FYP1004DN
FYP1004DN
Features
• Low forward voltage drop
• High frequency properties and switching speed
• Guard ring for over-voltage protection
Applications
• Switched mode power supply
• Freewheeling diodes
1
2 3
TO-220
1. Anode 2.Cathode 3. Anode
SCHOTTKY BARRIER RECTIFIER
Absolute Maximum Ratings
T
C
=25°C unless otherwise noted
°
Symbol
V
RRM
V
R
I
F(AV)
I
FSM
T
J,
T
STG
Parameter
Maximum Repetitive Reverse Voltage
Maximum DC Reverse Voltage
Average Rectified Forward Current
@ T
C
= 137°C
Non-repetitive Peak Surge Current (per diode)
60Hz Single Half-Sine Wave
Operating Junction and Storage Temperature
Value
40
40
10
80
-65 to +150
Units
V
V
A
A
°C
Thermal Characteristics
Symbol
R
θJC
Parameter
Maximum Thermal Resistance, Junction to Case (per diode)
Value
3.0
Units
°C/W
Electrical Characteristics
(per diode)
Symbol
V
FM
*
Parameter
Maximum Instantaneous Forward Voltage
I
F
= 5A
I
F
= 5A
I
F
= 10A
I
F
= 10A
Maximum Instantaneous Reverse Current
@ rated V
R
Value
T
C
= 25
°C
T
C
= 125
°C
T
C
= 25
°C
T
C
= 125
°C
T
C
= 25
°C
T
C
= 125
°C
0.55
0.49
0.67
0.65
mA
1
40
Units
V
I
RM
*
* Pulse Test: Pulse Width=300µs, Duty Cycle=2%
©2001 Fairchild Semiconductor Corporation
Rev. A, March 2001
FYP1004DN
Typical Characteristics
100
T
J
=150 C
10
o
Reverse Current, I
R
[mA]
10
Forward Current, I
F
[A]
T
J
=125 C
o
1
T
J
=75 C
0.1
o
1
T
J
=125 C
0.1
o
T
J
=75 C
T
J
=25 C
o
o
0.01
T
J
=25 C
o
0.001
0.01
0.0
0.5
1.0
1.5
0
10
20
30
40
Forward Voltage Drop, V
F
[V]
Reverse Voltage, V
R
[V]
Figure 1. Typical Forward Voltage Characteristics
(per diode)
Figure 2. Typical Reverse Current
vs. Reverse Voltage (per diode)
700
o
10
Junction Capacitance, C
J
[pF]
500
400
300
T
J
=25 C
200
Transient Thermal Impedance [
o
C/W]
1
100µ
600
100
90
80
0
10
20
30
40
1m
10m
100m
1
10
Reverse Voltage, V
R
[V]
Pulse Duration [s]
Figure 3. Typical Junction Capacitance
(per diode)
Figure 4. Thermal Impedance Characteristics
(per diode)
12
100
10
Max. Forward Surge Current, I
FSM
[A]
60
80
100
o
Average Forward Current, I
F(AV)
[A]
80
8
60
6
40
4
2
Square Wave
Duty Cycle=0.5
20
0
0
20
40
120
140
160
0
1
10
100
Case Temperature, T
C
[ C]
Number of Cycles @ 60Hz
Figure 5. Forward Current Derating Curve
Figure 6. Non-Repetive Sureg Current
(per diode)
©2001 Fairchild Semiconductor Corporation
Rev. A, March 2001
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
ACEx™
Bottomless™
CoolFET™
CROSSVOLT™
DenseTrench™
DOME™
EcoSPARK™
E
2
CMOS™
EnSigna™
FACT™
FACT Quiet Series™
DISCLAIMER
FAST
®
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ISOPLANAR™
LittleFET™
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MICROWIRE™
OPTOLOGIC™
OPTOPLANAR™
PACMAN™
POP™
PowerTrench
®
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SLIENT SWITCHER
®
SMART START™
Star* Power™
Stealth™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
UHC™
UltraFET
®
VCX™
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PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
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NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTENAPPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Advance Information
Product Status
Formative or In
Design
First Production
Definition
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Preliminary
No Identification Needed
Full Production
Obsolete
Not In Production
©2001 Fairchild Semiconductor Corporation
Rev. H1
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