Display Drivers u0026 Controllers
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | QFN |
包装说明 | HVQCCN, LCC20,.16SQ,20 |
针数 | 20 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
Is Samacsys | N |
模拟集成电路 - 其他类型 | SWITCHING CONTROLLER |
控制模式 | CURRENT-MODE |
控制技术 | PULSE WIDTH MODULATION |
最大输入电压 | 5.5 V |
最小输入电压 | 2.7 V |
标称输入电压 | 3 V |
JESD-30 代码 | S-PQCC-N20 |
JESD-609代码 | e0 |
长度 | 4 mm |
湿度敏感等级 | 1 |
功能数量 | 5 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装等效代码 | LCC20,.16SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 245 |
电源 | 3/5 V |
认证状态 | Not Qualified |
座面最大高度 | 0.8 mm |
最大供电电流 (Isup) | 1.25 mA |
表面贴装 | YES |
切换器配置 | SINGLE |
最大切换频率 | 1725 kHz |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 4 mm |
Base Number Matches | 1 |
MAX1513ETP-T | MAX1513ETP | MAX1514ETP-T | MAX1514ETP | HCHP1005K2104DNT | |
---|---|---|---|---|---|
描述 | Display Drivers u0026 Controllers | Display Drivers u0026 Controllers | LCD Drivers | LCD Drivers | Fixed Resistor, Metal Glaze/thick Film, 0.25W, 2100000ohm, 150V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 1005, CHIP |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 |
包装说明 | HVQCCN, LCC20,.16SQ,20 | HVQCCN, LCC20,.16SQ,20 | HVQCCN, | HVQCCN, LCC20,.16SQ,20 | SMT, 1005 |
Reach Compliance Code | not_compliant | not_compliant | compliant | not_compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
JESD-609代码 | e0 | e0 | e0 | e0 | e2 |
端子数量 | 20 | 20 | 20 | 20 | 2 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 155 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMT |
表面贴装 | YES | YES | YES | YES | YES |
技术 | BICMOS | BICMOS | BICMOS | BICMOS | METAL GLAZE/THICK FILM |
端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | TIN LEAD | Tin/Lead (Sn85Pb15) | Tin/Silver (Sn/Ag) - with Nickel (Ni) barrier |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | - |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - |
零件包装代码 | QFN | QFN | QFN | QFN | - |
针数 | 20 | 20 | 20 | 20 | - |
Is Samacsys | N | N | N | N | - |
模拟集成电路 - 其他类型 | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | - |
控制模式 | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | - |
控制技术 | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | - |
最大输入电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
最小输入电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - |
标称输入电压 | 3 V | 3 V | 3 V | 3 V | - |
JESD-30 代码 | S-PQCC-N20 | S-PQCC-N20 | S-PQCC-N20 | S-PQCC-N20 | - |
长度 | 4 mm | 4 mm | 4 mm | 4 mm | - |
湿度敏感等级 | 1 | 1 | 1 | 1 | - |
功能数量 | 5 | 5 | 5 | 5 | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | - |
封装等效代码 | LCC20,.16SQ,20 | LCC20,.16SQ,20 | - | LCC20,.16SQ,20 | - |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | - |
峰值回流温度(摄氏度) | 245 | 240 | 245 | 240 | - |
电源 | 3/5 V | 3/5 V | - | 3/5 V | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | - |
最大供电电流 (Isup) | 1.25 mA | 1.25 mA | - | 1.25 mA | - |
切换器配置 | SINGLE | SINGLE | SINGLE | SINGLE | - |
最大切换频率 | 1725 kHz | 1725 kHz | 1725 kHz | 1725 kHz | - |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | - |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | - |
端子位置 | QUAD | QUAD | QUAD | QUAD | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | 20 | NOT SPECIFIED | 20 | - |
宽度 | 4 mm | 4 mm | 4 mm | 4 mm | - |
Base Number Matches | 1 | 1 | 1 | 1 | - |
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