| 型号 |
24AA08H-I/ST |
24AA08H-I/MNY |
24AA08H-I/MS |
24AA08H-I/OT |
24AA08H-I/P |
24AA08H-I/S16K |
24AA08H-I/SN |
24AA08H-I/W16K |
24AA08H-I/WF16K |
| 描述 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
IC EEPROM 8K I2C 400KHZ WAFER |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
IC EEPROM 8K I2C 400KHZ WAFER |
IC EEPROM 8K I2C 400KHZ WAFER |
| 是否无铅 |
不含铅 |
不含铅 |
不含铅 |
- |
不含铅 |
- |
不含铅 |
- |
- |
| 是否Rohs认证 |
符合 |
符合 |
符合 |
- |
符合 |
- |
符合 |
- |
- |
| 零件包装代码 |
SOIC |
DFN |
MSOP |
- |
DIP |
- |
SOIC |
- |
- |
| 包装说明 |
4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 |
2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 |
ROHS COMPLIANT, PLASTIC, MSOP-8 |
- |
0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 |
DIE, |
3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 |
DIE, |
- |
| 针数 |
8 |
8 |
8 |
- |
8 |
- |
8 |
- |
- |
| Reach Compliance Code |
compli |
compli |
compli |
- |
compli |
unknown |
compli |
unknown |
- |
| ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
- |
EAR99 |
- |
EAR99 |
- |
- |
| 最大时钟频率 (fCLK) |
0.1 MHz |
0.1 MHz |
0.1 MHz |
- |
0.1 MHz |
0.4 MHz |
0.1 MHz |
0.4 MHz |
- |
| 数据保留时间-最小值 |
200 |
200 |
200 |
- |
200 |
- |
200 |
- |
- |
| 耐久性 |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
- |
1000000 Write/Erase Cycles |
- |
1000000 Write/Erase Cycles |
- |
- |
| I2C控制字节 |
1010XMMR |
1010XMMR |
1010XMMR |
- |
1010XMMR |
- |
1010XMMR |
- |
- |
| JESD-30 代码 |
R-PDSO-G8 |
R-PDSO-N8 |
S-PDSO-G8 |
- |
R-PDIP-T8 |
R-XUUC-N |
R-PDSO-G8 |
R-XUUC-N |
- |
| JESD-609代码 |
e3 |
e4 |
e3 |
- |
e3 |
- |
e3 |
- |
- |
| 长度 |
4.4 mm |
3 mm |
3 mm |
- |
9.27 mm |
- |
4.9 mm |
- |
- |
| 内存密度 |
2048 bi |
2048 bi |
2048 bi |
- |
2048 bi |
8192 bit |
2048 bi |
8192 bit |
- |
| 内存集成电路类型 |
EEPROM |
EEPROM |
EEPROM |
- |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
- |
| 内存宽度 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
- |
| 功能数量 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
- |
| 端子数量 |
8 |
8 |
8 |
8 |
8 |
- |
8 |
- |
- |
| 字数 |
256 words |
256 words |
256 words |
- |
256 words |
1024 words |
256 words |
1024 words |
- |
| 字数代码 |
256 |
256 |
256 |
- |
256 |
1000 |
256 |
1000 |
- |
| 工作模式 |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
- |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
- |
| 最高工作温度 |
85 °C |
85 °C |
85 °C |
- |
85 °C |
85 °C |
85 °C |
85 °C |
- |
| 最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
- |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
- |
| 组织 |
256X8 |
256X8 |
256X8 |
256 × 8 |
256X8 |
1KX8 |
256X8 |
1KX8 |
- |
| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
UNSPECIFIED |
PLASTIC/EPOXY |
UNSPECIFIED |
- |
| 封装代码 |
TSSOP |
HVSON |
TSSOP |
- |
DIP |
DIE |
SOP |
DIE |
- |
| 封装等效代码 |
TSSOP8,.25 |
SOLCC8,.11,20 |
TSSOP8,.19 |
- |
DIP8,.3 |
- |
SOP8,.25 |
- |
- |
| 封装形状 |
RECTANGULAR |
RECTANGULAR |
SQUARE |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
| 封装形式 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
- |
IN-LINE |
UNCASED CHIP |
SMALL OUTLINE |
UNCASED CHIP |
- |
| 并行/串行 |
SERIAL |
SERIAL |
SERIAL |
- |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
- |
| 峰值回流温度(摄氏度) |
260 |
260 |
260 |
- |
NOT APPLICABLE |
- |
260 |
- |
- |
| 电源 |
2/5 V |
2/5 V |
2/5 V |
- |
2/5 V |
- |
2/5 V |
- |
- |
| 认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
- |
Not Qualified |
- |
- |
| 座面最大高度 |
1.2 mm |
0.8 mm |
1.1 mm |
- |
5.334 mm |
- |
1.75 mm |
- |
- |
| 串行总线类型 |
I2C |
I2C |
I2C |
- |
I2C |
I2C |
I2C |
I2C |
- |
| 最大待机电流 |
0.000001 A |
0.000001 A |
0.000001 A |
- |
0.000001 A |
- |
0.000001 A |
- |
- |
| 最大压摆率 |
0.003 mA |
0.003 mA |
0.003 mA |
- |
0.003 mA |
- |
0.003 mA |
- |
- |
| 最大供电电压 (Vsup) |
5.5 V |
5.5 V |
5.5 V |
- |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
- |
| 最小供电电压 (Vsup) |
1.7 V |
1.7 V |
1.7 V |
- |
1.7 V |
1.7 V |
1.7 V |
1.7 V |
- |
| 标称供电电压 (Vsup) |
2.5 V |
2.5 V |
2.5 V |
- |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
- |
| 表面贴装 |
YES |
YES |
YES |
Yes |
NO |
YES |
YES |
YES |
- |
| 技术 |
CMOS |
CMOS |
CMOS |
- |
CMOS |
CMOS |
CMOS |
CMOS |
EEPROM |
| 温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
- |
| 端子面层 |
Matte Tin (Sn) - annealed |
NICKEL PALLADIUM GOLD |
Matte Tin (Sn) - annealed |
- |
Matte Tin (Sn) - annealed |
- |
Matte Tin (Sn) - annealed |
- |
- |
| 端子形式 |
GULL WING |
NO LEAD |
GULL WING |
NO 铅 |
THROUGH-HOLE |
NO LEAD |
GULL WING |
NO LEAD |
- |
| 端子节距 |
0.65 mm |
0.5 mm |
0.65 mm |
- |
2.54 mm |
- |
1.27 mm |
- |
- |
| 端子位置 |
DUAL |
DUAL |
DUAL |
双 |
DUAL |
UPPER |
DUAL |
UPPER |
- |
| 处于峰值回流温度下的最长时间 |
40 |
40 |
40 |
- |
NOT APPLICABLE |
- |
40 |
- |
- |
| 宽度 |
3 mm |
2 mm |
3 mm |
- |
7.62 mm |
- |
3.9 mm |
- |
- |
| 最长写入周期时间 (tWC) |
5 ms |
5 ms |
5 ms |
- |
5 ms |
5 ms |
5 ms |
5 ms |
- |
| 写保护 |
HARDWARE |
HARDWARE |
HARDWARE |
- |
HARDWARE |
- |
HARDWARE |
- |
- |
| Base Number Matches |
1 |
1 |
1 |
- |
1 |
- |
1 |
- |
- |