| 器件名 | 厂商 | 描 述 | 功能 |
|---|---|---|---|
| GS816236DGD-333 | GSI Technology | Cache SRAM, 512KX36, 4.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 | 下载 |
| GS816236DGD-333I | GSI Technology | 静态随机存取存储器 2.5 or 3.3V 512K x 36 18M | 下载 |
| GS816236DGD-333IT | GSI Technology | Cache SRAM, 512KX36, 4.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 | 下载 |
| GS816236DGD-333IV | GSI Technology | SRAM 1.8/2.5V 512K x 36 18M | 下载 |
| GS816236DGD-333IVT | GSI Technology | Cache SRAM, 512KX36, 5ns, CMOS, PBGA165, ROHS COMPLIANT, BGA-165 | 下载 |
| GS816236DGD-333T | GSI Technology | Cache SRAM, 512KX36, 4.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 | 下载 |
| GS816236DGD-333V | GSI Technology | SRAM 1.8/2.5V 512K x 36 18M | 下载 |
| GS816236DGD-333VT | GSI Technology | Cache SRAM, 512KX36, 5ns, CMOS, PBGA165, ROHS COMPLIANT, BGA-165 | 下载 |
| 对应元器件 | pdf文档资料下载 |
|---|---|
| GS816236DGD-333 、 GS816236DGD-333IT 、 GS816236DGD-333T | 下载文档 |
| GS816236DGD-333IV 、 GS816236DGD-333V | 下载文档 |
| GS816236DGD-333IVT 、 GS816236DGD-333VT | 下载文档 |
| GS816236DGD-333I | 下载文档 |
| 型号 | GS816236DGD-333 | GS816236DGD-333IT | GS816236DGD-333T |
|---|---|---|---|
| 描述 | Cache SRAM, 512KX36, 4.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 | Cache SRAM, 512KX36, 4.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 | Cache SRAM, 512KX36, 4.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 |
| 零件包装代码 | BGA | BGA | BGA |
| 包装说明 | LBGA, | LBGA, | LBGA, |
| 针数 | 165 | 165 | 165 |
| Reach Compliance Code | compliant | compliant | compliant |
| ECCN代码 | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
| 最长访问时间 | 4.5 ns | 4.5 ns | 4.5 ns |
| 其他特性 | ALSO OPERATES AT 3.3V | ALSO OPERATES AT 3.3V | ALSO OPERATES AT 3.3V |
| JESD-30 代码 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 |
| 长度 | 15 mm | 15 mm | 15 mm |
| 内存密度 | 18874368 bit | 18874368 bit | 18874368 bit |
| 内存集成电路类型 | CACHE SRAM | CACHE SRAM | CACHE SRAM |
| 内存宽度 | 36 | 36 | 36 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 165 | 165 | 165 |
| 字数 | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | 512000 | 512000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 70 °C |
| 组织 | 512KX36 | 512KX36 | 512KX36 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LBGA | LBGA | LBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL |
| 座面最大高度 | 1.4 mm | 1.4 mm | 1.4 mm |
| 最大供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V |
| 最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子形式 | BALL | BALL | BALL |
| 端子节距 | 1 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM |
| 宽度 | 13 mm | 13 mm | 13 mm |
| 厂商名称 | - | GSI Technology | GSI Technology |
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