CPLD - Complex Programmable Logic Devices CPLD - MAX 9000 560 Macro 216 IOs
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | BGA |
| 包装说明 | BGA-356 |
| 针数 | 356 |
| Reach Compliance Code | not_compliant |
| 其他特性 | 560 MACROCELLS; 35 LABS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V |
| 最大时钟频率 | 144.9 MHz |
| 系统内可编程 | YES |
| JESD-30 代码 | S-PBGA-B356 |
| JESD-609代码 | e0 |
| JTAG BST | YES |
| 长度 | 35 mm |
| 湿度敏感等级 | 3 |
| 专用输入次数 | |
| I/O 线路数量 | 216 |
| 宏单元数 | 560 |
| 端子数量 | 356 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 0 DEDICATED INPUTS, 216 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LBGA |
| 封装等效代码 | BGA356,26X26,50 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE |
| 峰值回流温度（摄氏度） | 220 |
| 电源 | 3.3/5,5 V |
| 可编程逻辑类型 | EE PLD |
| 传播延迟 | 11.4 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.63 mm |
| 最大供电电压 | 5.25 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn63Pb37) |
| 端子形式 | BALL |
| 端子节距 | 1.27 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 35 mm |
| Base Number Matches | 1 |
| EPM9560ABC356-10 | EPM9560ARC208-10N | EPM9320LC84-15 | EPM9560RC240-15 | EPM9560ARC240-10N | EPM9320LI84-20 | |
|---|---|---|---|---|---|---|
| 描述 | CPLD - Complex Programmable Logic Devices CPLD - MAX 9000 560 Macro 216 IOs | Multilayer Ceramic Capacitors MLCC - SMD/SMT 10uF 20% 10Volts | Modulator / Demodulator Wideband Integ Demod with PLL and VCO | CPLD - Complex Programmable Logic Devices CPLD - MAX 9000 560 Macro 191 IOs | CPLD - Complex Programmable Logic Devices CPLD - MAX 9000 560 Macro 191 IOs | CPLD - Complex Programmable Logic Devices CPLD - MAX 9000 320 Macro 60 IOs |
| 是否无铅 | 含铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 | 符合 | 不符合 |
| 零件包装代码 | BGA | QFP | LCC | QFP | QFP | LCC |
| 包装说明 | BGA-356 | FQFP, | PLASTIC, LCC-84 | POWER, RQFP-240 | FQFP, | PLASTIC, LCC-84 |
| 针数 | 356 | 208 | 84 | 240 | 240 | 84 |
| Reach Compliance Code | not_compliant | compliant | unknown | unknown | compliant | unknown |
| 其他特性 | 560 MACROCELLS; 35 LABS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 560 MACROCELLS; 35 LABS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 484 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 560 MACROCELLS; 35 LABS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 484 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V |
| 最大时钟频率 | 144.9 MHz | 144.9 MHz | 117.6 MHz | 117.6 MHz | 144.9 MHz | 100 MHz |
| JESD-30 代码 | S-PBGA-B356 | S-PQFP-G208 | S-PQCC-J84 | S-PQFP-G240 | S-PQFP-G240 | S-PQCC-J84 |
| JESD-609代码 | e0 | e2 | e0 | e0 | e3 | e0 |
| 长度 | 35 mm | 28 mm | 29.3116 mm | 32 mm | 32 mm | 29.3116 mm |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 |
| I/O 线路数量 | 216 | 153 | 60 | 191 | 191 | 60 |
| 端子数量 | 356 | 208 | 84 | 240 | 240 | 84 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C |
| 组织 | 0 DEDICATED INPUTS, 216 I/O | 0 DEDICATED INPUTS, 153 I/O | 0 DEDICATED INPUTS, 60 I/O | 0 DEDICATED INPUTS, 191 I/O | 0 DEDICATED INPUTS, 191 I/O | 0 DEDICATED INPUTS, 60 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LBGA | FQFP | QCCJ | FQFP | FQFP | QCCJ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE | FLATPACK, FINE PITCH | CHIP CARRIER | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 220 | 245 | 220 | 220 | 245 | 220 |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 11.4 ns | 11.4 ns | 16 ns | 16.6 ns | 11.4 ns | 23 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.63 mm | 4.1 mm | 5.08 mm | 4.1 mm | 4.1 mm | 5.08 mm |
| 最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V |
| 最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn63Pb37) | Matte Tin/Copper (Sn/Cu) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | MATTE TIN (472) OVER COPPER | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | GULL WING | J BEND | GULL WING | GULL WING | J BEND |
| 端子节距 | 1.27 mm | 0.5 mm | 1.27 mm | 0.5 mm | 0.5 mm | 1.27 mm |
| 端子位置 | BOTTOM | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 40 | 30 | 30 | 40 | 30 |
| 宽度 | 35 mm | 28 mm | 29.3116 mm | 32 mm | 32 mm | 29.3116 mm |
| 系统内可编程 | YES | - | YES | YES | - | YES |
| JTAG BST | YES | - | YES | YES | - | YES |
| 宏单元数 | 560 | - | 320 | 560 | - | 320 |
| 封装等效代码 | BGA356,26X26,50 | - | LDCC84,1.2SQ | HQFP240,1.37SQ,20 | - | LDCC84,1.2SQ |
| 电源 | 3.3/5,5 V | - | 3.3/5,5 V | 3.3/5,5 V | - | 3.3/5,5 V |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
