Digital to Analog Converters - DAC +2.7V to +5.5V, Low-Power, Triple, Parallel 8-Bit DAC with Rail-to-Rail Voltage Outputs
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | TSSOP |
| 包装说明 | 4.40 MM, MO-153AB, TSSOP-16 |
| 针数 | 16 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 最大模拟输出电压 | 5.5 V |
| 最小模拟输出电压 | |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY |
| 输入格式 | PARALLEL, 8 BITS |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 长度 | 5 mm |
| 最大线性误差 (EL) | 0.3906% |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 245 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 标称安定时间 (tstl) | 6 µs |
| 最大压摆率 | 0.52 mA |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 4.4 mm |
| MAX5101AEUE | MAX5101BEUE | MAX5101BEUE-T | MAX5101AEUE-T | |
|---|---|---|---|---|
| 描述 | Digital to Analog Converters - DAC +2.7V to +5.5V, Low-Power, Triple, Parallel 8-Bit DAC with Rail-to-Rail Voltage Outputs | Digital to Analog Converters - DAC +2.7V to +5.5V, Low-Power, Triple, Parallel 8-Bit DAC with Rail-to-Rail Voltage Outputs | Digital to Analog Converters - DAC 2.7V to 5.5V, Low-Power, Triple, Parallel 8-Bit DAC with Rail-to-Rail Voltage Outputs | Digital to Analog Converters - DAC 2.7V to 5.5V, Low-Power, Triple, Parallel 8-Bit DAC with Rail-to-Rail Voltage Outputs |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | TSSOP | TSSOP | TSSOP | TSSOP |
| 包装说明 | 4.40 MM, MO-153AB, TSSOP-16 | 4.40 MM, MO-153AB, TSSOP-16 | 4.40 MM, MO-153AB, TSSOP-16 | 4.40 MM, MO-153AB, TSSOP-16 |
| 针数 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
| 最大模拟输出电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY | BINARY | BINARY | BINARY |
| 输入格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 5 mm | 5 mm | 5 mm | 5 mm |
| 最大线性误差 (EL) | 0.3906% | 0.7812% | 0.7812% | 0.3906% |
| 湿度敏感等级 | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | TSSOP | TSSOP |
| 封装等效代码 | TSSOP16,.25 | TSSOP16,.25 | TSSOP16,.25 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 245 | 245 | 245 | 240 |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
| 标称安定时间 (tstl) | 6 µs | 6 µs | 6 µs | 6 µs |
| 最大压摆率 | 0.52 mA | 0.52 mA | 0.52 mA | 0.52 mA |
| 标称供电电压 | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm |
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