| 器件名 | 厂商 | 描 述 | 功能 |
|---|---|---|---|
| MX7524JP | Maxim(美信半导体) | Digital to Analog Converters - DAC | 下载 |
| MX7524JP+ | Maxim(美信半导体) | Digital to Analog Converters - DAC 8-Bit Precision DAC | 下载 |
| MX7524JP | Rochester Electronics | PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, PQCC20, 0.453 X 0.453 INCH, PLASTIC, LCC-20 | 下载 |
| MX7524JP+T | Maxim(美信半导体) | digital to analog converters - dac 8-bit precision dac | 下载 |
| MX7524JP-T | Maxim(美信半导体) | Digital to Analog Converters - DAC | 下载 |
| 对应元器件 | pdf文档资料下载 |
|---|---|
| MX7524JP 、 MX7524JP+ 、 MX7524JP-T | 下载文档 |
| MX7524JP+T | 下载文档 |
| MX7524JP | 下载文档 |
| 型号 | MX7524JP-T | MX7524JP | MX7524JP+ |
|---|---|---|---|
| 描述 | Digital to Analog Converters - DAC | Digital to Analog Converters - DAC | Digital to Analog Converters - DAC 8-Bit Precision DAC |
| 是否无铅 | 含铅 | 含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | QLCC | QLCC | QLCC |
| 包装说明 | QCCJ, LDCC20,.4SQ | QCCJ, LDCC20,.4SQ | QCCJ, LDCC20,.4SQ |
| 针数 | 20 | 20 | 20 |
| Reach Compliance Code | not_compliant | not_compliant | compliant |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
| 输入格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| JESD-30 代码 | S-PQCC-J20 | S-PQCC-J20 | S-PQCC-J20 |
| JESD-609代码 | e0 | e0 | e3 |
| 长度 | 8.965 mm | 8.965 mm | 8.965 mm |
| 最大线性误差 (EL) | 0.1953% | 0.1953% | 0.1953% |
| 湿度敏感等级 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | 70 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCJ | QCCJ |
| 封装等效代码 | LDCC20,.4SQ | LDCC20,.4SQ | LDCC20,.4SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 峰值回流温度(摄氏度) | 245 | 245 | 260 |
| 电源 | 5/15 V | 5/15 V | 5/15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.57 mm | 4.57 mm | 4.57 mm |
| 最大稳定时间 | 0.5 µs | 0.5 µs | 0.5 µs |
| 最大压摆率 | 2 mA | 2 mA | 2 mA |
| 标称供电电压 | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) |
| 端子形式 | J BEND | J BEND | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 8.965 mm | 8.965 mm | 8.965 mm |
| Factory Lead Time | - | 1 week | 11 weeks |
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