Zener diode
UMZ6.8EN
Application
Voltage regulation
(Anode common twin type)
Dimensions
(Unit : mm)
Lead size figure
(Unit : mm)
Features
1) Small mold type. (UMD5)
2) High reliability.
Structure
Silicon epitaxial planer
Structure
Taping dimensions
(Unit : mm)
Absolute maximum ratings
(Ta=25°C)
Parameter
Symbol
Power dissipation (*1)
P
Junction temperature
Tj
Storage temperature
Tstg
(*1) Total of 2 elements
Limits
200
150
-55 to +150
Unit
mW
°C
°C
Electrical characteristics
(Ta=25°C)
Parameter
Symbol
Zener voltage
V
Z
Reverse current
I
R
Dynamic impedance
Z
Z
Min.
6.47
-
-
Typ.
-
-
-
Max.
7.14
0.50
40
Unit
V
µA
Ω
I
Z
=5mA
V
R
=3.5V
I
Z
=5mA
Conditions
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©2009 ROHM Co., Ltd. All rights reserved.
1/2
2009.12 - Rev.D
UMZ6.8EN
Electrical characteristics
curves
10
REVERSE CURRENT:I
R
(nA)
Data Sheet
Ta=150°C Ta=125°C
100
Ta=75°C
10
Ta=75°C
1
0.1
0.01
Ta=-25°C
0.001
0.0001
Ta=25°C
CAPACITANCE BETWEEN
TERMINALS:Ct(pF)
100
f=1MH
ZENER CURRENT:Iz(mA)
1
Ta=25°C
Ta=125°C
Ta=-25°C
0.1
10
Ta=150°C
0.01
6
6.5
7
7.5
8
0.00001
0
1
2
3
4
1
0
1
2
3
4
5
6
ZENER VOLTAGE : Vz(V)
Vz-Iz CHARACTERISTICS
REVERSE VOLTAGE : V
R
(V)
V
R
-I
R
CHARACTERISTICS
REVERSE VOLTAGE : V
R
(V)
V
R
-Ct CHARACTERISTICS
7.2
Ta=25°C
IZ=5mA
n=30pcs
0.2
0.18
REVERSE CURRENT:I
R
(nA)
0.16
0.14
0.12
0.1
0.08
0.06
0.04
0.02
AVE:0.0143nA
Ta=25°C
V
R
=3.5V
n=30pcs
20
19.5
CAPACITANCE
BETWEENTERMINALS:Ct(pF)
19
18.5
18
17.5
17
16.5
16
15.5
15
AVE:19.06pF
Ta=25°C
f=1MHz
V
R
=0V
n=10pcs
ZENER VOLTAGE:Vz(Ｖ)
7.1
7
6.9
6.8
AVE:6.954V
6.7
0
Vz DISRESION MAP
I
R
DISRESION MAP
Ct DISRESION MAP
100
TRANSIENT
THAERMAL IMPEDANCE:Rth (°C/W)
DYNAMIC IMPEDANCE:Zz(Ω)
1000
Rth(j-a)
100
Rth(j-c)
Mounted on epoxy board
10
10
IM=10mA
I
F
=100mA
1ms
time
1
0.1
1
10
1
0.001
0.1
300us
10
1000
ZENER CURRENT(mA)
Zz-Iz CHARACTERISTICS
TIME:t(s)
Rth-t CHARACTERISTICS
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©2009 ROHM Co., Ltd. All rights reserved.
2/2
2009.12 - Rev.D
Datasheet
Notice
Precaution on using ROHM Products
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(Note 1)
, transport
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2
,
H
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S, NH
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, SO
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, and NO
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The Products are not subject to radiation-proof design.
Please verify and confirm characteristics of the final or mounted products in using the Products.
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De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
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3.
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6.
7.
8.
9.
Precaution for Mounting / Circuit board design
1.
2.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
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Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
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1.
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Other Precaution
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Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
General Precaution
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