Datasheet> 器件分类 > 半导体> 嵌入式处理器和控制器> SIM3C156-B-GM

SIM3C156-B-GM: 产品描述ARM Microcontrollers - MCU 32-bit ARM Cortex-M3 128KB QFN64; 产品类别半导体嵌入式处理器和控制器; 文件大小2MB，共90页; 制造商Silicon Laboratories

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SIM3C156-B-GM概述

ARM Microcontrollers - MCU 32-bit ARM Cortex-M3 128KB QFN64

SIM3C156-B-GM规格参数

参数名称	属性值
产品种类 Product Category	ARM Microcontrollers - MCU
制造商 Manufacturer	Silicon Laboratories
RoHS	Details
安装风格 Mounting Style	SMD/SMT
封装 / 箱体 Package / Case	QFN-64
Core	ARM Cortex M3
Data Bus Width	32 bit
Maximum Clock Frequency	80 MHz
Program Memory Size	128 kB
Data RAM Size	32 kB
工作电源电压 Operating Supply Voltage	1.8 V to 3.6 V
最大工作温度 Maximum Operating Temperature	+ 85 C
Processor Series	SIM3C1xx
系列 Packaging	Tray
接口类型 Interface Type	2 x I2C, I2S, 3 x SPI, 2 x USART, 2 x UART
最小工作温度 Minimum Operating Temperature	- 40 C
Moisture Sensitive	Yes
Number of I/Os	73 I/O
Number of Timers/Counters	10 Timer
工厂包装数量 Factory Pack Quantity	260
单位重量 Unit Weight	0.007277 oz

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SiM3C1xx

High-Performance, Low-Power, 32-Bit Precision32™

MCU Family with up to 256 kB of Flash

32-bit ARM® Cortex™-M3 CPU

80 MHz maximum frequency

Single-cycle multiplication, hardware division support

Nested vectored interrupt control (NVIC) with 16 priority levels

Memory

32–256 kB Flash, in-system programmable

8–32 kB SRAM (including 4 kB retention SRAM)

16-channel DMA controller

External bus interface supports up to 16 MB of external mem-

ory and a parallel LCD interface with QVGA resolution

Analog Peripherals

2 x 12-Bit Analog-to-Digital Converters: Up to 250 ksps 12-bit

mode or 1 Msps 10-bit mode, internal or external reference

2 x 10-Bit Current-mode Digital-to-Analog Converters, four-

word buffer enables 12-bit operation

2 x Low-current comparators

16-Channel Capacitance-to-Digital: Fast, <1 µA wake-on-touch

2 x Current-to-Voltage Converter, up to 6 mA input range

Digital and Communication Peripherals

2 x USARTs and 2 x UARTs with IrDA and ISO7816 SmartCard

3 x SPIs, 2 x I2C, I

S (receive and transmit), 16/32-bit CRC

128/192/256-bit Hardware AES Encryption

Timers/Counters

2 x 32-bit or 4 x 16-bit timers with capture/compare

2 x 16-bit, 2-channel counters with capture/compare/PWM

16-bit, 6-channel counter with capture/compare/PWM and

32-bit real time clock (RTC) with multiple alarms

Watchdog timer

dead-time controller with differential outputs

16-bit low power timer/pulse counter operational in sleep

Power Management

Low drop-out (LDO) regulator

Power-on reset circuit and brownout detectors

5-to-3.3 V 150 mA regulator supports up to 5 V input supply

Adjustable external regulator supports up to 3.6 V, 1000 mA

Multiple power modes supported for low power optimization

Low Power Features

85 nA current mode with voltage supply monitor enabled

Low-current RTC: 350 nA internal LFO, 620 nA external crystal

12 µs wakeup (lowest power mode); 1.5 µs analog setting time

275 µA/MHz active current

Clocks can be gated off from unused peripherals to save power

Flexible clock divider: Reduce operational frequency up to 128x

Clock Sources

Internal oscillator with PLL: 23–80 MHz, reduced EMI mode

Low power internal oscillator: 20 MHz and 2.5 MHz modes

Low frequency internal oscillator: 16.4 kHz

External oscillators: Crystal, RC, C, CMOS and RTC Crystal

Temperature Range: –40 to +85 °C

Package Options

QFN options: 40-pin (6 x 6 mm), 64-pin (9 x 9 mm)

TQFP options: 64-pin (10 x 10 mm), 80-pin (12 x 12 mm)

LGA option: 92-pin (7 x 7 mm)

Up to 65 Flexible I/O

Up to 59 contiguous GPIO with two priority crossbars providing

flexibility in pin assignments; 12 x 5 V tolerant GPIO

Up to 6 programmable high drive capable (5–300 mA, 1.8–6 V)

I/O can drive LEDs, power MOSFETs, buzzers, etc.

On-Chip Debugging

Serial wire debug (SWD) or JTAG (no boundary scan), serial

wire viewer (SWV)

Cortex-M3 embedded trace macrocell (ETM)

Supply Voltage

2.7 to 5.5 V (regulator enabled)

1.8 to 3.6 V (regulator disabled)

Power

5 V In, 3.3 V Out LDO

1.8 V Internal LDO

(Internal Logic and Memory Power)

External 1A Regulator

Power Management Unit

Supply Monitor

Core / Memory / Support

ARM Cortex M3 (80 MHz)

32/64/128/256 kB Flash

8/16/32 kB SRAM w/ 4kB Retention

16-Channel DMA Controller

Watchdog

Serial Wire / JTAG / ETM

Analog Peripherals

2 x SAR ADC

(12-bit 250 ksps / 10-bit 1 Msps)

Voltage Reference

2 x Current-Source DAC

2 x Low Current Comparators

2 x Current-to-Voltage Converter

16-Channel Capacitive Sense

65 Multi-Function I/O Pins (12 x 5 V tol, 6 x High-Drive)

Flexible Pin Muxing

Two Priority Crossbar

Encoders

Clocking / Oscillators

80 MHz PLL

Real-Time Clock w/ Dedicated Crystal

16 kHz Low Frequency Oscillator

20 MHz Low Power Oscillator

External Oscillator Drive

Clock Selection

and Gating

I2S TX/RX

Digital Peripherals

2 x I2C

3 x SPI

AES

CRC

2 x 32-bit Timers (4 x 16-bit)

2 x UART, 2 x USART w/ IrDA/SmartCard

6-Channel Enhanced PWM

2 x 2-Channel Standard PWM

Low-Power Timer

External Parallel I/F

Rev.1.0 11/12

SiM3C1xx

SiM3C1xx

Ta ble of Contents

1. Related Documents and Conventions ...............................................................................4

1.1. Related Documents........................................................................................................4

1.1.1. SiM3U1xx/SiM3C1xx Reference Manual...............................................................4

1.1.2. Hardware Access Layer (HAL) API Description ....................................................4

1.1.3. ARM Cortex-M3 Reference Manual.......................................................................4

1.2. Conventions ...................................................................................................................4

2. Typical Connection Diagrams ............................................................................................5

2.1. Power .............................................................................................................................5

3. Electrical Specifications......................................................................................................6

3.1. Electrical Characteristics ................................................................................................6

3.2. Thermal Conditions ...................................................................................................... 29

3.3. Absolute Maximum Ratings..........................................................................................29

4. Precision32™ SiM3C1xx System Overview .................................................................... 32

4.1. Power ........................................................................................................................... 34

4.1.1. LDO and Voltage Regulator (VREG0) ................................................................. 34

4.1.2. Voltage Supply Monitor (VMON0) ....................................................................... 34

4.1.3. External Regulator (EXTVREG0) ........................................................................ 34

4.1.4. Power Management Unit (PMU).......................................................................... 34

4.1.5. Device Power Modes........................................................................................... 35

4.2. I/O................................................................................................................................. 36

4.2.1. General Features.................................................................................................36

4.2.2. High Drive Pins (PB4)..........................................................................................36

4.2.3. 5 V Tolerant Pins (PB3) ....................................................................................... 36

4.2.4. Crossbars ............................................................................................................ 36

4.3. Clocking........................................................................................................................ 37

4.3.1. PLL (PLL0)........................................................................................................... 38

4.3.2. Low Power Oscillator (LPOSC0) ......................................................................... 38

4.3.3. Low Frequency Oscillator (LFOSC0)................................................................... 38

4.3.4. External Oscillators (EXTOSC0).......................................................................... 38

4.4. Data Peripherals...........................................................................................................39

4.4.1. 16-Channel DMA Controller................................................................................. 39

4.4.2. 128/192/256-bit Hardware AES Encryption (AES0) ............................................ 39

4.4.3. 16/32-bit CRC (CRC0)......................................................................................... 39

4.5. Counters/Timers and PWM ..........................................................................................40

4.5.1. Programmable Counter Array (EPCA0, PCA0, PCA1)........................................ 40

4.5.2. 32-bit Timer (TIMER0, TIMER1).......................................................................... 40

4.5.3. Real-Time Clock (RTC0) ..................................................................................... 41

4.5.4. Low Power Timer (LPTIMER0)............................................................................41

4.5.5. Watchdog Timer (WDTIMER0)............................................................................41

4.6. Communications Peripherals ....................................................................................... 42

4.6.1. External Memory Interface (EMIF0).....................................................................42

4.6.2. USART (USART0, USART1)............................................................................... 42

4.6.3. UART (UART0, UART1) ...................................................................................... 42

4.6.4. SPI (SPI0, SPI1) .................................................................................................. 43

Rev.1.0

SiM3C1xx

4.6.5. I2C (I2C0, I2C1)................................................................................................... 43

4.6.6. I2S (I2S0)............................................................................................................. 44

4.7. Analog .......................................................................................................................... 45

4.7.1. 12-Bit Analog-to-Digital Converters (SARADC0, SARADC1).............................. 45

4.7.2. Sample Sync Generator (SSG0) ......................................................................... 45

4.7.3. 10-Bit Digital-to-Analog Converter (IDAC0, IDAC1) ............................................ 45

4.7.4. 16-Channel Capacitance-to-Digital Converter (CAPSENSE0) ............................ 46

4.7.5. Low Current Comparators (CMP0, CMP1) .......................................................... 46

4.7.6. Current-to-Voltage Converter (IVC0) ................................................................... 46

4.8. Reset Sources..............................................................................................................47

4.9. Security ........................................................................................................................ 48

4.10.On-Chip Debugging ..................................................................................................... 48

5. Ordering Information .........................................................................................................49

6. Pin Definitions and Packaging Information.....................................................................51

6.1. SiM3C1x7 Pin Definitions............................................................................................. 51

6.2. SiM3C1x6 Pin Definitions............................................................................................. 59

6.3. SiM3C1x4 Pin Definitions............................................................................................. 66

6.4. LGA-92 Package Specifications...................................................................................70

6.4.1. LGA-92 Solder Mask Design ............................................................................... 72

6.4.2. LGA-92 Stencil Design ........................................................................................ 72

6.4.3. LGA-92 Card Assembly ....................................................................................... 72

6.5. TQFP-80 Package Specifications ................................................................................ 73

6.5.1. TQFP-80 Solder Mask Design............................................................................. 76

6.5.2. TQFP-80 Stencil Design ...................................................................................... 76

6.5.3. TQFP-80 Card Assembly..................................................................................... 76

6.6. QFN-64 Package Specifications .................................................................................. 77

6.6.1. QFN-64 Solder Mask Design............................................................................... 79

6.6.2. QFN-64 Stencil Design ........................................................................................ 79

6.6.3. QFN-64 Card Assembly....................................................................................... 79

6.7. TQFP-64 Package Specifications ................................................................................ 80

6.7.1. TQFP-64 Solder Mask Design............................................................................. 83

6.7.2. TQFP-64 Stencil Design ...................................................................................... 83

6.7.3. TQFP-64 Card Assembly..................................................................................... 83

6.8. QFN-40 Package Specifications .................................................................................. 84

6.8.1. QFN-40 Solder Mask Design............................................................................... 86

6.8.2. QFN-40 Stencil Design ........................................................................................ 86

6.8.3. QFN-40 Card Assembly....................................................................................... 86

7. Revision Specific Behavior............................................................................................... 87

7.1. Revision Identification .................................................................................................. 87

7.2. Comparator Rising/Falling Edge Flags in Debug Mode (CMP0, CMP1)...................... 88

7.2.1. Problem ...............................................................................................................88

7.2.2. Impacts ................................................................................................................ 88

7.2.3. Workaround ......................................................................................................... 88

7.2.4. Resolution............................................................................................................ 88

Document Change List ........................................................................................................... 89

Contact Information ................................................................................................................ 90

Rev.1.0

SIM3C156-B-GM相似产品对比

	SIM3C156-B-GM	SIM3C146-B-GQ	SIM3C146-B-GM	SIM3C166-B-GQ	SIM3C166-B-GM	SIM3C136-B-GQ	SIM3C136-B-GM	SIM3C134-B-GM	SIM3C144-B-GM	SIM3C164-B-GM
描述	ARM Microcontrollers - MCU 32-bit ARM Cortex-M3 128KB QFN64	Headers u0026 Wire Housings 6 CKT VERT HEADER	ARM Microcontrollers - MCU 32-bit ARM Cortex-M3 64KB QFN64	I/O Controller Interface IC Enhanced USB-to-UART BRIDGE	ARM Microcontrollers - MCU 32-bit ARM Cortex-M3 256KB QFN64	ARM Microcontrollers - MCU 32-bit ARM Cortex-M3 32KB TQFP64	ARM Microcontrollers - MCU 32-bit ARM Cortex-M3 32KB QFN64	ARM Microcontrollers - MCU 32-bit ARM Cortex-M3 32KB QFN40	Analog to Digital Converters - ADC 16-Bit 100ksps Ultra Lo Pwr SAR	ARM Microcontrollers - MCU 32-bit ARM Cortex-M3 256KB QFN40
产品种类 Product Category	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU
制造商 Manufacturer	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories
RoHS	Details	Details	Details	Details	Details	Details	Details	Details	Details	Details
安装风格 Mounting Style	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT
封装 / 箱体 Package / Case	QFN-64	TQFP-64	QFN-64	TQFP-64	QFN-64	TQFP-64	QFN-64	QFN-40	QFN-40	QFN-40
Core	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3
Data Bus Width	32 bit	32 bit	32 bit	32 bit	32 bit	32 bit	32 bit	32 bit	32 bit	32 bit
Maximum Clock Frequency	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz
Program Memory Size	128 kB	64 kB	64 kB	256 kB	256 kB	32 kB	32 kB	32 kB	64 kB	256 kB
Data RAM Size	32 kB	16 kB	16 kB	32 kB	32 kB	8 kB	8 kB	8 kB	16 kB	32 kB
工作电源电压 Operating Supply Voltage	1.8 V to 3.6 V	1.8 V to 3.6 V	1.8 V to 3.6 V	1.8 V to 3.6 V	1.8 V to 3.6 V	1.8 V to 3.6 V	1.8 V to 3.6 V	1.8 V to 3.6 V	1.8 V to 3.6 V	1.8 V to 3.6 V
最大工作温度 Maximum Operating Temperature	+ 85 C	+ 85 C	+ 85 C	+ 85 C	+ 85 C	+ 85 C	+ 85 C	+ 85 C	+ 85 C	+ 85 C
Processor Series	SIM3C1xx	SIM3C1xx	SIM3C1xx	SIM3C1xx	SIM3C1xx	SIM3C1xx	SIM3C1xx	SIM3C1xx	SIM3C1xx	SIM3C1xx
系列 Packaging	Tray	Tray	Tray	Tray	Tray	Tray	Tray	Tray	Tray	Tray
接口类型 Interface Type	2 x I2C, I2S, 3 x SPI, 2 x USART, 2 x UART	2 x I2C, I2S, 3 x SPI, 2 x USART, 2 x UART	2 x I2C, I2S, 3 x SPI, 2 x USART, 2 x UART	2 x I2C, I2S, 3 x SPI, 2 x USART, 2 x UART	2 x I2C, I2S, 3 x SPI, 2 x USART, 2 x UART	2 x I2C, I2S, 3 x SPI, 2 x USART, 2 x UART	2 x I2C, I2S, 3 x SPI, 2 x USART, 2 x UART	2 x I2C, I2S, 3 x SPI, 2 x USART, 2 x UART	2 x I2C, I2S, 3 x SPI, 2 x USART, 2 x UART	2 x I2C, I2S, 3 x SPI, 2 x USART, 2 x UART
最小工作温度 Minimum Operating Temperature	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C
Number of I/Os	73 I/O	71 I/O	70 I/O	79 I/O	78 I/O	68 I/O	67 I/O	66 I/O	69 I/O	77 I/O
Number of Timers/Counters	10 Timer	8 Timer	7 Timer	16 Timer	15 Timer	5 Timer	4 Timer	3 Timer	6 Timer	14 Timer
单位重量 Unit Weight	0.007277 oz	0.012720 oz	0.007277 oz	0.012720 oz	0.007277 oz	0.012720 oz	0.007277 oz	0.004138 oz	0.004138 oz	0.004138 oz
Moisture Sensitive	Yes	-	-	Yes	Yes	Yes	Yes	Yes	Yes	Yes
工厂包装数量 Factory Pack Quantity	260	160	260	-	260	160	260	490	490	490

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