| 器件名 | 厂商 | 描 述 | 功能 |
|---|---|---|---|
| GS88018BT-150 | GSI Technology | 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs | 下载 |
| GS88018BT-150 | Rochester Electronics | Cache SRAM, 512KX18, 7.5ns, CMOS, PQFP100, TQFP-100 | 下载 |
| GS88018BT-150I | GSI Technology | 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs | 下载 |
| GS88018BT-150IT | GSI Technology | Cache SRAM, 512KX18, 7.5ns, CMOS, PQFP100, TQFP-100 | 下载 |
| GS88018BT-150IV | GSI Technology | Cache SRAM, 512KX18, 7.5ns, CMOS, PQFP100, TQFP-100 | 下载 |
| GS88018BT-150IVT | GSI Technology | Cache SRAM, 512KX18, 7.5ns, CMOS, PQFP100, TQFP-100 | 下载 |
| GS88018BT-150T | GSI Technology | Cache SRAM, 512KX18, 7.5ns, CMOS, PQFP100, TQFP-100 | 下载 |
| GS88018BT-150V | GSI Technology | Cache SRAM, 512KX18, 7.5ns, CMOS, PQFP100, TQFP-100 | 下载 |
| GS88018BT-150VT | GSI Technology | Cache SRAM, 512KX18, 7.5ns, CMOS, PQFP100, TQFP-100 | 下载 |
| 对应元器件 | pdf文档资料下载 |
|---|---|
| GS88018BT-150IV 、 GS88018BT-150IVT 、 GS88018BT-150V 、 GS88018BT-150VT | 下载文档 |
| GS88018BT-150 、 GS88018BT-150IT 、 GS88018BT-150T | 下载文档 |
| GS88018BT-150 、 GS88018BT-150I | 下载文档 |
| 型号 | GS88018BT-150VT | GS88018BT-150IV | GS88018BT-150IVT | GS88018BT-150V |
|---|---|---|---|---|
| 描述 | Cache SRAM, 512KX18, 7.5ns, CMOS, PQFP100, TQFP-100 | Cache SRAM, 512KX18, 7.5ns, CMOS, PQFP100, TQFP-100 | Cache SRAM, 512KX18, 7.5ns, CMOS, PQFP100, TQFP-100 | Cache SRAM, 512KX18, 7.5ns, CMOS, PQFP100, TQFP-100 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | GSI Technology | GSI Technology | GSI Technology | GSI Technology |
| 零件包装代码 | QFP | QFP | QFP | QFP |
| 包装说明 | LQFP, | LQFP, | LQFP, | LQFP, |
| 针数 | 100 | 100 | 100 | 100 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
| 最长访问时间 | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns |
| 其他特性 | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 2.5V | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 2.5V | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 2.5V | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 2.5V |
| JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
| 长度 | 20 mm | 20 mm | 20 mm | 20 mm |
| 内存密度 | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit |
| 内存集成电路类型 | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
| 内存宽度 | 18 | 18 | 18 | 18 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 100 | 100 | 100 | 100 |
| 字数 | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | 512000 | 512000 | 512000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C |
| 组织 | 512KX18 | 512KX18 | 512KX18 | 512KX18 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LQFP | LQFP | LQFP | LQFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| 最大供电电压 (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm |
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