器件名 | 厂商 | 描 述 | 功能 |
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PNX0161 | NXP(恩智浦) | PNX0161 personal audio IC | 下载 |
PNX0161ET | NXP(恩智浦) | PNX0161 personal audio IC | 下载 |
PNX0161N101 | NXP(恩智浦) | PNX0161 personal audio IC | 下载 |
PNX0E221MCR1GS | Nichicon(尼吉康) | Aluminum Electrolytic Capacitor, Polarized, Aluminum (solid Polymer), 2.5V, 20% +Tol, 20% -Tol, 220uF, Surface Mount, 2626, CHIP | 下载 |
PNX0E821MCR1GS | Nichicon(尼吉康) | Aluminum Electrolytic Capacitor, Polarized, Aluminum (solid Polymer), 2.5V, 20% +Tol, 20% -Tol, 820uF, Surface Mount, 4141, CHIP | 下载 |
PNX0G471MCR1GS | Nichicon(尼吉康) | Aluminum Electrolytic Capacitor, Polarized, Aluminum (solid Polymer), 4V, 20% +Tol, 20% -Tol, 470uF, Surface Mount, 4141, CHIP | 下载 |
PNX0G681MCR1GS | Nichicon(尼吉康) | Aluminum Electrolytic Capacitor, Polarized, Aluminum (solid Polymer), 4V, 20% +Tol, 20% -Tol, 680uF, Surface Mount, 4141, CHIP | 下载 |
PNX0J101MCR1GS | Nichicon(尼吉康) | Aluminum Electrolytic Capacitor, Polarized, Aluminum (solid Polymer), 6.3V, 20% +Tol, 20% -Tol, 100uF, Surface Mount, 2626, CHIP | 下载 |
PNX0J151MCR1GS | Nichicon(尼吉康) | Aluminum Electrolytic Capacitor, Polarized, Aluminum (solid Polymer), 6.3V, 20% +Tol, 20% -Tol, 150uF, Surface Mount, 3333, CHIP | 下载 |
PNX0J221MCR1GS | Nichicon(尼吉康) | Aluminum Electrolytic Capacitor, Polarized, Aluminum (solid Polymer), 6.3V, 20% +Tol, 20% -Tol, 220uF, Surface Mount, 3333, CHIP | 下载 |
PNX0J331MCR1GS | Nichicon(尼吉康) | Aluminum Electrolytic Capacitor, Polarized, Aluminum (solid Polymer), 6.3V, 20% +Tol, 20% -Tol, 330uF, Surface Mount, 4141, CHIP | 下载 |
PNX0J471MCR1GS | Nichicon(尼吉康) | Aluminum Electrolytic Capacitor, Polarized, Aluminum (solid Polymer), 6.3V, 20% +Tol, 20% -Tol, 470uF, Surface Mount, 4141, CHIP | 下载 |
PNX1300 | Philips Semiconductors (NXP Semiconductors N.V.) | Media Processors | 下载 |
PNX1300 | NXP(恩智浦) | Media Processors | 下载 |
PNX1300EH,557 | NXP(恩智浦) | IC, SOT553-1 Package, Standard Marking, Tray Dry Pack,Bakeable,Multiple | 下载 |
PNX1300EH/G | NXP(恩智浦) | Nexperia media processor | 下载 |
PNX1300EH/G,557 | NXP(恩智浦) | Nexperia media processor; Package: SOT553-1 (HBGA292); Container: Tray Dry Pack, Bakeable, Multiple | 下载 |
PNX1301 | Philips Semiconductors (NXP Semiconductors N.V.) | Media Processors | 下载 |
PNX1301 | NXP(恩智浦) | Media Processors | 下载 |
PNX1301EH,557 | NXP(恩智浦) | IC MEDIA PROC 180MHZ 292-HBGA | 下载 |
PNX1301EH/G | NXP(恩智浦) | Nexperia media processor | 下载 |
PNX1301EH/G,557 | NXP(恩智浦) | Nexperia media processor; Package: SOT553-1 (HBGA292); Container: Tray Dry Pack, Bakeable, Multiple | 下载 |
PNX1302 | Philips Semiconductors (NXP Semiconductors N.V.) | Media Processors | 下载 |
PNX1302 | NXP(恩智浦) | Media Processors | 下载 |
PNX1302EH,557 | NXP(恩智浦) | IC MEDIA PROC 200MHZ 292-HBGA | 下载 |
PNX1302EH/G | NXP(恩智浦) | Nexperia media processor | 下载 |
PNX1302EH/G,557 | NXP(恩智浦) | Nexperia media processor; Package: SOT553-1 (HBGA292); Container: Tray Dry Pack, Bakeable, Multiple | 下载 |
PNX1311 | Philips Semiconductors (NXP Semiconductors N.V.) | Media Processors | 下载 |
PNX1311 | NXP(恩智浦) | Media Processors | 下载 |
PNX1311EH,557 | NXP(恩智浦) | SOT553-1 Package, Standard Marking, Tray Dry Pack,Bakeable,Multiple | 下载 |
对应元器件 | pdf文档资料下载 |
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PNX1700EH/G 、 PNX1700EH/G,557 、 PNX1701EH 、 PNX1701EH/G 、 PNX1701EH/G,557 、 PNX1702EH 、 PNX1702EH/G 、 PNX1702EH/G,557 | 下载文档 |
PNX1500E 、 PNX1500E/G 、 PNX1500E/G,557 、 PNX1501E/G 、 PNX1501E/G,557 、 PNX1502E/G 、 PNX1502E/G,557 | 下载文档 |
PNX1700EH 、 PNX1700EH-G 、 PNX1701EH 、 PNX1701EH-G 、 PNX1702EH 、 PNX1702EH-G 、 PNX17XX | 下载文档 |
PNX1500E 、 PNX1500G 、 PNX1501E 、 PNX1501G 、 PNX1502E 、 PNX1502G | 下载文档 |
PNX1500EG 、 PNX1501E 、 PNX1501EG 、 PNX1502E 、 PNX1502EG 、 PNX1520E | 下载文档 |
PNX1300EH,557 、 PNX1300EH/G,557 、 PNX1301EH/G,557 、 PNX1302EH/G,557 、 PNX1311EH,557 、 PNX1311EH/G,557 | 下载文档 |
PNX1700EH,557 、 PNX1700EH/G 、 PNX1701EH/G 、 PNX1701EH557 、 PNX1702EH,557 、 PNX1702EH/G | 下载文档 |
PNX1501E,557 、 PNX1502E,557 、 PNX1503E 、 PNX1503E/G 、 PNX1503E/G | 下载文档 |
PNX1300EH/G 、 PNX1301EH/G 、 PNX1302EH/G 、 PNX1311EH/G | 下载文档 |
PNX1300 、 PNX1301 、 PNX1302 、 PNX1311 | 下载文档 |
型号 | PNX1700EH/G | PNX1700EH/G,557 | PNX1701EH | PNX1701EH/G | PNX1701EH/G,557 | PNX1702EH | PNX1702EH/G | PNX1702EH/G,557 |
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描述 | IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other | IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other | IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other | IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other | IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other | IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other | IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other | IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
包装说明 | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, |
针数 | 456 | 456 | 456 | 456 | 456 | 456 | 456 | 456 |
制造商包装代码 | SOT-900-1 | SOT-900-1 | SOT-900-1 | SOT-900-1 | SOT-900-1 | SOT-900-1 | SOT-900-1 | SOT-900-1 |
Reach Compliance Code | unknown | compliant | unknown | unknown | compliant | unknown | unknown | compliant |
商用集成电路类型 | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT |
JESD-30 代码 | R-PBGA-B456 | R-PBGA-B456 | R-PBGA-B456 | R-PBGA-B456 | R-PBGA-B456 | R-PBGA-B456 | R-PBGA-B456 | R-PBGA-B456 |
长度 | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 456 | 456 | 456 | 456 | 456 | 456 | 456 | 456 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.45 mm | 2.45 mm | 2.45 mm | 2.45 mm | 2.45 mm | 2.45 mm | 2.45 mm | 2.45 mm |
最大供电电压 (Vsup) | 1.37 V | 1.37 V | 1.37 V | 1.37 V | 1.37 V | 1.37 V | 1.37 V | 1.37 V |
最小供电电压 (Vsup) | 1.23 V | 1.23 V | 1.23 V | 1.23 V | 1.23 V | 1.23 V | 1.23 V | 1.23 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm |
Source Url Status Check Date | 2013-06-14 00:00:00 | - | 2013-06-14 00:00:00 | 2013-06-14 00:00:00 | - | 2013-06-14 00:00:00 | 2013-06-14 00:00:00 | - |
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