Operating Temperature Range .........................-40°C to +125°C
Storage Temperature Range .............................-65°C to +160°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Electrical Characteristics
(V
CC
= +2.5V to +5.5V, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C.)
PARAMETER
Operating Voltage Range
SYMBOL
V
CC
CONDITIONS
MIN
TYP
5
4
V
TH
MAX
5.5
12
15
10
12
V
TH
+ 1.8%
V
TH
+ 2.5%
V
TH
+ 3.5%
UNITS
V
T
A
= -40°C to +85°C
1.0
V
CC
= 5.5V, no load (-40°C to +85°C)
V
CC
= 5.5V, no load (-40°C to +125°C)
V
CC
= 3.6V, no load (-40°C to +85°C)
V
CC
= 3.6V, no load (-40°C to +125°C)
T
A
= +25°C
V
TH
- 1.8%
T
A
= -40°C to +85°C
V
TH
- 2.5%
T
A
= -40°C to +125°C
V
TH
- 3.5%
V
CC
= falling at 1mV/µs
MAX6315US_ _D1-T (-40°C to +85°C)
MAX6315US_ _D1-T (-40°C to +125°C)
MAX6315US_ _D2-T (-40°C to +85°C)
MAX6315US_ _D2-T (-40°C to +125°C)
MAX6315US_ _D3-T (-40°C to +85°C)
MAX6315US_ _D3-T (-40°C to +125°C)
MAX6315US_ _D4-T (-40°C to +85°C)
MAX6315US_ _D4-T (-40°C to +125°C)
V
CC
Supply Current
I
CC
µA
Reset Threshold (Note 1)
Reset Threshold Tempco
V
CC
to Reset Delay
V
TH
ΔV
TH
/°C
V
ppm/°C
µs
Reset Timeout Period
t
RP
1
0.8
20
16
140
112
1120
896
0.8
60
35
1.4
28
200
1570
2
2.4
40
48
280
336
2240
2688
ms
MANUAL RESET INPUT
MR
Input Threshold
MR
Minimum Input Pulse
MR
Glitch Rejection
MR
to Reset Delay
MR
Pullup Resistance
V
CC
> 4.25V, I
SINK
= 3.2mA
RESET
Output Voltage
V
OL
V
CC
> 2.5V, I
SINK
= 1.2mA
V
CC
> 1.2V, I
SINK
= 0.5mA
V
CC
> 1.0V, I
SINK
= 80µA
RESET
Output Leakage Current
V
CC
> V
TH
,
RESET
deasserted
32
V
IL
V
IH
V
IL
V
IH
V
TH
> 4.0V
V
TH
< 4.0V
2.4
0.3 x V
CC
0.7 x V
CC
1
100
500
63
100
0.4
0.3
0.3
0.3
1
µA
V
µs
ns
ns
kΩ
V
Note 1:
The MAX6315 monitors V
CC
through an internal factory-trimmed voltage-divider that programs the nominal reset threshold.
Factory-trimmed reset thresholds are available in 100mV increments from 2.5V to 5V (see the
Ordering Information).
www.maximintegrated.com
Maxim Integrated | 2
MAX6315
Open-Drain SOT µP Reset Circuit
Typical Operating Characteristics
(T
A
= +25°C, unless otherwise noted.)
SUPPLY CURRENT vs. TEMPERATURE
MAX6315-01
SUPPLY CURRENT
vs. SUPPLY VOLTAGE
MAX6315-02
POWER-DOWN RESET DELAY
vs. TEMPERATURE
V
CC
FALLING AT 1mV/μs
POWER-DOWN RESET DELAY (μs)
40
V
TH
= 4.63V
MAX6315-03
6
5
SUPPLY CURRENT (μA)
4
3
V
CC
= 3V
2
1
0
-50
-30
-10
10
30
50
70
V
CC
= 1V
V
CC
= 5V
6
5
SUPPLY CURRENT (μA)
4
3
T
A
= +25°C
2
1
0
T
A
= -40°C
50
T
A
= +85°C
30
20
V
TH
= 3.00V
10
0
0
1
2
3
4
5
-50
-30
-10
10
30
50
70
90
SUPPLY VOLTAGE (V)
TEMPERATURE (°C)
90
TEMPERATURE (°C)
NORMALIZED RESET TIMEOUT PERIOD
vs. TEMPERATURE (V
CC
RISING)
MAX6315-04
NORMALIZED RESET THRESHOLD
vs. TEMPERATURE (V
CC
FALLING)
MAX6315-05
MAXIMUM TRANSIENT DURATION
vs. RESET COMPARATOR OVERDRIVE
MAXIMUM TRANSIENT DURATION (μs)
T
A
= +25°C
RESET OCCURS
ABOVE CURVE
V
TH
= 4.63V
60
MAX6315-06
1.04
NORMALIZED RESET TIMEOUT PERIOD
1.03
1.02
1.01
1.00
0.99
0.98
0.97
0.96
-50
-30
-10
10
30
50
70
1.006
NORMALIZED RESET THRESHOLD
1.004
1.002
1.000
0.998
0.996
0.994
100
80
40
20
V
T
= 3.00V
0
10
100
RESET COMP. OVERDRIVE, V
TH
- V
CC
(mV)
1000
90
-50
-30
-10
10
30
50
70
90
TEMPERATURE (°C)
TEMPERATURE (°C)
Pin Description
PIN
1
2
3
4
NAME
GND
RESET
MR
V
CC
Ground
Active-Low Open-Drain Output. Connect to an external pullup resistor. Can be pulled up to a voltage
higher than V
CC
, but less than 6V.
Manual Reset Input. A logic-low on
MR
asserts reset. Reset remains asserted as long as
MR
is low, and
for the reset timeout period (t
RP
) after the reset conditions are terminated. Connect to V
CC
if not used.
Supply Voltage and Reset Threshold Monitor Input
FUNCTION
www.maximintegrated.com
Maxim Integrated | 3
MAX6315
Open-Drain SOT µP Reset Circuit
Detailed Description
Reset Output
A microprocessor’s (µP’s) reset input starts the µP in a
known state. The MAX6315 asserts reset to prevent
code-execution errors during power-up, power-
down, or brownout conditions.
RESET
is guaranteed to
be a logic-low for V
CC
> 1V (see the
Electrical
Characteristics
table). Once V
CC
exceeds the reset
threshold, the internal timer keeps
RESET
asserted for
the reset timeout period (t
RP
); after this interval
RESET
goes high. If a brownout condition occurs (monitored
voltage dips below its programmed reset threshold),
RESET
goes low. Any time V
CC
dips below the reset
threshold, the internal timer resets to zero and
RESET
goes low. The internal timer starts when V
CC
returns
above the reset threshold, and
RESET
remains low for
the reset timeout period.
The MAX6315’s
RESET
output structure is a simple
open-drain n-channel MOSFET switch. Connect a pull-
up resistor to any supply in the 0V to +6V range. Select
a resistor value large enough to register a logic low
when
RESET
is asserted (see the
Electrical
Characteristics
table), and small enough to register a
logic high while supplying all input current and leakage
paths connected to the
RESET
line. A 10kΩ pullup is
sufficient in most applications.
Often, the pullup connected to the MAX6315’s
RESET
output will connect to the supply voltage monitored at
the IC’s V
CC
pin. However, some systems may use the
open-drain output to level-shift from the monitored
supply to reset circuitry powered by some other supply
(Figure 1). This is one useful feature of an open-drain
output. Keep in mind that as the MAX6315’s V
CC
decreases below 1V, so does the IC’s ability to sink
current at
RESET.
Finally, with any pullup,
RESET
will
be pulled high as V
CC
decays toward 0V. The voltage
where this occurs depends on the pullup resistor value
and the voltage to which it connects (see the
Electrical
Characteristics
table).
+3.3V
+5.0V
V
CC
10kΩ
MR
RESET
5V SYSTEM
MAX6315
GND
Figure 1. MAX6315 Open-Drain
RESET
Output Allows Use
with Multiple Supplies
MR
has an internal 63kΩ pullup resistor, so it can be
left open if not used. Connect a normally open momen-
tary switch from
MR
to GND to create a manual-reset
function; external debounce circuitry is not required.
If
MR
is driven from long cables or if the device is used
in a noisy environment, connecting a 0.1µF capacitor
from
MR
to ground provides additional noise immunity.
Applications Information
Negative-Going V
CC
Transients
In addition to issuing a reset to the µP during power-up,
power-down, and brownout conditions, these devices
are relatively immune to short-duration negative-going
transients (glitches). The
Typical Operating Character-
istics
show the Maximum Transient Duration vs. Reset
Comparator Overdrive, for which reset pulses are not
generated. The graph was produced using negative-
going pulses, starting at V
RST
max and ending below
the programmed reset threshold by the magnitude indi-
cated (reset threshold overdrive). The graph shows the
maximum pulse width that a negative-going V
CC
tran-
sient may typically have without causing a reset pulse
to be issued. As the transient amplitude increases (i.e.,
goes farther below the reset threshold), the maximum
allowable pulse width decreases. A 0.1µF bypass
capacitor mounted close to V
CC
provides additional
transient immunity.
Manual-Reset Input
Many µP-based products require manual-reset capa-
bility, allowing the operator, a test technician, or exter-
nal logic circuitry to initiate a reset. A logic low on
MR
asserts reset. Reset remains asserted while
MR
is low,
and for the reset active timeout period after
MR
returns high.
www.maximintegrated.com
Maxim Integrated | 4
MAX6315
Open-Drain SOT µP Reset Circuit
Ordering Information (continued)
PART
†
MAX6315US49D1-T
MAX6315US48D1-T
MAX6315US47D1-T
MAX6315US46D1-T
MAX6315US45D1-T
MAX6315US44D1-T
†††
MAX6315US43D1-T
MAX6315US42D1-T
MAX6315US41D1-T
MAX6315US40D1-T
MAX6315US39D1-T
MAX6315US38D1-T
MAX6315US37D1-T
MAX6315US36D1-T
MAX6315US35D1-T
MAX6315US34D1-T
MAX6315US33D1-T
MAX6315US32D1-T
MAX6315US31D1-T
MAX6315US30D1-T
MAX6315US29D1-T
MAX6315US28D1-T
MAX6315US27D1-T
MAX6315US26D1-T
†††
MAX6315US25D1-T
NOMINAL
V
TH
(V)
4.90
4.80
4.70
4.63
4.50
4.39
4.30
4.20
4.10
4.00
3.90
3.80
3.70
3.60
3.50
3.40
3.30
3.20
3.08
3.00
2.93
2.80
2.70
2.63
2.50
MIN t
RP
(ms)
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
TOP
MARK
††
FY_ _
FZ_ _
GA_ _
GB_ _
GC_ _
GD_ _
GE_ _
GF_ _
GG_ _
GH_ _
GI_ _
GJ_ _
GK_ _
GL_ _
GM_ _
GN_ _
GO_ _
GP_ _
GQ_ _
GR_ _
GS_ _
GT_ _
GU_ _
GV_ _
GW_ _
PART
†
MAX6315US50D2-T
MAX6315US49D2-T
MAX6315US48D2-T
MAX6315US47D2-T
MAX6315US46D2-T
MAX6315US45D2-T
MAX6315US44D2-T
†††
MAX6315US43D2-T
MAX6315US42D2-T
MAX6315US41D2-T
MAX6315US40D2-T
MAX6315US39D2-T
MAX6315US38D2-T
MAX6315US37D2-T
MAX6315US36D2-T
MAX6315US35D2-T
MAX6315US34D2-T
MAX6315US33D2-T
MAX6315US32D2-T
MAX6315US31D2-T
MAX6315US30D2-T
MAX6315US29D2-T
MAX6315US28D2-T
MAX6315US27D2-T
MAX6315US26D2-T
†††
MAX6315US25D2-T
NOMINAL
V
TH
(V)
5.00
4.90
4.80
4.70
4.63
4.50
4.39
4.30
4.20
4.10
4.00
3.90
3.80
3.70
3.60
3.50
3.40
3.30
4.20
3.08
3.00
2.93
2.80
2.70
2.63
2.50
MIN t
RP
(ms)
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
TOP
MARK
††
GX_ _
GY_ _
GZ_ _
HA_ _
HB_ _
HC_ _
HD_ _
HE_ _
HF_ _
HG_ _
HH_ _
HI_ _
HJ_ _
HK_ _
HL_ _
HM_ _
HN_ _
HO_ _
HP_ _
HQ_ _
HR_ _
HS_ _
HT_ _
HU_ _
HV_ _
HW_ _
†
The MAX6315 is available in a SOT143 package, -40°C to +125°C temperature range.
††
The first two letters in the package top mark identify the part, while the remaining two letters are the lot tracking code.
†††
Sample stocks generally held on the bolded products; also, the bolded products have 2,500 piece minimum-order quantities.
Non-bolded products have 10,000 piece minimum-order quantities. Contact factory for details.
Devices are available in both leaded and lead(Pb)-free packaging. Specify lead-free by replacing “-T” with “+T” when ordering.
Note:
All devices available in tape-and-reel only. Contact factory for availability.
在全球半导体产业因景气不佳而纷传并购、整合之际，两大IT巨头三星、IBM日前却双双宣布，将强化半导体产业投资。 三星电子本周一宣布，已向韩国证券交易所提交一份申请文件，打算2008年投下10.5亿美元，用于升级内存芯片生产线、改进技术工艺，从而提高产能并降低成本。无独有偶。本周二IBM公司宣布，未来3年将投资10亿美元，用于扩充位于纽约州 East Fishkill 的半导体工厂，以消...[详细]
单片机
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
