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74LVT162244GX

产品描述Buffers u0026 Line Drivers Buffer/Line Driver LV 16Bit
产品类别逻辑    逻辑   
文件大小93KB,共8页
制造商Fairchild
官网地址http://www.fairchildsemi.com/
下载文档 详细参数 选型对比 全文预览

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74LVT162244GX概述

Buffers u0026 Line Drivers Buffer/Line Driver LV 16Bit

74LVT162244GX规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Fairchild
零件包装代码BGA
包装说明LFBGA, BGA54,6X9,32
针数54
Reach Compliance Codecompliant
控制类型ENABLE LOW
系列LVT
JESD-30 代码R-PBGA-B54
JESD-609代码e0
长度8 mm
逻辑集成电路类型BUS DRIVER
最大I(ol)0.012 A
湿度敏感等级3
位数4
功能数量4
端口数量2
端子数量54
最高工作温度85 °C
最低工作温度-40 °C
输出特性3-STATE WITH SERIES RESISTOR
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码LFBGA
封装等效代码BGA54,6X9,32
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE, FINE PITCH
包装方法TAPE AND REEL
峰值回流温度(摄氏度)260
电源3.3 V
Prop。Delay @ Nom-Sup4 ns
传播延迟(tpd)4.8 ns
认证状态Not Qualified
座面最大高度1.4 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术BICMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度5.5 mm
Base Number Matches1

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74LVT162244 • 74LVTH162244 Low Voltage 16-Bit Buffer/Line Driver with 3-STATE Outputs and 25: Series
Resistors in the Outputs
March 1999
Revised June 2005
74LVT162244 • 74LVTH162244
Low Voltage 16-Bit Buffer/Line Driver
with 3-STATE Outputs
and 25: Series Resistors in the Outputs
General Description
The LVT162244 and LVTH162244 contain sixteen non-
inverting buffers with 3-STATE outputs designed to be
employed as a memory and address driver, clock driver, or
bus oriented transmitter/receiver. The device is nibble con-
trolled. Individual 3-STATE control inputs can be shorted
together for 8-bit or 16-bit operation.
The LVT162244 and LVTH162244 are designed with
equivalent 25
:
series resistance in both the HIGH and
LOW states of the output. This design reduces line noise in
applications such as memory address drivers, clock driv-
ers, and bus transceivers/transmitters.
The LVTH162244 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These buffers and line drivers are designed for low-voltage
(3.3V) V
CC
applications, but with the capability to provide a
TTL interface to a 5V environment. The LVT162244 and
LVTH162244 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining a low power dissipation.
Features
s
Input and output interface capability to systems at
5V V
CC
s
Bushold data inputs eliminate the need for external pull-
up resistors to hold unused inputs (74LVTH162244),
also available without bushold feature (74LVT162244).
s
Live insertion/extraction permitted
s
Power Up/Power Down high impedance provides glitch-
free bus loading
s
Outputs include equivalent series resistance of 25
:
to
make external termination resistors unnecessary and
reduce overshoot and undershoot
s
Functionally compatible with the 74 series 162244
s
Latch-up performance exceeds 500 mA
s
ESD performance:
Human-body model
!
2000V
Machine model
!
200V
Charged-device
!
1000V
s
Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Ordering Code:
Order Number
74LVT162244G
(Note 1)(Note 2)
74LVT162244MEA
(Note 2)
74LVT162244MTD
(Note 2)
74LVTH162244G
(Note 1)(Note 2)
74LVTH162244MEA
74LVTH162244MEX
74LVTH162244MTD
74LVTH162244MTX
Package
Number
BGA54A
MS48A
MTD48
BGA54A
MS48A
MS48A
MTD48
MTD48
Package Description
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[Tube]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[Tape and Reel]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[Tube]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[Tape and Reel]
Note 1:
Ordering code “G” indicates Trays.
Note 2:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
© 2005 Fairchild Semiconductor Corporation
DS012445
www.fairchildsemi.com

74LVT162244GX相似产品对比

74LVT162244GX 74LVTH162244G
描述 Buffers u0026 Line Drivers Buffer/Line Driver LV 16Bit Buffers u0026 Line Drivers Buffer/Line Driver LV 16Bit
是否Rohs认证 不符合 不符合
厂商名称 Fairchild Fairchild
零件包装代码 BGA BGA
包装说明 LFBGA, BGA54,6X9,32 LFBGA, BGA54,6X9,32
针数 54 54
Reach Compliance Code compliant compliant
控制类型 ENABLE LOW ENABLE LOW
系列 LVT LVT
JESD-30 代码 R-PBGA-B54 R-PBGA-B54
JESD-609代码 e0 e0
长度 8 mm 8 mm
逻辑集成电路类型 BUS DRIVER BUS DRIVER
最大I(ol) 0.012 A 0.012 A
湿度敏感等级 3 3
位数 4 4
功能数量 4 4
端口数量 2 2
端子数量 54 54
最高工作温度 85 °C 85 °C
最低工作温度 -40 °C -40 °C
输出特性 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR
输出极性 TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFBGA LFBGA
封装等效代码 BGA54,6X9,32 BGA54,6X9,32
封装形状 RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度) 260 260
电源 3.3 V 3.3 V
Prop。Delay @ Nom-Sup 4 ns 4 ns
传播延迟(tpd) 4.8 ns 4.8 ns
认证状态 Not Qualified Not Qualified
座面最大高度 1.4 mm 1.4 mm
最大供电电压 (Vsup) 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V
标称供电电压 (Vsup) 3.3 V 3.3 V
表面贴装 YES YES
技术 BICMOS BICMOS
温度等级 INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 BALL BALL
端子节距 0.8 mm 0.8 mm
端子位置 BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
宽度 5.5 mm 5.5 mm
Base Number Matches 1 1

 
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