |
2 |
2 |
功能数量 |
1 |
1 |
1 |
端子数量 |
8 |
8 |
8 |
最高工作温度 |
85 °C |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
SOP |
HVSON |
HVSON |
封装形状 |
RECTANGULAR |
SQUARE |
SQUARE |
封装形式 |
SMALL OUTLINE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
1.75 mm |
1 mm |
1 mm |
最大供电电压 (Vsup) |
5.5 V |
5.5 V |
5.5 V |
最小供电电压 (Vsup) |
2.7 V |
2.7 V |
2.7 V |
标称供电电压 (Vsup) |
5 V |
5 V |
5 V |
表面贴装 |
YES |
YES |
YES |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 |
GULL WING |
NO LEAD |
NO LEAD |
端子节距 |
1.27 mm |
0.65 mm |
0.65 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
3.9 mm |
3 mm |
3 mm |