| 型号 |
24LC32AF-E/OT |
24LC32AF-E/P |
24LC32AF-E/SN |
24LC32AF-E/ST |
| 描述 |
4K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
4K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
4K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
4K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
| 功能数量 |
1 |
1 |
1 |
1 |
| 端子数量 |
8 |
8 |
8 |
8 |
| 表面贴装 |
Yes |
NO |
YES |
YES |
| 端子形式 |
GULL WING |
THROUGH-HOLE |
GULL WING |
GULL WING |
| 端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
| 温度等级 |
INDUSTRIAL |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
| 内存宽度 |
8 |
8 |
8 |
8 |
| 组织 |
4K X 8 |
4KX8 |
4KX8 |
4KX8 |
| 是否无铅 |
- |
不含铅 |
不含铅 |
不含铅 |
| 是否Rohs认证 |
- |
符合 |
符合 |
符合 |
| 零件包装代码 |
- |
DIP |
SOIC |
SOIC |
| 包装说明 |
- |
0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 |
3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 |
4.40 MM, PLASTIC, TSSOP-8 |
| 针数 |
- |
8 |
8 |
8 |
| Reach Compliance Code |
- |
compli |
compli |
compli |
| ECCN代码 |
- |
EAR99 |
EAR99 |
EAR99 |
| Factory Lead Time |
- |
20 weeks |
20 weeks |
7 weeks |
| 最大时钟频率 (fCLK) |
- |
0.4 MHz |
0.4 MHz |
0.4 MHz |
| 数据保留时间-最小值 |
- |
100 |
100 |
100 |
| 耐久性 |
- |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
| I2C控制字节 |
- |
1010DDDR |
1010DDDR |
1010DDDR |
| JESD-30 代码 |
- |
R-PDIP-T8 |
R-PDSO-G8 |
R-PDSO-G8 |
| JESD-609代码 |
- |
e3 |
e3 |
e3 |
| 长度 |
- |
9.271 mm |
4.9 mm |
4.4 mm |
| 内存密度 |
- |
32768 bi |
32768 bi |
32768 bi |
| 内存集成电路类型 |
- |
EEPROM |
EEPROM |
EEPROM |
| 字数 |
- |
4096 words |
4096 words |
4096 words |
| 字数代码 |
- |
4000 |
4000 |
4000 |
| 工作模式 |
- |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
| 最高工作温度 |
- |
125 °C |
125 °C |
125 °C |
| 最低工作温度 |
- |
-40 °C |
-40 °C |
-40 °C |
| 封装主体材料 |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| 封装代码 |
- |
DIP |
SOP |
TSSOP |
| 封装等效代码 |
- |
DIP8,.3 |
SOP8,.25 |
TSSOP8,.19 |
| 封装形状 |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| 封装形式 |
- |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 |
- |
SERIAL |
SERIAL |
SERIAL |
| 峰值回流温度(摄氏度) |
- |
NOT APPLICABLE |
260 |
260 |
| 电源 |
- |
3/5 V |
3/5 V |
3/5 V |
| 认证状态 |
- |
Not Qualified |
Not Qualified |
Not Qualified |
| 座面最大高度 |
- |
5.334 mm |
1.75 mm |
1.2 mm |
| 串行总线类型 |
- |
I2C |
I2C |
I2C |
| 最大待机电流 |
- |
0.000005 A |
0.000005 A |
0.000005 A |
| 最大压摆率 |
- |
0.003 mA |
0.003 mA |
0.003 mA |
| 最大供电电压 (Vsup) |
- |
5.5 V |
5.5 V |
5.5 V |
| 最小供电电压 (Vsup) |
- |
2.5 V |
2.5 V |
2.5 V |
| 标称供电电压 (Vsup) |
- |
5 V |
5 V |
5 V |
| 技术 |
- |
CMOS |
CMOS |
CMOS |
| 端子面层 |
- |
Matte Tin (Sn) - annealed |
Matte Tin (Sn) - annealed |
Matte Tin (Sn) - annealed |
| 端子节距 |
- |
2.54 mm |
1.27 mm |
0.65 mm |
| 处于峰值回流温度下的最长时间 |
- |
NOT APPLICABLE |
40 |
40 |
| 宽度 |
- |
7.62 mm |
3.9 mm |
3 mm |
| 最长写入周期时间 (tWC) |
- |
5 ms |
5 ms |
5 ms |
| 写保护 |
- |
HARDWARE |
HARDWARE |
HARDWARE |
| Base Number Matches |
- |
1 |
1 |
1 |