EVALUATION KIT AVAILABLE
MAX11102/03/05/06/10/11/15/16/17
2Msps/3Msps, Low-Power,
Serial 12-/10-/8-Bit ADCs
General Description
The MAX11102/MAX11103/MAX11105/MAX11106/
MAX11110/MAX11111/MAX11115/MAX11116/
MAX11117 are 12-/10-/8-bit, compact, high-speed, low-
power, successive approximation analog-to-digital con-
verters (ADCs). These high-performance ADCs include a
high-dynamic range sample-and-hold and a high-speed
serial interface. These ADCs accept a full-scale input
from 0V to the power supply or to the reference voltage.
The MAX11102/MAX11103/MAX11106/MAX11111 fea-
ture dual, single-ended analog inputs connected to the
ADC core using a 2:1 MUX. The devices also include a
separate supply input for data interface and a dedicated
input for reference voltage. In contrast, the single-chan-
nel devices generate the reference voltage internally
from the power supply.
These
ADCs
operate from a 2.2V to 3.6V supply and
consume only 5.2mW at 3Msps and 3.7mW at
2Msps.
The devices include full power-down mode and fast
wake-up for optimal power management and a high-
speed 3-wire serial interface. The 3-wire serial interface
directly connects to SPI, QSPIK, and MICROWIRE
®
devices without external logic.
Excellent dynamic performance, low voltage, low power,
ease of use, and small package size make these con-
verters ideal for portable battery-powered data-acquisi-
tion applications, and for other applications that demand
low-power consumption and minimal space.
These ADCs are available in a 10-pin TDFN package,
10-pin
FMAX
®
package, and a 6-pin SOT23 package.
These devices operate over the -40NC to +125NC tem-
perature range.
S
12-/10-/8-Bit Resolution
S
1-/2-Channel, Single-Ended Analog Inputs
S
Low-Noise 73dB SNR
S
Variable I/O: 1.5V to 3.6V (Dual-Channel Only)
Allows the Serial Interface to Connect Directly
to 1.5V, 1.8V, 2.5V, or 3V Digital Systems
S
2.2V to 3.6V Supply Voltage
S
Low Power
3.7mW at 2Msps
5.2mW at 3Msps
Very Low Power Consumption at 2.5µA/ksps
S
External Reference Input (Dual-Channel Devices Only)
S
1.3µA Power-Down Current
S
SPI-/QSPI-/MICROWIRE-Compatible Serial
Interface
S
10-Pin, 3mm x 3mm TDFN Package
S
10-Pin, 3mm x 5mm µMAX Package
S
6-Pin, 2.8mm x 2.9mm SOT23 Package
S
Wide -40NC to +125NC Operation
Features
S
2Msps/3Msps Conversion Rate, No Pipeline Delay
Applications
Data Acquisition
Portable Data Logging
Medical Instrumentation
Battery-Operated Systems
Communication Systems
Automotive Systems
Ordering Information
PART
MAX11102AUB+
MAX11102AUB/V+
MAX11102ATB+
MAX11103AUB+
MAX11103ATB+
PIN-PACKAGE
10
FMAX-EP*
10
FMAX-EP*
10 TDFN-EP*
10
FMAX-EP*
10 TDFN-EP*
BITS
12
12
12
12
12
SPEED (Msps)
2
2
2
3
3
NO. OF CHANNELS
2
2
2
2
2
TOP MARK
+ABBA
+ABBR
+AWI
+AAAU
+AWV
Ordering Information continued at end of data sheet.
Note:
All devices are specified over the -40°C to +125°C operating temperature range.
+Denotes
a lead(Pb)-free/RoHS-compliant package.
*EP
= Exposed pad.
QSPI is a trademark of Motorola, Inc.
MICROWIRE is a registered trademark of National Semiconductor Corp.
µMAX is a registered trademark of Maxim Integrated Products, Inc.
For pricing, delivery, and ordering information, please contact Maxim Direct
at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com.
19-5245; Rev 8; 7/13
MAX11102/03/05/06/10/11/15/16/17
2Msps/3Msps, Low-Power,
Serial 12-/10-/8-Bit ADCs
ABSOLUTE MAXIMUM RATINGS
VDD to GND ............................................................-0.3V to +4V
REF, OVDD, AIN1, AIN2, AIN to GND ........-0.3V to the lower of
(V
DD
+ 0.3V) and +4V
CS,
SCLK, CHSEL, DOUT TO GND ............-0.3V to the lower of
(V
OVDD
+ 0.3V) and +4V
AGND to GND ......................................................-0.3V to +0.3V
Input/Output Current (all pins) ...........................................50mA
Continuous Power Dissipation (T
A
= +70NC)
6-Pin SOT23 (derate 8.7mW/NC above +70NC) ...........696mW
10-Pin TDFN (derate 24.4mW/NC above +70NC) .......1951mW
10-Pin
FMAX
(derate 8.8mW/NC above +70NC)........707.3mW
Operating Temperature Range ....................... .-40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS (MAX11102/MAX11103)
(V
DD
= 2.2V to 3.6V, V
REF
= V
DD
, V
OVDD
= V
DD
. MAX11102: f
SCLK
= 32MHz, 50% duty cycle, 2Msps. MAX11103: f
SCLK
= 48MHz,
50% duty cycle, 3Msps. C
DOUT
= 10pF, T
A
= -40NC to +125NC, unless otherwise noted. Typical values are at T
A
= +25NC.)
PARAMETER
DC ACCURACY
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Gain Error
Total Unadjusted Error
Channel-to-Channel Offset
Matching
Channel-to-Channel Gain
Matching
DYNAMIC PERFORMANCE (MAX11103: f
AIN_
= 1MHz, MAX11102: f
AIN_
= 0.5MHz)
MAX11103
Signal-to-Noise and Distortion
SINAD
MAX11102
Signal-to-Noise Ratio
Total Harmonic Distortion
Spurious-Free Dynamic Range
Intermodulation Distortion
Full-Power Bandwidth
Full-Linear Bandwidth
Small-Signal Bandwidth
Crosstalk
SNR
THD
SFDR
IMD
MAX11103
MAX11102
MAX11103
MAX11102
MAX11103
MAX11102
MAX11103: f
1
= 1.0003MHz, f
2
= 0.99955MHz
MAX11102: f
1
= 500.15kHz, f
2
= 499.56kHz
-3dB point
SINAD > 68dB
76
77
70
70
70.5
70.5
INL
DNL
OE
GE
TUE
Excluding offset and reference errors
No missing codes
Q0.3
Q1
Q1.5
Q0.4
Q0.05
12
Q1
Q1
Q3
Q3
Bits
LSB
LSB
LSB
LSB
LSB
LSB
LSB
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
72
72.5
72
73
-85
-85
85
85
-84
40
2.5
45
-90
-75
-76
dB
dB
dB
dB
dB
MHz
MHz
MHz
dB
2
Maxim Integrated
MAX11102/03/05/06/10/11/15/16/17
2Msps/3Msps, Low-Power,
Serial 12-/10-/8-Bit ADCs
ELECTRICAL CHARACTERISTICS (MAX11102/MAX11103) (continued)
(V
DD
= 2.2V to 3.6V, V
REF
= V
DD
, V
OVDD
= V
DD
. MAX11102: f
SCLK
= 32MHz, 50% duty cycle, 2Msps. MAX11103: f
SCLK
= 48MHz,
50% duty cycle, 3Msps. C
DOUT
= 10pF, T
A
= -40NC to +125NC, unless otherwise noted. Typical values are at T
A
= +25NC.)
PARAMETER
CONVERSION RATE
Throughput
Conversion Time
Acquisition Time
Aperture Delay
Aperture Jitter
Serial-Clock Frequency
ANALOG INPUT (AIN1, AIN2)
Input Voltage Range
Input Leakage Current
Input Capacitance
V
AIN_
I
ILA
C
AIN_
Track
Hold
0
0.002
20
4
V
DD
+
0.05
0.005
5
0.75 x
V
OVDD
0.25 x
V
OVDD
0.15 x
V
OVDD
Inputs at GND or V
DD
0.001
2
0.85 x
V
OVDD
0.15 x
V
OVDD
Q1.0
4
Q1
Q1
V
REF
Q1
V
FA
pF
f
CLK
MAX11103
MAX11102
0.48
0.32
t
ACQ
From
CS
falling edge
MAX11103
MAX11102
MAX11103
MAX11102
0.03
0.02
260
391
52
4
15
48
32
3
2
Msps
ns
ns
ns
ps
MHz
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
EXTERNAL REFERENCE INPUT (REF)
Reference Input-Voltage Range
Reference Input Leakage
Current
Reference Input Capacitance
V
REF
I
ILR
C
REF
Conversion stopped
1
V
FA
pF
DIGITAL INPUTS (SCLK,
CS,
CHSEL)
Digital Input High Voltage
Digital Input Low Voltage
Digital Input Hysteresis
Digital Input Leakage Current
Digital Input Capacitance
DIGITAL OUTPUT (DOUT)
Output High Voltage
Output Low Voltage
High-Impedance Leakage
Current
High-Impedance Output
Capacitance
V
OH
V
OL
I
OL
C
OUT
I
SOURCE
= 200FA
I
SINK
= 200FA
V
V
FA
pF
V
IH
V
IL
V
HYST
I
IL
C
IN
V
V
V
FA
pF
Maxim Integrated
3
MAX11102/03/05/06/10/11/15/16/17
2Msps/3Msps, Low-Power,
Serial 12-/10-/8-Bit ADCs
ELECTRICAL CHARACTERISTICS (MAX11102/MAX11103) (continued)
(V
DD
= 2.2V to 3.6V, V
REF
= V
DD
, V
OVDD
= V
DD
. MAX11102: f
SCLK
= 32MHz, 50% duty cycle, 2Msps. MAX11103: f
SCLK
= 48MHz,
50% duty cycle, 3Msps. C
DOUT
= 10pF, T
A
= -40NC to +125NC, unless otherwise noted. Typical values are at T
A
= +25NC.)
PARAMETER
POWER SUPPLY
Positive Supply Voltage
Digital I/O Supply Voltage
Positive Supply Current
(Full-Power Mode)
Positive Supply Current (Full-
Power Mode), No Clock
Power-Down Current
Line Rejection
TIMING CHARACTERISTICS (Note 1)
Quiet Time
CS
Pulse Width
CS
Fall to SCLK Setup
CS
Falling Until DOUT High-
Impedance Disabled
Data Access Time After SCLK
Falling Edge
SCLK Pulse Width Low
SCLK Pulse Width High
Data Hold Time From SCLK
Falling Edge
SCLK Falling Until DOUT High-
Impedance
Power-Up Time
t
Q
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
(Note 2)
(Note 2)
(Note 2)
(Note 2)
Figure 2, V
OVDD
= 2.2V - 3.6V
Figure 2, V
OVDD
= 1.5V - 2.2V
Percentage of clock period (Note 2)
Percentage of clock period (Note 2)
Figure 3
Figure 4 (Note 2)
Conversion cycle (Note 2)
40
40
5
2.5
14
1
4
10
5
1
15
16.5
60
60
ns
ns
ns
ns
ns
%
%
ns
ns
Cycle
V
DD
V
OVDD
I
VDD
I
OVDD
I
VDD
I
PD
MAX11103, V
AIN_
= V
GND
MAX11102, V
AIN_
= V
GND
MAX11103, V
AIN_
= V
GND
MAX11102, V
AIN_
= V
GND
MAX11103
MAX11102
Leakage only
V
DD
= +2.2V to +3.6V, V
REF
= 2.2V
1.98
1.48
1.3
0.7
10
2.2
1.5
3.6
V
DD
3.3
2.6
0.33
0.22
mA
FA
LSB/V
mA
V
V
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
ELECTRICAL CHARACTERISTICS (MAX11105)
(V
DD
= 2.2V to 3.6V, f
SCLK
= 32MHz, 50% duty cycle, 2Msps, C
DOUT
= 10pF, T
A
= -40NC to +125NC, unless otherwise noted. Typical
values are at T
A
= +25NC.)
PARAMETER
DC ACCURACY
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Gain Error
Total Unadjusted Error
DYNAMIC PERFORMANCE
Signal-to-Noise and Distortion
Signal-to-Noise Ratio
4
SYMBOL
CONDITIONS
MIN
12
TYP
MAX
UNITS
Bits
INL
DNL
OE
GE
TUE
SINAD
SNR
f
AIN
= 500kHz
f
AIN
= 500kHz
70
70.5
Excluding offset and reference errors
No missing codes
Q0.3
Q1
Q1.5
72.5
73
Q1
Q1
Q3
Q3
LSB
LSB
LSB
LSB
LSB
dB
dB
Maxim Integrated
MAX11102/03/05/06/10/11/15/16/17
2Msps/3Msps, Low-Power,
Serial 12-/10-/8-Bit ADCs
ELECTRICAL CHARACTERISTICS (MAX11105) (continued)
(V
DD
= 2.2V to 3.6V, f
SCLK
= 32MHz, 50% duty cycle, 2Msps, C
DOUT
= 10pF, T
A
= -40NC to +125NC, unless otherwise noted. Typical
values are at T
A
= +25NC.)
PARAMETER
Total Harmonic Distortion
Spurious-Free Dynamic Range
Intermodulation Distortion
Full-Power Bandwidth
Full-Linear Bandwidth
Small-Signal Bandwidth
CONVERSION RATE
Throughput
Conversion Time
Acquisition Time
Aperture Delay
Aperture Jitter
Serial Clock Frequency
ANALOG INPUT
Input Voltage Range
Input Leakage Current
Input Capacitance
V
AIN
I
ILA
C
AIN
Track
Hold
0.75 x
V
VDD
0.25 x
V
VDD
0.15 x
V
VDD
Inputs at GND or V
DD
0.001
2
0.85 x
V
VDD
0.15 x
V
VDD
Q1.0
4
Q1
0
0.002
20
4
V
DD
Q1
V
FA
pF
f
CLK
0.32
t
ACQ
From
CS
falling edge
0.02
391
52
4
15
32
2
Msps
ns
ns
ns
ps
MHz
SYMBOL
THD
SFDR
IMD
f
AIN
= 500kHz
f
AIN
= 500kHz
f
1
= 500.15 kHz, f
2
= 499.56 kHz
-3dB point
SINAD > 68dB
77
CONDITIONS
MIN
TYP
-85
85
-84
40
2.5
45
MAX
-76
UNITS
dB
dB
dB
MHz
MHz
MHz
DIGITAL INPUTS (SCLK,
CS,
CHSEL)
Digital Input High Voltage
Digital Input Low Voltage
Digital Input Hysteresis
Digital Input Leakage Current
Digital Input Capacitance
DIGITAL OUTPUT (DOUT)
Output High Voltage
Output Low Voltage
High-Impedance Leakage
Current
High-Impedance Output
Capacitance
POWER SUPPLY
Positive Supply Voltage
Positive Supply Current
(Full-Power Mode)
V
DD
I
VDD
V
AIN
= V
GND
2.2
3.6
2.6
V
mA
V
OH
V
OL
I
OL
C
OUT
I
SOURCE
= 200FA
I
SINK
= 200FA
V
V
FA
pF
V
IH
V
IL
V
HYST
I
IL
C
IN
V
V
V
FA
pF
Maxim Integrated
5
FPGA/CPLD
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