Digital to Analog Converters - DAC Buffered, Fast-Settling, Dual, 12-/10-/8-Bit, Voltage-Output DACs
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | TSSOP |
包装说明 | 6.50 X 5 MM, MO-153AB, TSSOP-16 |
针数 | 16 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
最大模拟输出电压 | 3 V |
最小模拟输出电压 | |
转换器类型 | D/A CONVERTER |
输入位码 | BINARY |
输入格式 | SERIAL |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e0 |
长度 | 5 mm |
最大线性误差 (EL) | 0.1953% |
湿度敏感等级 | 1 |
位数 | 8 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP16,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 245 |
电源 | 2/3.3,3/3.3 V |
认证状态 | Not Qualified |
座面最大高度 | 1.1 mm |
最大稳定时间 | 4 µs |
标称安定时间 (tstl) | 2 µs |
标称供电电压 | 3 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 4.4 mm |
MAX5295EUE | MAX5290BEUD- | MAX5290AEUD-T | MAX5290AEUD | MAX5292EUD-T | MAX5291BEUE-T | MAX5291BEUE- | |
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描述 | Digital to Analog Converters - DAC Buffered, Fast-Settling, Dual, 12-/10-/8-Bit, Voltage-Output DACs | Programmers - Processor Based STM8S STM32 Programr 5V USB 2.0 JTAG DFU | Digital to Analog Converters - DAC Buffered, Fast Settling, Dual 12-/10-/8-Bit Voltage Output DACs | Digital to Analog Converters - DAC Buffered, Fast-Settling, Dual, 12-/10-/8-Bit, Voltage-Output DACs | Digital to Analog Converters - DAC 10-Bit 2Ch Precision DAC | Digital to Analog Converters - DAC Buffered, Fast Settling, Dual 12-/10-/8-Bit Voltage Output DACs | Digital to Analog Converters - DAC 12-Bit 2Ch Precision DAC |
是否无铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | - |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | - |
厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | - |
零件包装代码 | TSSOP | - | TSSOP | TSSOP | TSSOP | TSSOP | - |
包装说明 | 6.50 X 5 MM, MO-153AB, TSSOP-16 | - | 4.4 MM, MO-153-AB-1, TSSOP-14 | 6.50 X 5 MM, MO-153AB-1, TSSOP-14 | 6.50 X 5 MM, MO-153AB-1, TSSOP-14 | 6.50 X 5 MM, MO-153AB, TSSOP-16 | - |
针数 | 16 | - | 14 | 14 | 14 | 16 | - |
Reach Compliance Code | not_compliant | - | not_compliant | not_compliant | not_compliant | not_compliant | - |
最大模拟输出电压 | 3 V | - | 3.6 V | 3 V | 3 V | 3 V | - |
转换器类型 | D/A CONVERTER | - | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | - |
输入位码 | BINARY | - | BINARY | BINARY | BINARY | BINARY | - |
输入格式 | SERIAL | - | SERIAL | SERIAL | SERIAL | SERIAL | - |
JESD-30 代码 | R-PDSO-G16 | - | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G16 | - |
JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | - |
长度 | 5 mm | - | 5 mm | 5 mm | 5 mm | 5 mm | - |
最大线性误差 (EL) | 0.1953% | - | 0.0244% | 0.0244% | 0.0977% | 0.0977% | - |
湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | - |
位数 | 8 | - | 12 | 12 | 10 | 12 | - |
功能数量 | 1 | - | 1 | 1 | 1 | 1 | - |
端子数量 | 16 | - | 14 | 14 | 14 | 16 | - |
最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | - |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | - |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | TSSOP | - | TSSOP | TSSOP | TSSOP | TSSOP | - |
封装等效代码 | TSSOP16,.25 | - | TSSOP14,.25 | TSSOP14,.25 | TSSOP14,.25 | TSSOP16,.25 | - |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - |
峰值回流温度(摄氏度) | 245 | - | 240 | 245 | 240 | 240 | - |
电源 | 2/3.3,3/3.3 V | - | 2/3.3,3/3.3 V | 2/3.3,3/3.3 V | 2/3.3,3/3.3 V | 2/3.3,3/3.3 V | - |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
座面最大高度 | 1.1 mm | - | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | - |
最大稳定时间 | 4 µs | - | 6 µs | 6 µs | 6 µs | 6 µs | - |
标称安定时间 (tstl) | 2 µs | - | 3 µs | 3 µs | 2.5 µs | 3 µs | - |
标称供电电压 | 3 V | - | 3 V | 3 V | 3 V | 3 V | - |
表面贴装 | YES | - | YES | YES | YES | YES | - |
技术 | BICMOS | - | BICMOS | BICMOS | BICMOS | BICMOS | - |
温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
端子面层 | Tin/Lead (Sn85Pb15) | - | TIN LEAD | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | - |
端子形式 | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING | - |
端子节距 | 0.65 mm | - | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | - |
端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
宽度 | 4.4 mm | - | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm | - |
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