| 器件名 | 厂商 | 描 述 | 功能 |
|---|---|---|---|
| SY58026UMI | Microchip(微芯科技) | 58026 SERIES, DUAL 2 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, QCC32 | 下载 |
| SY58026UMI | Micrel ( Microchip ) | Multiplexer, 58026 Series, 2-Func, 2 Line Input, 1 Line Output, Complementary Output, 5 X 5 MM, MLF-32 | 下载 |
| SY58026UMI-TR | Microchip(微芯科技) | IC MUX 10.7GBPS DUAL 2:1 32-MLF | 下载 |
| SY58026UMITR | Microchip(微芯科技) | 58026 SERIES, DUAL 2 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, QCC32 | 下载 |
| SY58026UMI TR | Microchip(微芯科技) | IC mux 10.7gbps dual 2:1 32-mlf | 下载 |
| SY58026UMITR | Micrel ( Microchip ) | Multiplexer, 58026 Series, 2-Func, 2 Line Input, 1 Line Output, Complementary Output, 5 X 5 MM, MLF-32 | 下载 |
| 对应元器件 | pdf文档资料下载 |
|---|---|
| SY58026UMI 、 SY58026UMI-TR 、 SY58026UMITR | 下载文档 |
| SY58026UMITR | 下载文档 |
| SY58026UMI TR | 下载文档 |
| SY58026UMI | 下载文档 |
| 型号 | SY58026UMI | SY58026UMI-TR | SY58026UMITR |
|---|---|---|---|
| 描述 | 58026 SERIES, DUAL 2 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, QCC32 | IC MUX 10.7GBPS DUAL 2:1 32-MLF | 58026 SERIES, DUAL 2 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, QCC32 |
| 厂商名称 | Microchip(微芯科技) | - | Microchip(微芯科技) |
| 零件包装代码 | DFN | - | DFN |
| 包装说明 | HVQCCN, LCC32,.2SQ,20 | - | HVQCCN, LCC32,.2SQ,20 |
| 针数 | 32 | - | 32 |
| 制造商包装代码 | MLF | - | MLF |
| Reach Compliance Code | compli | - | compli |
| 其他特性 | SEATED HT-CALCULATED; ALSO OPERATES AT 3.3V SUPPLY | - | SEATED HT-CALCULATED; ALSO OPERATES AT 3.3V SUPPLY |
| 系列 | 58026 | - | 58026 |
| JESD-30 代码 | S-XQCC-N32 | - | S-XQCC-N32 |
| 长度 | 5 mm | - | 5 mm |
| 逻辑集成电路类型 | MULTIPLEXER | - | MULTIPLEXER |
| 功能数量 | 2 | - | 2 |
| 输入次数 | 2 | - | 2 |
| 输出次数 | 1 | - | 1 |
| 端子数量 | 32 | - | 32 |
| 最高工作温度 | 85 °C | - | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C |
| 输出极性 | COMPLEMENTARY | - | COMPLEMENTARY |
| 封装主体材料 | UNSPECIFIED | - | UNSPECIFIED |
| 封装代码 | HVQCCN | - | HVQCCN |
| 封装等效代码 | LCC32,.2SQ,20 | - | LCC32,.2SQ,20 |
| 封装形状 | SQUARE | - | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 最大电源电流(ICC) | 130 mA | - | 130 mA |
| 传播延迟(tpd) | 0.31 ns | - | 0.31 ns |
| 座面最大高度 | 0.9 mm | - | 0.9 mm |
| 最大供电电压 (Vsup) | 2.625 V | - | 2.625 V |
| 最小供电电压 (Vsup) | 2.375 V | - | 2.375 V |
| 标称供电电压 (Vsup) | 2.5 V | - | 2.5 V |
| 表面贴装 | YES | - | YES |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL |
| 端子形式 | NO LEAD | - | NO LEAD |
| 端子节距 | 0.5 mm | - | 0.5 mm |
| 端子位置 | QUAD | - | QUAD |
| 宽度 | 5 mm | - | 5 mm |
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