Analog to Digital Converters - ADC
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | LCC |
| 包装说明 | PLCC-28 |
| 针数 | 28 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最大模拟输入电压 | 5 V |
| 最小模拟输入电压 | |
| 最长转换时间 | 150 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | S-PQCC-J28 |
| JESD-609代码 | e0 |
| 长度 | 11.505 mm |
| 湿度敏感等级 | 1 |
| 标称负供电电压 | -5 V |
| 模拟输入通道数量 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出位码 | BINARY |
| 输出格式 | PARALLEL, 8 BITS |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC28,.5SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | +-5,15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.57 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 11.505 mm |
| MX7578KP-T | MX7578BQ | MX7578KCWG-T | MX7578KEWG-T | MX7578K/D-T | MX7578KN-T | |
|---|---|---|---|---|---|---|
| 描述 | Analog to Digital Converters - ADC | Analog to Digital Converters - ADC | Analog to Digital Converters - ADC | Analog to Digital Converters - ADC | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, DIE-22 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, PDIP24, PLASTIC, DIP-24 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | LCC | DIP | SOIC | SOIC | DIE | DIP |
| 包装说明 | PLCC-28 | CERDIP-24 | SOIC-24 | SOIC-24 | DIE, | DIP, |
| 针数 | 28 | 24 | 24 | 24 | 22 | 24 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最长转换时间 | 150 µs | 150 µs | 150 µs | 150 µs | 150 µs | 150 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | S-PQCC-J28 | R-GDIP-T24 | R-PDSO-G24 | R-PDSO-G24 | R-XUUC-N22 | R-PDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 标称负供电电压 | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 12 | 12 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 24 | 24 | 24 | 22 | 24 |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C |
| 输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| 输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | QCCJ | DIP | SOP | SOP | DIE | DIP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | UNCASED CHIP | IN-LINE |
| 峰值回流温度（摄氏度） | 225 | 245 | 240 | 240 | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | YES | NO |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD |
| 端子形式 | J BEND | THROUGH-HOLE | GULL WING | GULL WING | NO LEAD | THROUGH-HOLE |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | UPPER | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | - |
| 长度 | 11.505 mm | 31.75 mm | 15.4 mm | 15.4 mm | - | 31.75 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | - | - |
| 封装等效代码 | LDCC28,.5SQ | DIP24,.3 | SOP24,.4 | SOP24,.4 | - | - |
| 电源 | +-5,15 V | +-5,15 V | +-5,15 V | +-5,15 V | - | - |
| 座面最大高度 | 4.57 mm | 5.842 mm | 2.65 mm | 2.65 mm | - | 5.08 mm |
| 技术 | CMOS | CMOS | CMOS | CMOS | - | - |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | - | 2.54 mm |
| 宽度 | 11.505 mm | 15.24 mm | 7.5 mm | 7.5 mm | - | 15.24 mm |
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