Digital to Analog Converters - DAC Single-Supply, 3V/5V, Voltage Output, Dual, Precision 12-Bit DACs
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | SOIC |
包装说明 | MICRO MAX PACKAGE-10 |
针数 | 10 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
Factory Lead Time | 1 week |
最大模拟输出电压 | 3 V |
最小模拟输出电压 | |
转换器类型 | D/A CONVERTER |
输入位码 | BINARY |
输入格式 | SERIAL |
JESD-30 代码 | S-PDSO-G10 |
JESD-609代码 | e4 |
长度 | 3 mm |
最大线性误差 (EL) | 0.0122% |
湿度敏感等级 | 1 |
位数 | 12 |
功能数量 | 1 |
端子数量 | 10 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP10,.19,20 |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 245 |
电源 | 3/3.3 V |
认证状态 | Not Qualified |
座面最大高度 | 1.1 mm |
标称安定时间 (tstl) | 10 µs |
最大压摆率 | 0.43 mA |
标称供电电压 | 3 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3 mm |
Base Number Matches | 1 |
MAX5234AEUB | MAX5235AEUB-T | MAX5235BEUB | MAX5234BEUB-T | MAX5234AEUB-T | MAX5235BEUB-T | MAX5235AEUB | MAX5234BEUB | MAX5234BEUB+ | |
---|---|---|---|---|---|---|---|---|---|
描述 | Digital to Analog Converters - DAC Single-Supply, 3V/5V, Voltage Output, Dual, Precision 12-Bit DACs | Digital to Analog Converters - DAC Single-Supply, 3V/5V, Voltage Output, Dual, Precision 12-Bit DACs | Digital to Analog Converters - DAC Single-Supply, 3V/5V, Voltage Output, Dual, Precision 12-Bit DACs | Digital to Analog Converters - DAC Single-Supply, 3V/5V, Voltage Output, Dual, Precision 12-Bit DACs | Digital to Analog Converters - DAC Single-Supply, 3V/5V, Voltage Output, Dual, Precision 12-Bit DACs | Digital to Analog Converters - DAC Single-Supply, 3V/5V, Voltage Output, Dual, Precision 12-Bit DACs | Digital to Analog Converters - DAC 12-Bit 2Ch Precision DAC | Digital to Analog Converters - DAC Single-Supply 3V/5V, Voltage-Output, Dual, Precision 12-Bit DACs | IC DAC 12BIT DUAL 3V 10-UMAX |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 不含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
包装说明 | MICRO MAX PACKAGE-10 | TSSOP, | MICRO MAX PACKAGE-10 | MICRO MAX PACKAGE-10 | TSSOP, | MICRO MAX PACKAGE-10 | MICRO MAX PACKAGE-10 | MICRO MAX PACKAGE-10 | TSSOP, |
针数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
Reach Compliance Code | not_compliant | compliant | not_compliant | not_compliant | compliant | not_compliant | not_compliant | not_compliant | compliant |
最大模拟输出电压 | 3 V | 5 V | 5 V | 3 V | 3 V | 5 V | 5 V | 3 V | 3 V |
转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
输入位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
输入格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
JESD-30 代码 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 |
JESD-609代码 | e4 | e0 | e4 | e0 | e0 | e0 | e4 | e4 | e4 |
长度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
最大线性误差 (EL) | 0.0122% | 0.0122% | 0.0244% | 0.0244% | 0.0122% | 0.0244% | 0.0122% | 0.0244% | 0.0244% |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
位数 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 245 | 245 | 245 | 245 | 245 | 245 | 245 | 245 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
标称安定时间 (tstl) | 10 µs | 10 µs | 10 µs | 10 µs | 10 µs | 10 µs | 10 µs | 10 µs | 10 µs |
标称供电电压 | 3 V | 5 V | 5 V | 3 V | 3 V | 5 V | 5 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | TIN LEAD | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn85Pb15) | TIN LEAD | Tin/Lead (Sn85Pb15) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
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