电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

89HPES10T4G2ZBBCG

产品描述PCI Interface IC PCI EXPRESS SWITCH
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小226KB,共30页
制造商IDT (Integrated Device Technology)
标准
下载文档 详细参数 选型对比 全文预览

89HPES10T4G2ZBBCG在线购买

供应商 器件名称 价格 最低购买 库存  
89HPES10T4G2ZBBCG - - 点击查看 点击购买

89HPES10T4G2ZBBCG概述

PCI Interface IC PCI EXPRESS SWITCH

89HPES10T4G2ZBBCG规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码CABGA
包装说明CABGA-324
针数324
制造商包装代码BCG324
Reach Compliance Codecompliant
ECCN代码EAR99
地址总线宽度
总线兼容性PCI; SMBUS
最大时钟频率125 MHz
最大数据传输速率12000 MBps
外部数据总线宽度
JESD-30 代码S-PBGA-B324
JESD-609代码e1
长度19 mm
湿度敏感等级3
端子数量324
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)260
座面最大高度1.72 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度19 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

文档预览

下载PDF文档
10-Lane 4-Port
Gen2 PCI Express® Switch
®
89HPES10T4G2
Data Sheet
Device Overview
The 89HPES10T4G2 is a member of IDT’s PRECISE™ family of PCI
Express® switching solutions. The PES10T4G2 is a 10-lane, 4-port
Gen2 peripheral chip that performs PCI Express Base switching with a
feature set optimized for high performance applications such as servers,
storage, and communications/networking. It provides connectivity and
switching functions between a PCI Express upstream port and two
downstream ports and supports switching between downstream ports.
High Performance PCI Express Switch
— Ten 5 Gbps Gen2 PCI Express lanes
— Four switch ports
– One x4 upstream port
– Three x2 downstream ports
— Low latency cut-through switch architecture
— Support for Max Payload Size up to 2048 bytes
— One virtual channel
— Eight traffic classes
— PCI Express Base Specification Revision 2.0 compliant
Flexible Architecture with Numerous Configuration Options
— Automatic per port link width negotiation to x4, x2 or x1
— Automatic lane reversal on all ports
— Automatic polarity inversion
— Ability to load device configuration from serial EEPROM
Features
Legacy Support
— PCI compatible INTx emulation
— Bus locking
Highly Integrated Solution
— Incorporates on-chip internal memory for packet buffering and
queueing
— Integrates ten 5 Gbps embedded SerDes with 8b/10b
encoder/decoder (no separate transceivers needed)
– Receive equalization (RxEQ)
Reliability, Availability, and Serviceability (RAS) Features
— Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
— Supports ECRC and Advanced Error Reporting
— Supports PCI Express Native Hot-Plug, Hot-Swap capable
I/O
— Compatible with Hot-Plug I/O expanders used on PC mother-
boards
— Supports Hot-Swap
Block Diagram
4-Port Switch Core / 10 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
(Port 4)
(Port 6)
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 30
2016 Integrated Device Technology, Inc.
May 10, 2016
DSC 6930

89HPES10T4G2ZBBCG相似产品对比

89HPES10T4G2ZBBCG 89HPES10T4G2ZABCG 89HPES10T4G2ZBBCG8
描述 PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 CABGA CABGA CABGA
包装说明 CABGA-324 CABGA-324 BGA,
针数 324 324 324
制造商包装代码 BCG324 BCG324 BCG324
Reach Compliance Code compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99
总线兼容性 PCI; SMBUS PCI; SMBUS SMBUS
最大数据传输速率 12000 MBps 12000 MBps 12000 MBps
JESD-30 代码 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324
JESD-609代码 e1 e1 e1
长度 19 mm 19 mm 19 mm
湿度敏感等级 3 3 3
端子数量 324 324 324
最高工作温度 70 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA
封装形状 SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 260 260 260
座面最大高度 1.72 mm 1.72 mm 1.72 mm
最大供电电压 1.1 V 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V 0.9 V
标称供电电压 1 V 1 V 1 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL BALL BALL
端子节距 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 19 mm 19 mm 19 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1 1
最大时钟频率 125 MHz 125 MHz -

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1848  1648  2094  1705  2380  38  34  43  35  48 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved