| 型号 |
89HPES10T4G2ZBBC |
89HPES10T4G2ZBBCG |
89HPES10T4G2ZBBCG8 |
| 描述 |
PCI Interface IC PCI EXPRESS SWITCH |
PCI Interface IC PCI EXPRESS SWITCH |
PCI Interface IC PCI EXPRESS SWITCH |
| Brand Name |
- |
Integrated Device Technology |
Integrated Device Technology |
| 是否无铅 |
- |
不含铅 |
不含铅 |
| 是否Rohs认证 |
- |
符合 |
符合 |
| 厂商名称 |
- |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
| 零件包装代码 |
- |
CABGA |
CABGA |
| 包装说明 |
- |
CABGA-324 |
BGA, |
| 针数 |
- |
324 |
324 |
| 制造商包装代码 |
- |
BCG324 |
BCG324 |
| Reach Compliance Code |
- |
compliant |
compliant |
| ECCN代码 |
- |
EAR99 |
EAR99 |
| 总线兼容性 |
- |
PCI; SMBUS |
SMBUS |
| 最大数据传输速率 |
- |
12000 MBps |
12000 MBps |
| JESD-30 代码 |
- |
S-PBGA-B324 |
S-PBGA-B324 |
| JESD-609代码 |
- |
e1 |
e1 |
| 长度 |
- |
19 mm |
19 mm |
| 湿度敏感等级 |
- |
3 |
3 |
| 端子数量 |
- |
324 |
324 |
| 最高工作温度 |
- |
70 °C |
70 °C |
| 封装主体材料 |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| 封装代码 |
- |
BGA |
BGA |
| 封装形状 |
- |
SQUARE |
SQUARE |
| 封装形式 |
- |
GRID ARRAY |
GRID ARRAY |
| 峰值回流温度(摄氏度) |
- |
260 |
260 |
| 座面最大高度 |
- |
1.72 mm |
1.72 mm |
| 最大供电电压 |
- |
1.1 V |
1.1 V |
| 最小供电电压 |
- |
0.9 V |
0.9 V |
| 标称供电电压 |
- |
1 V |
1 V |
| 表面贴装 |
- |
YES |
YES |
| 技术 |
- |
CMOS |
CMOS |
| 温度等级 |
- |
COMMERCIAL |
COMMERCIAL |
| 端子面层 |
- |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 |
- |
BALL |
BALL |
| 端子节距 |
- |
1 mm |
1 mm |
| 端子位置 |
- |
BOTTOM |
BOTTOM |
| 处于峰值回流温度下的最长时间 |
- |
NOT SPECIFIED |
NOT SPECIFIED |
| 宽度 |
- |
19 mm |
19 mm |
| uPs/uCs/外围集成电路类型 |
- |
BUS CONTROLLER, PCI |
BUS CONTROLLER, PCI |
| Base Number Matches |
- |
1 |
1 |