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MAX3013EGP-T

产品描述Translation - Voltage Levels
产品类别模拟混合信号IC    驱动程序和接口   
文件大小431KB,共17页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
下载文档 详细参数 选型对比 全文预览

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MAX3013EGP-T概述

Translation - Voltage Levels

MAX3013EGP-T规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Maxim(美信半导体)
零件包装代码QFN
包装说明5 X 5 MM, 0.90 MM HEIGHT, MO-220, QFN-20
针数20
Reach Compliance Codenot_compliant
接口集成电路类型INTERFACE CIRCUIT
JESD-30 代码S-XQCC-N20
JESD-609代码e0
长度5 mm
湿度敏感等级1
功能数量8
端子数量20
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料UNSPECIFIED
封装代码HVQCCN
封装等效代码LCC20,.20SQ,25
封装形状SQUARE
封装形式CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度)245
电源1.8/3.3 V
认证状态Not Qualified
座面最大高度1 mm
最大供电电压3.6 V
最小供电电压1.65 V
标称供电电压3.3 V
表面贴装YES
技术BICMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式NO LEAD
端子节距0.65 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度5 mm

文档预览

下载PDF文档
19-3156; Rev 2; 12/04
+1.2V to +3.6V, 0.1µA, 100Mbps,
8-Channel Level Translators
General Description
The MAX3013 8-channel level translator provides the
level shifting necessary to allow 100Mbps data transfer
in a multivoltage system. Externally applied voltages,
V
CC
and V
L
, set the logic levels on either side of the
device. Logic signals present on the V
L
side of the
device appear as a higher voltage logic signal on the
V
CC
side of the device, and vice-versa.
The MAX3013 features an EN input that, when at logic
low, places all inputs/outputs on both sides in tristate
and reduces the V
CC
and V
L
supply currents to 0.1µA.
This device operates at a guaranteed data rate of
100Mbps for V
L
> 1.8V.
The MAX3013 accepts a V
CC
voltage from +1.65V to
+3.6V and a V
L
voltage from +1.2V to (V
CC
- 0.4V), mak-
ing it ideal for data transfer between low-voltage
ASICs/PLDs and higher voltage systems. The MAX3013
is available in 5 x 4 UCSP™, 20-pin 5mm x 5mm QFN,
and 20-pin TSSOP packages.
100Mbps Guaranteed Data Rate
Bidirectional Level Translation
V
L
Operation Down to +1.2V
Ultra-Low 0.1µA Supply Current in Shutdown
Low-Quiescent Current (0.1µA)
UCSP, QFN, and TSSOP Packages
Features
MAX3013
Pin Configurations
TOP VIEW
I/O V
L
1 1
I/O V
L
2 2
I/O V
L
3 3
I/O V
L
4 4
V
L
5
EN 6
I/O V
L
5 7
I/O V
L
6 8
I/O V
L
7 9
I/O V
L
8 10
20 I/O V
CC
1
19 I/O V
CC
2
18 I/O V
CC
3
17 I/O V
CC
4
16 V
CC
Applications
Low-Voltage ASIC Level Translation
Cell Phones
SPI™, MICROWIRE™ Level Translation
Portable POS Systems
Portable Communication Devices
GPS
Telecommunications Equipment
MAX3013
15 GND
14 I/O V
CC
5
13 I/O V
CC
6
12 I/O V
CC
7
11 I/O V
CC
8
TSSOP
Pin Configurations continued at end of data sheet.
UCSP is a trademark of Maxim Integrated Products, Inc.
SPI is a trademark of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor Corp.
Typical Operating Circuit appears at end of data sheet.
Ordering Information
PART
MAX3013EUP
MAX3013EBP-T
MAX3013EGP
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
20 TSSOP
5 x 4 UCSP
20 QFN-EP*
NUMBER OF
V
L
V
CC
TRANSLATORS
8
8
8
NUMBER OF
V
L
V
CC
TRANSLATORS
8
8
8
DATA RATE
(Mbps)
100
100
100
*EP
= Exposed paddle.
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

MAX3013EGP-T相似产品对比

MAX3013EGP-T MAX3013EUP-T MAX3013EUP MAX13004EEUE MAX13005EEUE MAX3013EBP-T MAX3013EGP MAX3013EUP+
描述 Translation - Voltage Levels Translation - Voltage Levels +1.2V to +3.6V, 0.1microAmp, 100Mbps, 8-Channel Level Translator Translation - Voltage Levels +1.2V to +3.6V, 0.1A, 100Mbps, 8-Channel Level Translators Translation - Voltage Levels Ultra-Low-Voltage Level Translators Translation - Voltage Levels Ultra-Low-Voltage Level Translators Translation - Voltage Levels +1.2V to +3.6V, 0.1microAmp, 100Mbps, 8-Channel Level Translator Translation - Voltage Levels IC TRNSLTR BIDIRECTIONAL 20TSSOP
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 符合
零件包装代码 QFN TSSOP TSSOP TSSOP TSSOP BGA QFN TSSOP
包装说明 5 X 5 MM, 0.90 MM HEIGHT, MO-220, QFN-20 4.40 MM, MO-153AC, TSSOP-20 4.40 MM, MO-153AC, TSSOP-20 4.40 MM, MO-153AB, TSSOP-16 4.40 MM, MO-153AB, TSSOP-16 5 X 4 MM, UCSP-20 5 X 5 MM, 0.90 MM HEIGHT, MO-220, QFN-20 TSSOP, TSSOP20,.25
针数 20 20 20 16 16 20 20 20
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant compliant
接口集成电路类型 INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 代码 S-XQCC-N20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G16 R-PDSO-G16 R-PBGA-B20 S-XQCC-N20 R-PDSO-G20
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e3
长度 5 mm 6.5 mm 6.5 mm 5 mm 5 mm 2.54 mm 5 mm 6.5 mm
功能数量 8 8 8 6 6 8 8 8
端子数量 20 20 20 16 16 20 20 20
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY
封装代码 HVQCCN TSSOP TSSOP TSSOP TSSOP VFBGA HVQCCN TSSOP
封装等效代码 LCC20,.20SQ,25 TSSOP20,.25 TSSOP20,.25 TSSOP16,.25 TSSOP16,.25 BGA20,4X5,20 LCC20,.20SQ,25 TSSOP20,.25
封装形状 SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
封装形式 CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 245 245 240 NOT SPECIFIED 240 240 240 260
电源 1.8/3.3 V 1.8/3.3 V 1.8/3.3 V 1.8/3.3 V 1.8/3.3 V 1.8/3.3 V 1.8/3.3 V 1.8/3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1 mm 1.1 mm 1.1 mm 1.1 mm 1.1 mm 0.67 mm 1 mm 1.1 mm
最大供电电压 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 1.65 V 1.65 V 1.65 V 1.5 V 1.5 V 1.65 V 1.65 V 1.65 V
标称供电电压 3.3 V 3.3 V 3.3 V 1.65 V 1.65 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES
技术 BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn63Pb37) Tin/Lead (Sn85Pb15) Matte Tin (Sn)
端子形式 NO LEAD GULL WING GULL WING GULL WING GULL WING BALL NO LEAD GULL WING
端子节距 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.5 mm 0.65 mm 0.65 mm
端子位置 QUAD DUAL DUAL DUAL DUAL BOTTOM QUAD DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED 20 NOT SPECIFIED 30 20 20 30
宽度 5 mm 4.4 mm 4.4 mm 4.4 mm 4.4 mm 2.03 mm 5 mm 4.4 mm
厂商名称 Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) - Maxim(美信半导体) Maxim(美信半导体)
湿度敏感等级 1 1 1 - 1 1 1 1
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