|
LFE3-150EA-8FN672CTW |
LFE3-150EA-8FN1156CTW |
BLU0603ER-2640-AT50Q |
LFE3-70EA-7FN672C |
LFE3-150EA-7FN672ITW |
LFE3-35EA-8FN484C |
描述 |
|
FPGA - Field Programmable Gate Array 149K LUTs 586 I/O 1.2V -8 Speed |
Fixed Resistor, Thin Film, 0.1W, 264ohm, 75V, 0.05% +/-Tol, 50ppm/Cel, 0603, |
FPGA - Field Programmable Gate Array 66.5K LUTs 380 I/O SERDES 1.2V -7 Speed |
FPGA - Field Programmable Gate Array 149K LUTs, 380 I/O, 1.2V, -7 Speed, Pb-Free, IND |
Circuit Board Hardware - PCB MINI SMT TEST POINT |
是否Rohs认证 |
符合 |
符合 |
不符合 |
符合 |
符合 |
符合 |
Reach Compliance Code |
unknown |
unknown |
compliant |
not_compliant |
unknown |
compliant |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
JESD-609代码 |
e1 |
e1 |
e0 |
e1 |
e1 |
e1 |
端子数量 |
672 |
1156 |
2 |
672 |
672 |
484 |
最高工作温度 |
85 °C |
85 °C |
155 °C |
85 °C |
100 °C |
85 °C |
封装形式 |
GRID ARRAY |
GRID ARRAY |
SMT |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
端子面层 |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Tin/Silver/Copper (Sn/Ag/Cu) |
厂商名称 |
Lattice(莱迪斯) |
Lattice(莱迪斯) |
- |
Lattice(莱迪斯) |
Lattice(莱迪斯) |
Lattice(莱迪斯) |
零件包装代码 |
BGA |
BGA |
- |
BGA |
BGA |
BGA |
包装说明 |
27 X 27 MM, LEAD FREE, FPBGA-672 |
35 X 35 MM, LEAD FREE, FPBGA-1156 |
- |
BGA, BGA672,26X26,40 |
27 X 27 MM, LEAD FREE, FPBGA-672 |
BGA, BGA484,22X22,40 |
针数 |
672 |
1156 |
- |
672 |
672 |
484 |
最大时钟频率 |
500 MHz |
500 MHz |
- |
420 MHz |
420 MHz |
500 MHz |
CLB-Max的组合延迟 |
0.281 ns |
0.281 ns |
- |
0.335 ns |
0.335 ns |
0.281 ns |
JESD-30 代码 |
S-PBGA-B672 |
S-PBGA-B1156 |
- |
S-PBGA-B672 |
S-PBGA-B672 |
S-PBGA-B484 |
长度 |
27 mm |
35 mm |
- |
27 mm |
27 mm |
23 mm |
湿度敏感等级 |
3 |
3 |
- |
3 |
3 |
3 |
输入次数 |
380 |
586 |
- |
380 |
380 |
295 |
逻辑单元数量 |
149000 |
149000 |
- |
67000 |
149000 |
33000 |
输出次数 |
380 |
586 |
- |
380 |
380 |
295 |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
BGA |
BGA |
- |
BGA |
BGA |
BGA |
封装等效代码 |
BGA672,26X26,40 |
BGA1156,34X34,40 |
- |
BGA672,26X26,40 |
BGA672,26X26,40 |
BGA484,22X22,40 |
封装形状 |
SQUARE |
SQUARE |
- |
SQUARE |
SQUARE |
SQUARE |
峰值回流温度(摄氏度) |
250 |
250 |
- |
250 |
250 |
250 |
电源 |
1.2 V |
1.2 V |
- |
1.2 V |
1.2 V |
1.2 V |
可编程逻辑类型 |
FIELD PROGRAMMABLE GATE ARRAY |
FIELD PROGRAMMABLE GATE ARRAY |
- |
FIELD PROGRAMMABLE GATE ARRAY |
FIELD PROGRAMMABLE GATE ARRAY |
FIELD PROGRAMMABLE GATE ARRAY |
认证状态 |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
2.6 mm |
2.6 mm |
- |
2.6 mm |
2.6 mm |
2.6 mm |
最大供电电压 |
1.26 V |
1.26 V |
- |
1.26 V |
1.26 V |
1.26 V |
最小供电电压 |
1.14 V |
1.14 V |
- |
1.14 V |
1.14 V |
1.14 V |
标称供电电压 |
1.2 V |
1.2 V |
- |
1.2 V |
1.2 V |
1.2 V |
表面贴装 |
YES |
YES |
- |
YES |
YES |
YES |
温度等级 |
OTHER |
OTHER |
- |
OTHER |
INDUSTRIAL |
OTHER |
端子形式 |
BALL |
BALL |
- |
BALL |
BALL |
BALL |
端子节距 |
1 mm |
1 mm |
- |
1 mm |
1 mm |
1 mm |
端子位置 |
BOTTOM |
BOTTOM |
- |
BOTTOM |
BOTTOM |
BOTTOM |
处于峰值回流温度下的最长时间 |
30 |
30 |
- |
30 |
30 |
30 |
宽度 |
27 mm |
35 mm |
- |
27 mm |
27 mm |
23 mm |