Datasheet> 器件分类 > 模拟混合信号IC> 放大器电路> TS27L2ACN

TS27L2ACN: 产品描述Operational Amplifiers - Op Amps Dual Prec Low-Power; 产品类别模拟混合信号IC 放大器电路; 文件大小202KB，共9页; 制造商ST(意法半导体); 官网地址http://www.st.com/; 标准

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TS27L2ACN概述

Operational Amplifiers - Op Amps Dual Prec Low-Power

TS27L2ACN规格参数

参数名称	属性值
Brand Name	STMicroelectronics
是否Rohs认证	符合
厂商名称	ST(意法半导体)
零件包装代码	DIP
包装说明	DIP, DIP8,.3
针数	8
Reach Compliance Code	compliant
ECCN代码	EAR99
放大器类型	OPERATIONAL AMPLIFIER
架构	VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB)	0.00015 µA
标称共模抑制比	80 dB
频率补偿	YES
最大输入失调电压	6500 µV
JESD-30 代码	R-PDIP-T8
JESD-609代码	e3
低-偏置	YES
低-失调	NO
微功率	YES
负供电电压上限
标称负供电电压 (Vsup)
功能数量	2
端子数量	8
最高工作温度	70 °C
最低工作温度
封装主体材料	PLASTIC/EPOXY
封装代码	DIP
封装等效代码	DIP8,.3
封装形状	RECTANGULAR
封装形式	IN-LINE
峰值回流温度（摄氏度）	NOT SPECIFIED
功率	NO
电源	5/10 V
可编程功率	NO
认证状态	Not Qualified
座面最大高度	5.08 mm
标称压摆率	0.04 V/us
最大压摆率	0.034 mA
供电电压上限	18 V
标称供电电压 (Vsup)	10 V
表面贴装	NO
技术	CMOS
温度等级	COMMERCIAL
端子面层	Matte Tin (Sn)
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
标称均一增益带宽	100 kHz
最小电压增益	45000
宽带	NO
宽度	7.62 mm

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TS27L2C,I,M

PRECISION VERY LOW POWER

CMOS DUAL OPERATIONAL AMPLIFIERS

VERY LOW POWER CONSUMPTION :

10µA/op

OUTPUT VOLTAGE CAN SWING TO

GROUND

EXCELLENT PHASE MARGIN ON

CAPACITIVE LOADS

STABLE AND LOW OFFSET VOLTAGE

THREE INPUT OFFSET VOLTAGE

SELECTIONS

DESCRIPTION

These devices are low cost, low power dual oper-

ational amplifiers designed to operate with single

or dual supplies. These operational amplifiers use

the ST silicon gate CMOS process allowing an ex-

cellent consumption-speed ratio. These series are

ideally suited for low consumption applications.

Three power consumptions are available allowing

to have always the best consumption-speed ratio:

DIP8

(Plastic Package)

SO8

(Plastic Micropackage)

TSSOP8

(Thin Shrink Small Outline Package)

= 10µA/amp.: TS27L2 (very low power)

= 150µA/amp.: TS27M2 (low power)

= 1mA/amp.: TS272 (standard)

These CMOS amplifiers offer very high input im-

pedance and extremely low input currents. The

major advantage versus JFET devices is the very

low input currents drift with temperature (see fig-

ure 2).

ORDER CODE

Package

Part Number

Temperature Range

TS27L2C/AC/BC

0°C, +70°C

TS27L2I/AI/BI

-40°C, +125°C

TS27L2M/AM/BM

-55°C, +125°C

Example :

TS27L2ACN

•

PIN CONNECTIONS

(top view)

N =

Dual in Line Package (DIP)

D =

Small Outline Package (SO) - also available in Tape & Reel (DT)

P =

Thin Shrink Small Outline Package (TSSOP) - only available

in Tape & Reel (PT)

1 - Output 1

2 - Inverting Input 1

3 - Non-inverting Input 1

4 - V

5 - Non-inverting Input 2

6 - Inverting Input 2

7 - Output 2

8 - V

November 2001

1/9

TS27L2ACN相似产品对比

	TS27L2ACN	TS27L2AID	TS27L2IPT	TS27L2ACDT	TS27L2AIDT	TS27L2BIPT	TS27L2IDT	TS27L2BCDT	TS27L2CN	TS27L2BID
描述	Operational Amplifiers - Op Amps Dual Prec Low-Power	Operational Amplifiers - Op Amps Dual Prec Low-Power	LDO Voltage Regulators 300mA Low Quiescent Crnt low noise LDO		PCBs u0026 Breadboards SOIC to DIP adpt 0.7in DIP spacing	Operational Amplifiers - Op Amps Dual Prec Low-Power	Operational Amplifiers - Op Amps Dual Prec Low-Power	Precision Amplifiers PRCISION VERY Lo Pwr CMOS DUAL OP AMPS	Operational Amplifiers - Op Amps Dual Prec Low-Power	Operational Amplifiers - Op Amps Dual Prec Low-Power
Brand Name	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
零件包装代码	DIP	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	DIP	SOIC
包装说明	DIP, DIP8,.3	SOP, SOP8,.25	TSSOP, TSSOP8,.25	SOP, SOP8,.25	SOP, SOP8,.25	TSSOP, TSSOP8,.25	SOP, SOP8,.25	SOP, SOP8,.25	DIP, DIP8,.3	SOP, SOP8,.25
针数	8	8	8	8	8	8	8	8	8	8
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	not_compliant	compliant
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
放大器类型	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
架构	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB)	0.00015 µA	0.0003 µA	0.0003 µA	0.00015 µA	0.0003 µA	0.0003 µA	0.0003 µA	0.00015 µA	0.00015 µA	0.0003 µA
标称共模抑制比	80 dB	80 dB	80 dB	80 dB	80 dB	80 dB	80 dB	80 dB	80 dB	80 dB
频率补偿	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
最大输入失调电压	6500 µV	6500 µV	12000 µV	6500 µV	6500 µV	3500 µV	12000 µV	3000 µV	12000 µV	3500 µV
JESD-30 代码	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8	R-PDSO-G8
JESD-609代码	e3	e4	e4	e4	e4	e4	e4	e4	e3	e4
低-偏置	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
低-失调	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
微功率	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
功能数量	2	2	2	2	2	2	2	2	2	2
端子数量	8	8	8	8	8	8	8	8	8	8
最高工作温度	70 °C	125 °C	125 °C	70 °C	125 °C	125 °C	125 °C	70 °C	70 °C	125 °C
最低工作温度	-	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C	-	-	-40 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	DIP	SOP	TSSOP	SOP	SOP	TSSOP	SOP	SOP	DIP	SOP
封装等效代码	DIP8,.3	SOP8,.25	TSSOP8,.25	SOP8,.25	SOP8,.25	TSSOP8,.25	SOP8,.25	SOP8,.25	DIP8,.3	SOP8,.25
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE
峰值回流温度（摄氏度）	NOT SPECIFIED	260	260	260	260	260	260	260	NOT SPECIFIED	260
功率	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
电源	5/10 V	5/10 V	5/10 V	5/10 V	5/10 V	5/10 V	5/10 V	5/10 V	5/10 V	5/10 V
可编程功率	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	5.08 mm	1.75 mm	1.2 mm	1.75 mm	1.75 mm	1.2 mm	1.75 mm	1.75 mm	5.08 mm	1.75 mm
标称压摆率	0.04 V/us	0.04 V/us	0.04 V/us	0.04 V/us	0.04 V/us	0.04 V/us	0.04 V/us	0.04 V/us	0.04 V/us	0.04 V/us
最大压摆率	0.034 mA	0.036 mA	0.036 mA	0.034 mA	0.036 mA	0.036 mA	0.036 mA	0.034 mA	0.034 mA	0.036 mA
供电电压上限	18 V	18 V	18 V	18 V	18 V	18 V	18 V	18 V	18 V	18 V
标称供电电压 (Vsup)	10 V	10 V	10 V	10 V	10 V	10 V	10 V	10 V	10 V	10 V
表面贴装	NO	YES	YES	YES	YES	YES	YES	YES	NO	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	AUTOMOTIVE	AUTOMOTIVE	COMMERCIAL	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	COMMERCIAL	COMMERCIAL	AUTOMOTIVE
端子面层	Matte Tin (Sn)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Matte Tin (Sn) - annealed	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	GULL WING
端子节距	2.54 mm	1.27 mm	0.65 mm	1.27 mm	1.27 mm	0.65 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	30	10	30	30	10	30	30	NOT SPECIFIED	30
标称均一增益带宽	100 kHz	100 kHz	100 kHz	100 kHz	100 kHz	100 kHz	100 kHz	100 kHz	100 kHz	100 kHz
最小电压增益	45000	40000	40000	45000	40000	40000	40000	45000	45000	40000
宽带	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
宽度	7.62 mm	3.9 mm	3 mm	3.9 mm	3.9 mm	3 mm	3.9 mm	3.9 mm	7.62 mm	3.9 mm
是否Rohs认证	符合	符合	-	-	符合	符合	符合	符合	符合	符合
厂商名称	ST(意法半导体)	-	ST(意法半导体)	ST(意法半导体)	-	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)
Factory Lead Time	-	25 weeks	12 weeks	10 weeks	10 weeks	-	10 weeks	-	43 weeks 2 days	-
长度	-	4.9 mm	4.4 mm	4.9 mm	4.9 mm	4.4 mm	4.9 mm	4.9 mm	-	4.9 mm
湿度敏感等级	-	1	1	1	1	1	1	1	-	1
包装方法	-	-	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	-	-