19-3515; Rev 2; 1/07
KIT
ATION
EVALU
BLE
AVAILA
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
General Description
The MAX5875 is an advanced 16-bit, 200Msps, dual
digital-to-analog converter (DAC). This DAC meets the
demanding performance requirements of signal synthesis
applications found in wireless base stations and other
communications applications. Operating from 3.3V and
1.8V supplies, this dual DAC offers exceptional dynamic
performance such as 78dBc spurious-free dynamic range
(SFDR) at f
OUT
= 16MHz and supports update rates of
200Msps, with a power dissipation of only 260mW.
The MAX5875 utilizes a current-steering architecture
that supports a 2mA to 20mA full-scale output current
range, and allows a 0.1V
P-P
to 1V
P-P
differential output
voltage swing. The device features an integrated 1.2V
bandgap reference and control amplifier to ensure
high-accuracy and low-noise performance. A separate
reference input (REFIO) allows for the use of an exter-
nal reference source for optimum flexibility and
improved gain accuracy.
The digital and clock inputs of the MAX5875 accept
3.3V CMOS voltage levels. The device features a flexi-
ble input data bus that allows for dual-port input or a
single-interleaved data port. The MAX5875 is available
in a 68-pin QFN package with an exposed paddle (EP)
and is specified for the extended temperature range
(-40°C to +85°C).
Refer to the MAX5873 and MAX5874 data sheets for
pin-compatible 12-bit and 14-bit versions of the
MAX5875, respectively. Refer to the MAX5878 data
sheet for an LVDS-compatible version of the MAX5875.
Features
♦
200Msps Output Update Rate
♦
Noise Spectral Density = -162dBFS/Hz at f
OUT
=
16MHz
♦
Excellent SFDR and IMD Performance
SFDR = 78dBc at f
OUT
= 16MHz (to Nyquist)
SFDR = 75dBc at f
OUT
= 80MHz (to Nyquist)
IMD = -86dBc at f
OUT
= 10MHz
IMD = -76dBc at f
OUT
= 80MHz
♦
ACLR = 75dB at f
OUT
= 61MHz
♦
2mA to 20mA Full-Scale Output Current
♦
CMOS-Compatible Digital and Clock Inputs
♦
On-Chip 1.2V Bandgap Reference
♦
Low 260mW Power Dissipation
♦
Compact 68-Pin QFN-EP Package (10mm x 10mm)
♦
Evaluation Kit Available (MAX5875EVKIT)
MAX5875
Ordering Information
PART
MAX5875EGK-D
MAX5875EGK+D
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
PIN-
PACKAGE
68 QFN-EP*
68 QFN-EP*
PKG
CODE
G6800-4
G6800-4
*EP
= Exposed pad.
+ Denotes lead-free package.
D = Dry pack.
Pin Configuration
TOP VIEW
A10
A11
A12
A13
A14
A15
A9
68
67 66 65 64
Base Stations: Single/Multicarrier UMTS, CDMA, GSM
Communications: Fixed Broadband Wireless Access,
Point-to-Point Microwave
Direct Digital Synthesis (DDS)
Cable Modem Termination Systems (CMTS)
Automated Test Equipment (ATE)
Instrumentation
DV
DD1.8
Applications
B0
B1
B2
B3
B4
B5
B6
B7
63 62 61 60 59 58
57 56 55 54 53 52
51
50
49
48
47
46
45
44
A8
A7
A6
A5
A4
A3
A2
A1
A0
GND
DV
DD3.3
GND
GND
AV
DD3.3
GND
REFIO
FSADJ
B8
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34
B9
B10
B11
B12
B13
B14
B15
SELIQ
GND
XOR
DORI
PD
TORB
CLKP
CLKN
GND
AV
CLK
Selector Guide
PART
MAX5873
MAX5874
MAX5875
MAX5876
MAX5877
MAX5878
RESOLUTION
(Bits)
12
14
16
12
14
16
UPDATE
RATE (Msps)
200
200
200
250
250
250
LOGIC
INPUTS
CMOS
CMOS
CMOS
LVDS
LVDS
LVDS
MAX5875
43
42
41
40
39
38
37
36
35
AV
DD1.8
GND
OUTQP
GND
GND
GND
GND
OUTQN
OUTIN
DACREF
AV
DD3.3
AV
DD3.3
OUTIP
AV
DD3.3
AV
DD3.3
GND
QFN
________________________________________________________________
Maxim Integrated Products
AV
DD1.8
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
MAX5875
ABSOLUTE MAXIMUM RATINGS
Continuous Power Dissipation (T
A
= +70°C)
AV
DD1.8
, DV
DD1.8
to GND, DACREF ..................-0.3V to +2.16V
AV
DD3.3
, DV
DD3.3
, AV
CLK
to GND, DACREF ........-0.3V to +3.9V
68-Pin QFN-EP
REFIO, FSADJ to GND, DACREF ........-0.3V to (AV
DD3.3
+ 0.3V)
(derate 41.7mW/°C above +70°C) (Note 1) ............3333.3mW
OUTIP, OUTIN, OUTQP, OUTQN to
Thermal Resistance
θ
JA
(Note 1)...................................+24°C/W
Operating Temperature Range ...........................-40°C to +85°C
GND, DACREF....................................-1V to (AV
DD3.3
+ 0.3V)
CLKP, CLKN to GND, DACREF..............-0.3V to (AV
CLK
+ 0.3V)
Junction Temperature ......................................................+150°C
A15/B15–A0/B0, XOR, SELIQ to
Storage Temperature Range .............................-60°C to +150°C
GND, DACREF .....................................-0.3V to (DV
DD3.3
+ 0.3V)
Lead Temperature (soldering, 10s) .................................+300°C
TORB,
DORI,
PD to GND, DACREF ....-0.3V to (DV
DD3.3
+ 0.3V)
Note 1:
Thermal resistors based on a multilayer board with 4 x 4 via array in exposed paddle area.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(AV
DD3.3
= DV
DD3.3
= AV
CLK
= 3.3V, AV
DD1.8
= DV
DD1.8
= 1.8V, GND = 0, f
CLK
= f
DAC
, external reference V
REFIO
= 1.25V, output load
50Ω double-terminated, transformer-coupled output, I
OUTFS
= 20mA, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 2)
PARAMETER
STATIC PERFORMANCE
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Offset-Drift Tempco
Full-Scale Gain Error
Gain-Drift Tempco
Full-Scale Output Current
Output Compliance
Output Resistance
Output Capacitance
DYNAMIC PERFORMANCE
Clock Frequency
Output Update Rate
Noise Spectral Density
f
CLK
f
DAC
f
DAC
= f
CLK
/ 2, single-port mode
f
DAC
= f
CLK
, dual-port mode
f
DAC
= 150MHz
f
DAC
= 200MHz
f
OUT
= 16MHz, -12dBFS
f
OUT
= 80MHz, -12dBFS
1
1
1
-162
-160
200
100
200
MHz
Msps
dBFS/Hz
R
OUT
C
OUT
I
OUTFS
GE
FS
External reference
Internal reference
External reference
(Note 3)
Single-ended
2
-0.5
1
5
INL
DNL
OS
Measured differentially
Measured differentially
-0.025
16
±3
±2
±0.001 +0.025
±10
±1
±100
±50
20
+1.1
Bits
LSB
LSB
%FS
ppm/°C
%FS
ppm/°C
mA
V
MΩ
pF
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
2
_______________________________________________________________________________________
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
ELECTRICAL CHARACTERISTICS (continued)
(AV
DD3.3
= DV
DD3.3
= AV
CLK
= 3.3V, AV
DD1.8
= DV
DD1.8
= 1.8V, GND = 0, f
CLK
= f
DAC
, external reference V
REFIO
= 1.25V, output load
50Ω double-terminated, transformer-coupled output, I
OUTFS
= 20mA, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
f
OUT
= 1MHz, 0dBFS
f
OUT
= 1MHz, -6dBFS
f
DAC
= 100MHz
f
OUT
= 1MHz, -12dBFS
f
OUT
= 10MHz, -12dBFS
Spurious-Free Dynamic Range to
Nyquist
f
OUT
= 30MHz, -12dBFS
SFDR
f
OUT
= 10MHz, -12dBFS
f
OUT
= 16MHz, -12dBFS,
T
A
≥
+25
o
C
f
OUT
= 16MHz, 0dBFS
f
OUT
= 50MHz, -12dBFS
f
OUT
= 80MHz, -12dBFS
Spurious-Free Dynamic Range,
25MHz Bandwidth
SFDR
f
DAC
= 150MHz
f
DAC
= 100MHz
Two-Tone IMD
TTIMD
f
DAC
= 200MHz
Four-Tone IMD, 1MHz
Frequency Spacing, GSM Model
Adjacent Channel Leakage Power
Ratio 3.84MHz Bandwidth,
W-CDMA Model
Output Bandwidth
INTER-DAC CHARACTERISTICS
Gain Matching
Gain-Matching Tempco
Phase Matching
Phase-Matching Tempco
Channel-to-Channel Crosstalk
REFERENCE
Internal Reference Voltage Range
Reference Input Compliance
Range
Reference Input Resistance
Reference Voltage Drift
V
REFIO
V
REFIOCR
R
REFIO
TCO
REF
1.14
0.125
10
±25
1.2
1.26
1.250
V
V
kΩ
ppm/°C
∆Gain
∆Gain/°C
∆Phase
f
OUT
= 60MHz
∆Phase/°C
f
OUT
= 60MHz
f
CLK
= 200MHz, f
OUT
= 50MHz, 0dBFS
f
OUT
= DC - 80MHz
f
OUT
= DC
±0.2
+0.01
±20
±0.25
±0.002
-70
dB
ppm/°C
Degrees
Degrees/
°C
dB
FTIMD
f
DAC
= 150MHz
f
DAC
=
184.32MHz
(Note 4)
f
OUT
= 16MHz, -12dBFS
f
OUT1
= 9MHz, -7dBFS;
f
OUT2
= 10MHz, -7dBFS
f
OUT1
= 79MHz, -7dBFS;
f
OUT2
= 80MHz, -7dBFS
f
OUT
= 16MHz, -12dBFS
71
MIN
TYP
88
84
82
81
79
80
78
87
78
75
84
-86
dBc
-76
-86
dBc
dBc
dBc
MAX
UNITS
MAX5875
f
DAC
= 200MHz
ACLR
BW
-1dB
f
OUT
= 61.44MHz
75
240
dB
MHz
_______________________________________________________________________________________
3
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
MAX5875
ELECTRICAL CHARACTERISTICS (continued)
(AV
DD3.3
= DV
DD3.3
= AV
CLK
= 3.3V, AV
DD1.8
= DV
DD1.8
= 1.8V, GND = 0, f
CLK
= f
DAC
, external reference V
REFIO
= 1.25V, output load
50Ω double-terminated, transformer-coupled output, I
OUTFS
= 20mA, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 2)
PARAMETER
Output Fall Time
Output Rise Time
Output-Voltage Settling Time
Output Propagation Delay
Glitch Impulse
Output Noise
TIMING CHARACTERISTICS
Data to Clock Setup Time
Data to Clock Hold Time
Single-Port (Interleaved Mode)
Data Latency
Dual-Port (Parallel Mode) Data
Latency
Minimum Clock Pulse-Width High
Minimum Clock Pulse-Width Low
t
CH
t
CL
CLKP, CLKN
CLKP, CLKN
0.7 x
DV
DD3.3
0.3 x
DV
DD3.3
1
V
PD
= V
TORB
= V
DORI
= 3.3V
C
IN
Sine wave
Square wave
SR
CLK
V
COM
R
CLK
C
CLK
AV
DD3.3
AV
DD1.8
DV
DD3.3
DV
DD1.8
AV
CLK
3.135
1.710
3.135
1.710
3.135
(Note 7)
1.5
2.5
> 1.5
> 0.5
> 100
AV
CLK
/ 2
±0.3
5
2.5
3.3
1.8
3.3
1.8
3.3
3.465
1.890
3.465
1.890
3.465
20
t
SETUP
t
HOLD
Referenced to rising edge of clock (Note 6)
Referenced to rising edge of clock (Note 6)
Latency to I output
Latency to Q output
-0.6
2.1
-1.2
1.5
9
8
5.5
2.4
2.4
ns
ns
Clock
Cycles
Clock
Cycles
ns
ns
n
OUT
SYMBOL
t
FALL
t
RISE
t
SETTLE
t
PD
CONDITIONS
90% to 10% (Note 5)
10% to 90% (Note 5)
Output settles to 0.025% FS (Note 5)
Excluding data latency (Note 5)
Measured differentially
I
OUTFS
= 2mA
I
OUTFS
= 20mA
MIN
TYP
0.7
0.7
14
1.1
1
30
30
MAX
UNITS
ns
ns
ns
ns
pV
•
s
pA/√Hz
ANALOG OUTPUT TIMING (See Figure 4)
CMOS LOGIC INPUTS (A15/B15–A0/B0, XOR, SELIQ, PD, TORB,
DORI)
Input-Logic High
Input-Logic Low
Input Leakage Current
PD, TORB,
DORI
Internal
Pulldown Resistance
Input Capacitance
CLOCK INPUTS (CLKP, CLKN)
Differential Input
Voltage Swing
Differential Input Slew Rate
External Common-Mode Voltage
Range
Input Resistance
Input Capacitance
POWER SUPPLIES
Analog Supply Voltage Range
Digital Supply Voltage Range
Clock Supply Voltage Range
V
V
V
V
P-P
V/µs
V
kΩ
pF
V
IH
V
IL
I
IN
V
V
µA
MΩ
pF
4
_______________________________________________________________________________________
16-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
ELECTRICAL CHARACTERISTICS (continued)
(AV
DD3.3
= DV
DD3.3
= AV
CLK
= 3.3V, AV
DD1.8
= DV
DD1.8
= 1.8V, GND = 0, f
CLK
= f
DAC
, external reference V
REFIO
= 1.25V, output load
50Ω double-terminated, transformer-coupled output, I
OUTFS
= 20mA, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
53
0.002
25
0.001
0.5
0.001
22
0.001
260
14
-0.1
+0.1
300
mW
MAX5875
MAX
58
32
3
25
UNITS
Analog Supply Current
I
AVDD3.3 +
f
DAC
= 200Msps, f
OUT
= 1MHz
I
AVCLK
Power-down
I
AVDD1.8
I
DVDD3.3
f
DAC
= 200Msps, f
OUT
= 1MHz
Power-down
f
DAC
= 200Msps, f
OUT
= 1MHz
Power-down
f
DAC
= 200Msps, f
OUT
= 1MHz
Power-down
f
DAC
= 200Msps, f
OUT
= 1MHz
Power-down
AV
DD3.3
= AV
CLK
= DV
DD3.3
= +3.3V
±5%
(Notes 7, 8)
mA
Digital Supply Current
I
DVDD1.8
Power Dissipation
Power-Supply Rejection Ratio
P
DISS
PSRR
mA
µW
%FS/V
Note 2:
Specifications at T
A
≥
+25°C are guaranteed by production testing. Specifications at T
A
< +25°C are guaranteed by design
and characterization data.
Note 3:
Nominal full-scale current I
OUTFS
= 32 x I
REF
.
Note 4:
This parameter does not include update-rate-dependent effects of sin(x)/x filtering inherent in the MAX5875.
Note 5:
Parameter measured single-ended into a 50Ω termination resistor.
Note 6:
Not production tested. Guaranteed by design and characterization data.
Note 7:
A differential clock input slew rate of > 100V/µs is required to achieve the specified dynamic performance.
Note 8:
Parameter defined as the change in midscale output caused by a ±5% variation in the nominal supply voltage.
Typical Operating Characteristics
(AV
DD3.3
= DV
DD3.3
= AV
CLK
= 3.3V, AV
DD1.8
= DV
DD1.8
= 1.8V, external reference, V
REFIO
= 1.25V, R
L
= 50Ω double-terminated,
I
OUTFS
= 20mA, T
A
= +25°C, unless otherwise noted.)
SINGLE-TONE SFDR vs. OUTPUT
FREQUENCY (f
CLK
= 50Msps)
MAX5875 toc01
SINGLE-TONE SFDR vs. OUTPUT
FREQUENCY (f
CLK
= 100Msps)
MAX5875 toc02
SINGLE-TONE SFDR vs. OUTPUT
FREQUENCY (f
CLK
= 150Msps)
0dBFS
80
-12dBFS
SFDR (dBc)
60
-6dBFS
MAX5875 toc03
100
0dBFS
100
0dBFS
80
-12dBFS -6dBFS
SFDR (dBc)
60
100
80
-12dBFS
-6dBFS
SFDR (dBc)
60
40
40
40
20
20
20
0
0
5
10
15
20
25
f
OUT
(MHz)
0
0
10
20
30
40
50
f
OUT
(MHz)
0
0
15
30
45
60
75
f
OUT
(MHz)
_______________________________________________________________________________________
5
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
