Operational Amplifiers - Op Amps Dual 1.8-V w/ Rail-To-Rail I/O
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | MSOP |
| 包装说明 | GREEN, PLASTIC, VSSOP-8 |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK |
| 最大平均偏置电流 (IIB) | 0.075 µA |
| 25C 时的最大偏置电流 (IIB) | 0.065 µA |
| 标称共模抑制比 | 81 dB |
| 频率补偿 | YES |
| 最大输入失调电压 | 7500 µV |
| JESD-30 代码 | S-PDSO-G8 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 低-偏置 | NO |
| 低-失调 | NO |
| 微功率 | YES |
| 湿度敏感等级 | 1 |
| 负供电电压上限 | |
| 标称负供电电压 (Vsup) | |
| 功能数量 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP8,.19 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 |
| 功率 | NO |
| 电源 | 1.8/5 V |
| 可编程功率 | NO |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 标称压摆率 | 0.35 V/us |
| 最大压摆率 | 0.46 mA |
| 供电电压上限 | 5.5 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 标称均一增益带宽 | 1400 kHz |
| 最小电压增益 | 3980 |
| 宽带 | NO |
| 宽度 | 3 mm |
| LMV932IDGKR | LMV934IDRE4 | LMV932IDGKRG4 | LMV934IDR | LMV931IDBVR | LMV932IDRE4 | |
|---|---|---|---|---|---|---|
| 描述 | Operational Amplifiers - Op Amps Dual 1.8-V w/ Rail-To-Rail I/O | Operational Amplifiers - Op Amps Quad 1.8-V w/ Rail-To-Rail I/O | Operational Amplifiers - Op Amps Dual 1.8-V w/ Rail-To-Rail I/O | Operational Amplifiers - Op Amps Quad 1.8-V w/ Rail-To-Rail I/O | Operational Amplifiers - Op Amps Single 1.8-V with Rail-To-Rail I/O | Operational Amplifiers - Op Amps Dual 1.8-V w/ Rail-To-Rail I/O |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | MSOP | SOIC | MSOP | SOIC | SOT-23 | SOIC |
| 包装说明 | GREEN, PLASTIC, VSSOP-8 | SOP, SOP14,.25 | GREEN, PLASTIC, VSSOP-8 | SOP, SOP14,.25 | LSSOP, TSOP5/6,.11,37 | SOP, SOP8,.25 |
| 针数 | 8 | 14 | 8 | 14 | 5 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| 最大平均偏置电流 (IIB) | 0.075 µA | 0.075 µA | 0.075 µA | 0.075 µA | 0.075 µA | 0.075 µA |
| 25C 时的最大偏置电流 (IIB) | 0.065 µA | 0.065 µA | 0.065 µA | 0.065 µA | 0.065 µA | 0.065 µA |
| 标称共模抑制比 | 81 dB | 78 dB | 78 dB | 78 dB | 78 dB | 81 dB |
| 频率补偿 | YES | YES | YES | YES | YES | YES |
| 最大输入失调电压 | 7500 µV | 7500 µV | 7500 µV | 7500 µV | 6000 µV | 7500 µV |
| JESD-30 代码 | S-PDSO-G8 | R-PDSO-G14 | S-PDSO-G8 | R-PDSO-G14 | R-PDSO-G5 | R-PDSO-G8 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 3 mm | 8.65 mm | 3 mm | 8.65 mm | 2.9 mm | 4.9 mm |
| 低-偏置 | NO | NO | NO | NO | NO | NO |
| 低-失调 | NO | NO | NO | NO | NO | NO |
| 微功率 | YES | YES | YES | YES | YES | YES |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 2 | 4 | 2 | 4 | 1 | 2 |
| 端子数量 | 8 | 14 | 8 | 14 | 5 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | SOP | TSSOP | SOP | LSSOP | SOP |
| 封装等效代码 | TSSOP8,.19 | SOP14,.25 | TSSOP8,.19 | SOP14,.25 | TSOP5/6,.11,37 | SOP8,.25 |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 包装方法 | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 功率 | NO | NO | NO | NO | NO | NO |
| 电源 | 1.8/5 V | 1.8/5 V | 1.8/5 V | 1.8/5 V | 1.8/5 V | 1.8/5 V |
| 可编程功率 | NO | NO | NO | NO | NO | NO |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 1.75 mm | 1.1 mm | 1.75 mm | 1.45 mm | 1.75 mm |
| 标称压摆率 | 0.35 V/us | 0.35 V/us | 0.35 V/us | 0.35 V/us | 0.35 V/us | 0.35 V/us |
| 最大压摆率 | 0.46 mA | 0.92 mA | 0.46 mA | 0.92 mA | 0.23 mA | 0.46 mA |
| 供电电压上限 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | BICMOS | CMOS | BICMOS | BICMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm | 0.95 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 标称均一增益带宽 | 1400 kHz | 1400 kHz | 1400 kHz | 1400 kHz | 1400 kHz | 1400 kHz |
| 最小电压增益 | 3980 | 3980 | 3980 | 3980 | 4470 | 3980 |
| 宽带 | NO | NO | NO | NO | NO | NO |
| 宽度 | 3 mm | 3.9 mm | 3 mm | 3.9 mm | 1.6 mm | 3.9 mm |
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