| 型号 |
STA013 |
STA013B |
STA013T$ |
| 描述 |
SPECIALTY CONSUMER CIRCUIT, PDSO28 |
SPECIALTY CONSUMER CIRCUIT, PBGA64 |
SPECIALTY CONSUMER CIRCUIT, PQFP44 |
| Brand Name |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
| 厂商名称 |
ST(意法半导体) |
ST(意法半导体) |
ST(意法半导体) |
| 零件包装代码 |
SOIC |
BGA |
QFP |
| 包装说明 |
SOP, |
8 X 8 MM, 1.70 MM HEIGHT, LFBGA-64 |
QFP, |
| 针数 |
28 |
64 |
44 |
| Reach Compliance Code |
compli |
compli |
compli |
| 商用集成电路类型 |
CONSUMER CIRCUIT |
CONSUMER CIRCUIT |
CONSUMER CIRCUIT |
| JESD-30 代码 |
R-PDSO-G28 |
S-PBGA-B64 |
S-PQFP-G44 |
| JESD-609代码 |
e4 |
e1 |
e4 |
| 长度 |
17.9 mm |
8 mm |
17.9 mm |
| 功能数量 |
1 |
1 |
1 |
| 端子数量 |
28 |
64 |
44 |
| 最高工作温度 |
70 °C |
70 °C |
70 °C |
| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| 封装代码 |
SOP |
LFBGA |
QFP |
| 封装形状 |
RECTANGULAR |
SQUARE |
SQUARE |
| 封装形式 |
SMALL OUTLINE |
GRID ARRAY, LOW PROFILE, FINE PITCH |
FLATPACK |
| 峰值回流温度(摄氏度) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| 认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
| 座面最大高度 |
2.65 mm |
1.7 mm |
2.65 mm |
| 最大供电电压 (Vsup) |
3.6 V |
3.6 V |
3.6 V |
| 最小供电电压 (Vsup) |
2.7 V |
2.7 V |
2.7 V |
| 表面贴装 |
YES |
YES |
YES |
| 技术 |
CMOS |
CMOS |
CMOS |
| 温度等级 |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| 端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 |
GULL WING |
BALL |
GULL WING |
| 端子节距 |
1.27 mm |
0.8 mm |
1.27 mm |
| 端子位置 |
DUAL |
BOTTOM |
QUAD |
| 处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| 宽度 |
7.5 mm |
8 mm |
7.5 mm |
| 是否Rohs认证 |
符合 |
符合 |
- |