| 型号 |
SA620DK,112 |
SA620DK,118 |
SA620DK112 |
| 描述 |
IC lna mixer vco 1ghz 20ssop |
IC LNA MIXER VCO 1GHZ 20-SSOP |
Up-Down Converters 1 GHZ LV LNA MIXER |
| Source Url Status Check Date |
2013-06-14 00:00:00 |
2013-06-14 00:00:00 |
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| Brand Name |
NXP Semiconduc |
NXP Semiconductor |
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| 厂商名称 |
NXP(恩智浦) |
NXP(恩智浦) |
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| 零件包装代码 |
SSOP2 |
SSOP2 |
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| 包装说明 |
4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20 |
4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20 |
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| 针数 |
20 |
20 |
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| 制造商包装代码 |
SOT266-1 |
SOT266-1 |
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| Reach Compliance Code |
unknow |
unknown |
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| JESD-30 代码 |
R-PDSO-G20 |
R-PDSO-G20 |
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| JESD-609代码 |
e4 |
e4 |
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| 长度 |
6.5 mm |
6.5 mm |
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| 湿度敏感等级 |
1 |
1 |
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| 功能数量 |
1 |
1 |
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| 端子数量 |
20 |
20 |
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| 最高工作温度 |
85 °C |
85 °C |
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| 最低工作温度 |
-40 °C |
-40 °C |
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| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
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| 封装代码 |
LSSOP |
LSSOP |
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| 封装形状 |
RECTANGULAR |
RECTANGULAR |
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| 封装形式 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
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| 峰值回流温度(摄氏度) |
260 |
260 |
- |
| 认证状态 |
Not Qualified |
Not Qualified |
- |
| 座面最大高度 |
1.5 mm |
1.5 mm |
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| 标称供电电压 |
3 V |
3 V |
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| 表面贴装 |
YES |
YES |
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| 电信集成电路类型 |
RF AND BASEBAND CIRCUIT |
RF AND BASEBAND CIRCUIT |
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| 温度等级 |
INDUSTRIAL |
INDUSTRIAL |
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| 端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
| 端子形式 |
GULL WING |
GULL WING |
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| 端子节距 |
0.65 mm |
0.65 mm |
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| 端子位置 |
DUAL |
DUAL |
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| 处于峰值回流温度下的最长时间 |
30 |
30 |
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| 宽度 |
4.4 mm |
4.4 mm |
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