Hi-Speed USB Device Transceiver with UTMI Interface
Highlights
• USB-IF "Hi-Speed" certified to USB 2.0 electrical
specification
• Interface compliant with the UTMI specification
(60MHz 8-bit unidirectional interface or 30MHz
16-bit bidirectional interface)
• Supports 480Mbps High Speed (HS) and 12Mbps
Full Speed (FS) serial data transmission rates
• Integrated 45 and 1.5k termination resistors
reduce external component count
• Internal short circuit protection of DP and DM
lines
• On-chip oscillator operates with low cost 12MHz
crystal
• Robust and low power digital clock and data
recovery circuit
• SYNC and EOP generation on transmit packets
and detection on receive packets
• NRZI encoding and decoding
• Bit stuffing and unstuffing with error detection
• Supports the USB suspend state, HS detection,
HS Chirp, Reset and Resume
• Support for all test modes defined in the USB 2.0
specification
• Draws 72mA (185mW) maximum current con-
sumption in HS mode - ideal for bus powered
functions
• On-die decoupling capacitance and isolation for
immunity to digital switching noise
• Available in a 56-pin VQFN package
• Full industrial operating temperature range from
-40
o
C to +85
o
C (ambient)
Applications
The Universal Serial Bus (USB) is the preferred inter-
face to connect Hi-Speed PC peripherals.
•
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•
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Digital Still and Video Cameras
MP3 Players
External Hard Drives
Scanners
Entertainment Devices
Printers
Test and Measurement Systems
POS Terminals
Set Top Boxes
2013 - 2016 Microchip Technology Inc.
DS00002142A-page 1
USB3250
TO OUR VALUED CUSTOMERS
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The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
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DS00002142A-page 2
2013 - 2016 Microchip Technology Inc.
USB3250
Table of Contents
1.0 General Description ........................................................................................................................................................................ 4
Appendix A: Data Sheet Revision History ........................................................................................................................................... 42
The Microchip Web Site ...................................................................................................................................................................... 43
Customer Change Notification Service ............................................................................................................................................... 43
Customer Support ............................................................................................................................................................................... 43
Product Identification System ............................................................................................................................................................. 44
2013 - 2016 Microchip Technology Inc.
DS00002142A-page 3
USB3250
1.0
GENERAL DESCRIPTION
The USB3250 provides the Physical Layer (PHY) interface to a USB 2.0 Device Controller. The IC is available in a 56-
pin VQFN.
The USB3250 is a USB 2.0 physical layer transceiver (PHY) integrated circuit. Microchip's proprietary technology
results in low power dissipation, which is ideal for building a bus powered USB 2.0 peripheral. The PHY can be config-
ured for either an 8-bit unidirectional or a 16-bit bidirectional parallel interface, which complies with the USB Transceiver
Macrocell Interface (UTMI) specification. It supports 480Mbps transfer rate, while remaining backward compatible with
USB 1.1 legacy protocol at 12Mbps.
All required termination for the USB 2.0 Transceiver is internal. Internal 5.25V short circuit protection of DP and DM lines
is provided for USB compliance.
While transmitting data, the PHY serializes data and generates SYNC and EOP fields. It also performs needed bit stuff-
ing and NRZI encoding. Likewise, while receiving data, the PHY de-serializes incoming data, stripping SYNC and EOP
fields and performs bit un-stuffing and NRZI decoding.
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