Important notice
Dear Customer,
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BCP53; BCX53; BC53PA
80 V, 1 A PNP medium power transistors
Rev. 9 — 19 October 2011
Product data sheet
1. Product profile
1.1 General description
PNP medium power transistor series in Surface-Mounted Device (SMD) plastic packages.
Table 1.
Product overview
Package
NXP
BCP53
BCX53
BC53PA
[1]
Type number
[1]
NPN complement
JEITA
SC-73
SC-62
-
JEDEC
-
TO-243
-
BCP56
BCX56
BC56PA
SOT223
SOT89
SOT1061
Valid for all available selection groups.
1.2 Features and benefits
High current
Three current gain selections
High power dissipation capability
Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)
Leadless very small SMD plastic package with medium power capability (SOT1061)
AEC-Q101 qualified
1.3 Applications
Linear voltage regulators
High-side switches
Battery-driven devices
Power management
MOSFET drivers
Amplifiers
1.4 Quick reference data
Table 2.
Symbol
V
CEO
I
C
I
CM
Quick reference data
Parameter
collector-emitter voltage
collector current
peak collector current
single pulse; t
p
1 ms
Conditions
open base
Min
-
-
-
Typ
-
-
-
Max
80
1
2
Unit
V
A
A
NXP Semiconductors
BCP53; BCX53; BC53PA
80 V, 1 A PNP medium power transistors
Quick reference data
…continued
Parameter
DC current gain
h
FE
selection -10
h
FE
selection -16
Conditions
V
CE
=
2
V;
I
C
=
150
mA
V
CE
=
2
V;
I
C
=
150
mA
V
CE
=
2
V;
I
C
=
150
mA
Min
63
63
100
Typ
-
-
-
Max
250
160
250
Unit
Table 2.
Symbol
h
FE
2. Pinning information
Table 3.
Pin
SOT223
1
2
3
4
base
collector
emitter
collector
1
2
3
3
sym028
Pinning
Description
Simplified outline
Graphic symbol
4
1
2, 4
SOT89
1
2
3
emitter
collector
base
3
2
1
3
1
006aaa231
2
SOT1061
1
2
3
base
emitter
collector
3
1
2
1
2
sym013
3
Transparent top view
BCP53_BCX53_BC53PA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 9 — 19 October 2011
2 of 22
NXP Semiconductors
BCP53; BCX53; BC53PA
80 V, 1 A PNP medium power transistors
3. Ordering information
Table 4.
Ordering information
Package
Name
BCP53
BCX53
BC53PA
[1]
Type number
[1]
Description
plastic surface-mounted package with increased
heatsink; 4 leads
plastic surface-mounted package; exposed die pad for
good heat transfer; 3 leads
Version
SOT223
SOT89
SOT1061
SC-73
SC-62
HUSON3 plastic thermal enhanced ultra thin small outline
package; no leads; 3 terminals; body 2
2
0.65 mm
Valid for all available selection groups.
4. Marking
Table 5.
BCP53
BCP53-10
BCP53-16
BCX53
BCX53-10
BCX53-16
BC53PA
BC53-10PA
BC53-16PA
Marking codes
Marking code
BCP53
BCP53/10
BCP53/16
AH
AK
AL
BV
BW
BX
Type number
BCP53_BCX53_BC53PA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 9 — 19 October 2011
3 of 22
NXP Semiconductors
BCP53; BCX53; BC53PA
80 V, 1 A PNP medium power transistors
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
B
I
BM
P
tot
Parameter
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
peak collector current
base current
peak base current
total power dissipation
BCP53
single pulse;
t
p
1 ms
T
amb
25
C
[1]
[2]
[3]
Conditions
open emitter
open base
open collector
single pulse;
t
p
1 ms
Min
-
-
-
-
-
-
-
Max
100
80
5
1
2
0.3
0.3
Unit
V
V
V
A
A
A
A
-
-
-
-
-
-
-
-
-
-
-
-
55
65
0.65
1.00
1.35
0.50
0.95
1.35
0.42
0.83
1.10
0.81
1.65
150
+150
+150
W
W
W
W
W
W
W
W
W
W
W
C
C
C
BCX53
[1]
[2]
[3]
BC53PA
[1]
[2]
[3]
[4]
[5]
T
j
T
amb
T
stg
[1]
[2]
[3]
[4]
[5]
junction temperature
ambient temperature
storage temperature
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm
2
.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm
2
.
Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm
2
.
BCP53_BCX53_BC53PA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 9 — 19 October 2011
4 of 22
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