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74LCX574WM

产品描述Headers u0026 Wire Housings RECEPTACLE 4P DUAL ROW
产品类别逻辑    逻辑   
文件大小904KB,共17页
制造商Fairchild
官网地址http://www.fairchildsemi.com/
标准
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74LCX574WM概述

Headers u0026 Wire Housings RECEPTACLE 4P DUAL ROW

74LCX574WM规格参数

参数名称属性值
Brand NameFairchild Semiconductor
是否无铅不含铅
是否Rohs认证符合
厂商名称Fairchild
零件包装代码SOIC
包装说明SOP, SOP20,.4
针数20
制造商包装代码20LD, SOIC, JEDEC MS013, .300\", WIDE BODY
Reach Compliance Codecompliant
ECCN代码EAR99
Samacsys DescriptionFairchild Semiconductor 74LCX574WM, Octal, D Type Flip Flop, 3-State, 2 → 3.6 V, 20-Pin SOIC
其他特性BROADSIDE VERSION OF 374
系列LVC/LCX/Z
JESD-30 代码R-PDSO-G20
JESD-609代码e3
长度12.8 mm
负载电容(CL)50 pF
逻辑集成电路类型BUS DRIVER
最大频率@ Nom-Sup150000000 Hz
最大I(ol)0.024 A
湿度敏感等级1
位数8
功能数量1
端口数量2
端子数量20
最高工作温度85 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装等效代码SOP20,.4
封装形状RECTANGULAR
封装形式SMALL OUTLINE
包装方法RAIL
峰值回流温度(摄氏度)260
电源3.3 V
Prop。Delay @ Nom-Sup8.5 ns
传播延迟(tpd)10.5 ns
认证状态Not Qualified
座面最大高度2.65 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
触发器类型POSITIVE EDGE
宽度7.5 mm
Base Number Matches1

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Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers
will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor
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device numbers. The most current and up-to-date ordering information can be found at
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Please
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74LCX574WM相似产品对比

74LCX574WM 74LCX574MSA 74LCX574MSAX 74LCX574WMX
描述 Headers u0026 Wire Housings RECEPTACLE 4P DUAL ROW Flip Flops Oct D-Type Flip-Flop Flip Flops Oct D-Type Flip-Flop Flip Flops Oct D-Type Flip-Flop
Brand Name Fairchild Semiconductor Fairchild Semiconductor Fairchild Semiconductor Fairchild Semiconductor
是否无铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合
厂商名称 Fairchild Fairchild Fairchild Fairchild
零件包装代码 SOIC SSOP SSOP SOIC
包装说明 SOP, SOP20,.4 SSOP, SSOP20,.3 SSOP, SSOP20,.3 SOP, SOP20,.4
针数 20 20 20 20
制造商包装代码 20LD, SOIC, JEDEC MS013, .300\", WIDE BODY 20LD, SSOP, JEDEC MO-150, 5.3MM WIDE 20LD, SSOP, JEDEC MO-150, 5.3MM WIDE 20LD, SOIC, JEDEC MS013, .300\", WIDE BODY
Reach Compliance Code compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99
其他特性 BROADSIDE VERSION OF 374 BROADSIDE VERSION OF 374 BROADSIDE VERSION OF 374 BROADSIDE VERSION OF 374
系列 LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 代码 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20
JESD-609代码 e3 e3 e3 e3
长度 12.8 mm 7.2 mm 7.2 mm 12.8 mm
负载电容(CL) 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
最大频率@ Nom-Sup 150000000 Hz 150000000 Hz 150000000 Hz 150000000 Hz
最大I(ol) 0.024 A 0.024 A 0.024 A 0.024 A
湿度敏感等级 1 1 1 1
位数 8 8 8 8
功能数量 1 1 1 1
端口数量 2 2 2 2
端子数量 20 20 20 20
最高工作温度 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP SSOP SSOP SOP
封装等效代码 SOP20,.4 SSOP20,.3 SSOP20,.3 SOP20,.4
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
包装方法 RAIL RAIL TAPE AND REEL TAPE AND REEL
峰值回流温度(摄氏度) 260 260 260 260
电源 3.3 V 3.3 V 3.3 V 3.3 V
Prop。Delay @ Nom-Sup 8.5 ns 8.5 ns 8.5 ns 8.5 ns
传播延迟(tpd) 10.5 ns 10.5 ns 10.5 ns 10.5 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.65 mm 2 mm 2 mm 2.65 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2 V 2 V 2 V 2 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
端子形式 GULL WING GULL WING GULL WING GULL WING
端子节距 1.27 mm 0.65 mm 0.65 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
触发器类型 POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
宽度 7.5 mm 5.3 mm 5.3 mm 7.5 mm
Base Number Matches 1 1 1 1
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钽电容与铝电容比较
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【ESK32-360测评】ESK32-360的使用感受
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