Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
DD
= 19V, V
GND
= 0V, V
CM
= V
OUT
= V
DD
/2, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
Supply Voltage Range
Quiescent Current
High Output Voltage
Low Output Voltage
Input Offset Voltage
Load Regulation
Input Bias Current
Voltage Gain
Power-Supply Rejection Ratio
Common-Mode Input Voltage
Range
Common-Mode Rejection Ratio
Continuous Output Current
Transient Peak Output Current
Bandwidth
Slew Rate
Settling Time
SYMBOL
V
DD
I
DD
V
OH
V
OL
V
OS
LR
I
FB
A
V
PSRR
CMVR
CMRR
I
O
I
PK
BW
SR
t
S
Per channel
I
H
= +5mA, V
IN
= V
DD
I
L
= -5mA, V
IN
= 0V
T
A
= +25°C
T
A
= -40°C to +125°C
I
OUT
= 0mA to -80mA
I
OUT
= 0mA to +80mA
At V
IN
= 9.5V
R
L
= 10kΩ, C
L
= 50pF
V
DD
= 6V to 20V, V
CM
= V
OUT
= 3V
Inferred from CMRR test
0.5V
≤
V
CM
≤
V
DD
- 0.5V
V
OUT
= 9.5V
(Note 2)
V
DD
= 15V, V
OUT
= 7.5V
(Note 3)
-3dB
4V step, C
L
= 50pF, R
L
= 10kΩ, A
V
= +1V/V
Settling to 0.1% of V
OUT
, I
L
= 0 to 1000mA,
R
S
= 2.2Ω, C
S
= 0.1µF (Figure 1)
MAX9650AZK+
MAX9650AUA+
MAX9650ATA+
0.99
70
0.5
60
20
80
±350
±1.3
35
40
2.0
A
MHz
V/µs
µs
mA
80
95
V
DD
-
0.5
-14
-17
+0.2
-0.2
0.01
1
1.01
V
DD
-
0.30
CONDITIONS
Guaranteed by PSRR
MIN
6
3.7
V
DD
-
0.05
0.05
3.5
0.30
+14
+17
TYP
MAX
20
8
UNITS
V
mA
V
V
mV
mV/mA
µA
V/V
dB
V
dB
2
Maxim Integrated
MAX9650/MAX9651
High-Current VCOM Drive Op Amps
for TFT LCDs
ELECTRICAL CHARACTERISTICS (continued)
(V
DD
= 19V, V
GND
= 0V, V
CM
= V
OUT
= V
DD
/2, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
Maximum Load Capacitance
Noninverting Input Resistance
Inverting Input Resistance
Input Capacitance
Thermal Shutdown
Thermal Shutdown Hysteresis
SYMBOL
C
LOAD
R
IN+
R
IN-
C
IN
(Note 4)
(Note 5)
(Note 5)
CONDITIONS
MIN
TYP
150
100
100
3
+170
15
MAX
UNITS
nF
MΩ
MΩ
pF
°C
°C
Note 1:
Note 2:
Note 3:
Note 4:
All devices are 100% production tested at T
A
= +25°C. All temperature limits are guaranteed by design.
Continuous output current is tested with one output at a time.
See the
Thermal Shutdown with Temperature Hysteresis
section.
A series resistor can extend load capacitance range. The settling time can be optimized by a small series resistance. See
the
Applications Information
section for more information.
Note 5:
Inputs are protected by back-to-back diodes.
Typical Operating Characteristics
(V
DD
= 19V, GND = 0, V
CM
= V
OUT
= V
DD
/2, T
A
= +25°C, unless otherwise specified.)
INPUT OFFSET VOLTAGE DEVIATION
vs. SUPPLY VOLTAGE
MAX9650 toc01
INPUT OFFSET VOLTAGE DEVIATION
vs. TEMPERATURE
7
INPUT OFFSET VOLTAGE (mV)
6
5
4
3
2
1
0
V
OUT
(125mV/div)
MAX9650 toc02
LOAD TRANSIENT
SOURCING
MAX9650 toc05
4
3
INPUT OFFSET VOLTAGE (mV)
2
1
0
T
A
= +25°C
-1
-2
-3
-4
6
9
12
15
18
T
A
= -40°C
T
A
= +125°C
8
I
OUT
(500mA/div)
0.1A RESPONSE
0.5A RESPONSE
1A RESPONSE
21
-50
-25
0
25
50
75
100
125
TIME (1μs/div)
SUPPLY VOLTAGE (V)
TEMPERATURE (°C)
Maxim Integrated
3
MAX9650/MAX9651
High-Current VCOM Drive Op Amps
for TFT LCDs
Typical Operating Characteristics (continued)
(V
DD
= 19V, GND = 0, V
CM
= V
OUT
= V
DD
/2, T
A
= +25°C, unless otherwise specified.)
SUPPLY CURRENT
vs. TEMPERATURE
7
SUPPLY CURRENT (mA)
6
5
4
3
2
1
0
-50
-25
0
25
50
75
100
125
TIME (1μs/div)
TIME (1μs/div)
TEMPERATURE (°C)
V
OUT
(125mV/div)
0.5A RESPONSE
1A RESPONSE
V
OUT
(125mV/div)
0.5A RESPONSE
0.1A RESPONSE
1A RESPONSE
MAX9650 toc04
LOAD TRANSIENT
SOURCING
MAX9650 toc05
LOAD TRANSIENT
SINKING
MAX9650 toc06
8
I
OUT
(500mA/div)
I
OUT
(500mA/div)
0.1A RESPONSE
STARTUP WAVEFORM
MAX9650 toc07
MAX9650 STEP RESPONSE
WITH VARIOUS C
L
I
DD
10mA/div
V
DD
10V/div
C
L
= 10pF
OPEN-LOOP GAIN AND PHASE
vs. FREQUENCY
120
V
OUT
5V/div
V
OUT
5V/div
100
80
60
GAIN (dB)
40
20
0
-20
-40
PHASE
MAX9650 toc09
MAX9650 toc08
GAIN
360
300
240
180
120
60
0
-60
-120
-180
-240
PHASE (DEG)
C
L
= 100pF
C
L
= 2200pF
V
IN
5V/div
V
OUT
5V/div
100ms/div
C
L
= 0.01μF
V
OUT
5V/div
V
OUT
5V/div
2μs/div
CL = 0.022μF
-60
-80
10E+0
1E+3
100E+3
10E+6
100E+0
1E+6
10E+3
FREQUENCY (Hz)
100E+6
CLOSED-LOOP SMALL-SIGNAL FREQUENCY
RESPONSE FOR VARIOUS C
L
MAX9650 toc10
SMALL-SIGNAL GAIN
vs. FREQUENCY
MAX9650 toc11
SMALL-SIGNAL GAIN vs. FREQUENCY
WITH VARIOUS C
L
15
10
5
GAIN (dB)
0
-5
-10
-15
-20
10pF
V
OUT
= 100mV
P-P
R
L
= 10kΩ TO V
DD
/2
10,000pF
MAX9650 toc12
20
15
C
L
= 0.01μF
VOLTAGE GAIN (dB)
10
C
L
= 0.1μF
5
0
-5
-10
-15
0.01
0.1
1
FREQUENCY (MHz)
10
C
L
= 100pF
C
L
= 56pF
C
L
= 0.001μF
C
L
= 560pF
C
L
= 10pF
C
L
= 0.0022μF
3
2
1
0
GAIN (dB)
-1
-2
-3
-4
-5
-6
V
OUT
= 100mV
P-P
R
L
= 10kΩ TO V
DD
/2
20
1000pF
100pF
100
-7
100E+3
1E+6
10E+6
100E+6
-25
100E+3
1E+6
10E+6
100E+6
FREQUENCY (Hz)
FREQUENCY (Hz)
4
Maxim Integrated
MAX9650/MAX9651
High-Current VCOM Drive Op Amps
for TFT LCDs
Pin Description
PIN
MAX9650
SOT23
1
2
3
4
5
—
—
—
—
—
MAX9651
(µMAX-EP,
µMAX-EP,
TDFN-EP TDFN-EP)
6
4
3
2
7
—
—
—
1, 5, 8
—
1
4
3
2
8
5
6
7
—
—
NAME
FUNCTION
OUTA
GND
INA+
INA-
V
DD
INB+
INB-
OUTB
N.C.
EP
VCOM Output A
Ground
Positive Input A
Negative Input A
Positive-Supply Input. Bypass V
DD
to GND with a 0.1µF capacitor as close as
possible to the device.
Positive Input B
Negative Input B
VCOM Output B
No Connection. Not internally connected.
Exposed Pad (μMAX and TDFN Only). EP is internally connected to GND. Connect EP
to GND.
Detailed Description
The MAX9650/MAX9651 operational rail-to-rail
input/output amplifiers hold the VCOM voltage stable
while providing the ability to source and sink a high cur-
rent quickly (1.3A) into a capacitive load such as the
backplane of a TFT-LCD panel.
19V
SUPPLY
*C2 = 0.1μF
19V
SUPPLY
V
DD
MAX9650
LCD VCOM LOAD
V
REF
IN_+
OUT_ V
OUT_
IN_-
GND
R
S
=
2.2Ω
C
LCD
=
0.1μF
**0V TO 2.2V
AT 50kHz
*C1 = 10μF
Thermal Shutdown
with Temperature Hysteresis
The MAX9650/MAX9651 are capable of high output
currents and feature thermal-shutdown protection with
temperature hysteresis. When the die temperature
reaches +170°C, the device shuts down. When the die
cools down by 15°C, the device turns on again. In a
TFT-LCD application, the duty cycle is very low. Even
with high values of voltage and current, the power dissi-
pation is low and the chip does not shut down.
*10μF and 0.1μF CAPACITORS AS CLOSE AS POSSIBLE TO THE PIN.
SMT贴片机是表面贴装技术（Surface Mount Technology）中的重要设备，它的性能状态对电子制造的质量和效率有着决定性的影响。因此，对SMT贴片机的主要指标性能进行定期检测非常重要。以下是一些主要的检测项目： 定位精度：定位精度是SMT贴片机的核心性能指标，它直接影响到贴片的准确性。通常，我们通过重复测量贴片机在X、Y轴上的移动误差来检测其定位精度。 贴片速度：贴片速度...[详细]
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