SPECIFICATION
To
SPEC. No.
D A T E : 2013 Feb.
Non-Controlled Copy
CUSTOMER’S PRODUCT NAME
TDK’S PRODUCT NAME
WOUND/STD INDUCTOR,
MAGNETIC SHIELDED
LGJ7045TS-H SERIES HIGH RELIABILITY
GRADE – See section 1 on page 1 for
Important Product Information
ALL ORDERS FOR THIS PRODUCT ARE SUBJECT TO THE TERMS AND CONDITIONS OF THIS
SPECIFICATION
DATE:
YEAR
MONTH
DAY
TDK Corporation
Sales
Electronic Components
Sales & Marketing Group
TDK-EPC Corporation
Engineering
Magnetics Business Group
APPROVED
Person in Charge
APPROVED
CHECKED
Person in Charge
1. SCOPE AND MEANING OF “HIGH RELIABILITY” GRADE
This specification is applicable to WOUND STD INDUCTOR/MAGNETIC SHIELDED with a priority over the
other relevant specifications. Manufacturing places defined in this specification shall be TDK-EPC
Corporation Japan, and TDK Components USA. Inc.
“High Reliability Grade” means that TDK's LGJ Series Inductors provide an extended life Inductor that meets
or exceedes the electrical, mechanical and environmental performance standards from AEC Q200 Rev.D.
Details are referenced within section 7 of this specification. It also means that, in addition to our highest
quality Inductor, the customer will also receive access to an on-line Sigma Report (Enhanced Certificate of
Compliance) and internet based product authentication for each lot (which includes electrical characterization
data, and estimated product life, as well as anti-counterfeit packaging).
Additionally RFID (radio frequency identification) tags are available as an option.
EXPLANATORY NOTE:
For warranty information, please refer to section 14 of this specification.
2. CODE CONSTRUCTION
(Example)
LGJ 7045 TS - 471 M R31 - H
(1)
(1) Series Name
(2) Dimension L x W x T (7045: 7.0mm x 7.0mm x 4.5mm)
(3) Packaging Style (TS: Tape & Reel)
(4) Inductance Value (3R3 = 3.3μH; 100 = 10μH)
(5) Inductance Tolerance (M:
±20%)
(6) Rated Current (2R5 = 2.5A; R90 = 0.90A)
(7) Operating Temperature Range (H: -40°C to +125°C)
(2)
(3)
(4) (5)
(6)
(7)
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1
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3. SHAPES AND DIMENSIONS/CIRCUIT DIAGRAM
Inductance print
Polarity
Marking
(st side)
Dimensions in mm
220
7.0
±0.2
①
②
③ ④
⑥
⑤
(4.9)
(
2-
St.
2-
7.0
±0.2
(0.10)
±0.3
4.5
( ) : Ref
No.
1
2
3
4
5
6
7
ITEM NAME
Drum core
Ring core
Winding wire
Glue
Base
Terminals
Solder
MATERIAL
Ferrite
Ferrite
Polyurethane enameled copper wire
Epoxy resin
Phenolic resin
Tin plated copper(t=0.1)
Lead free solder(Sn-2Cu)
Note: 1) It is acceptable even if adhesive is out of ring core, but it shouldn’t be out of base.
Note: 2) Even if the adhesives of an upper surface application have the portion which
has not been buried completely, they presuppose that it is possible.
4. CHARACTERISTICS
Temperature rise
Operating Temperature Range
Storage Temperature Range
Rated current
Application
: 20°C TYP.（IDC2)
: -40°C to +125°C (Including Self Temperature Rise)
: -40°C to +125°C
: Please see Section 5-1
Reflow soldering can be used for this product while wave-flow can not be used.
The condition in soldering by hand should confirm to the heat capacitance corresponding to the
test of resistance to soldering heat.
Equivalent Circuit
St.
̶
2
̶
2.0
0 . 9 )
Fin.
±0.1
5. ELECTRICAL CHARACTERISTICS
5-1. Electrical Specifications
Customer
Part Number
TDK Item
Description
LGJ7045TS-3R3M2R2-H
LGJ7045TS-4R7M2R1-H
LGJ7045TS-6R8M1R9-H
LGJ7045TS-100M1R8-H
LGJ7045TS-150M1R5-H
LGJ7045TS-220M1R3-H
LGJ7045TS-330M1R1-H
LGJ7045TS-470MR90-H
LGJ7045TS-680MR75-H
LGJ7045TS-101MR60-H
LGJ7045TS-151MR50-H
LGJ7045TS-221MR40-H
LGJ7045TS-331MR35-H
LGJ7045TS-471MR31-H
Inductance
L (μH)
at 100kHz
3.3±20%
4.7±20%
6.8±20%
10±20%
15±20%
22±20%
33±20%
47±20%
68±20%
100±20%
150±20%
220±20%
330±20%
470±20%
DC resistance
R
DC
(Ω)
0.028±20%
0.031±20%
0.039±20%
0.047±20%
0.068±20%
0.082±20%
0.120±20%
0.180±20%
0.270±20%
0.390±20%
0.550±20%
0.830±20%
1.15±20%
1.80±20%
*Rated Current (A)
I
DC1
MAX
2.20
2.10
1.90
1.80
1.50
1.30
1.10
0.90
0.75
0.60
0.50
0.40
0.35
0.31
I
DC2
TYPICAL
2.30
2.10
2.04
1.81
1.46
1.25
1.11
0.93
0.76
0.61
0.54
0.43
0.37
0.31
Marking
3R3
4R7
6R8
100
150
220
330
470
680
101
151
221
331
471
*Rated current : the less value which is IDC1 or IDC2.
(Current is D.C. current)
IDC1
：
Based on inductance change(△L:-10% MAX from initial L value.)
IDC2
：
Based on temperature rise(△T:20°C TYP.)
Test Instruments
L
: 4194A IMPEDANCE/GAIN-PHASE ANALYZER, HP OR EQUIV.
RDC
: MILLIOHM METER VP-2941A MATUSITA OR EQUIV.
L(IDC1)
: 4284A PRECISION LCR METER, HP with 42841A BIAS CURRENT
SOURCE, HP / 42842A TEST FIXTURE, HP OR EQUIV.
6. STORAGE TERMS AND CONDITIONS
6-1. Storage condition before mounting:
5°C to 30°C at 20 to 75% RH Max
Use within 6 months from delivery date
Solderability might be decreased if the period is exceeded.
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3
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7. PERFORMANCE
No.
1
Item
High Temperature
Exposure (Storage)
∆L/L0
≦±5%
Performance
There shall be no
mechanical damage.
125°C / 2000h
Test Condition / Inspection Method
MIL-STD-202 Method 108
2
Temperature Cycling
∆L/L0
≦±5%
There shall be no
mechanical damage.
JESD22 Method JA-104
-40/+125°C (Dwell 30min) / 2000cycles
3
Biased Humidity
∆L/L0
≦±5%
There shall be no
mechanical damage.
MIL-STD-202 Method 103
85°C 85%R.H. / 2000h
4
Operational Life
∆L/L0
≦±5%
There shall be no
mechanical damage.
MIL-PRF-27
105°C / 2000h
Current rating is energized.
MIL-STD-883 Method 2009
JESD22 Method JB-100
Length , Width , Height dimension
5
6
External Visual
Physical Dimensions
No Visual Damage
Section 3. Shapes and Dimensions
7
8
Resistance to Solvents
Mechanical Shock
No Visual Damage
∆L/L0
≦±5%
There shall be no
mechanical damage.
MIL-STD-202 Method 215
MIL-STD-202 Method 213 Method 213
Peak:100G Half-sine / Duration:6ms /
Number of times:6axis x 3times
MIL-STD-202 Method 204
10-2000Hz / 5G or 1.52mmP-P /
20 min x 12 cycles x 3axis
MIL-STD-202 Method 210
Test Type: Dip Solder: 260°C Dipping Time:10sec
9
Vibration
∆L/L0
≦±5%
There shall be no
mechanical damage.
10
Resistance to
Soldering Heat
∆L/L0
≦±5%
There shall be no
mechanical damage.
11
Solderability
Covered by New Solder
over 95%.
J-STD-002
Method B, 4hrs@235°C, category 3
J-STD-002
Method B, @215°C, category 3
12
Electrical
Characterization
∆L/L20°C
≦±15%
Inductance change rate based on 20°C
(-40½125°C)
13
Board Flex
∆L/L0
≦±5%
There shall be no
mechanical damage.
AEC-Q200-005
2mm / 60sec
14
Terminal Strength (SMD)
∆L/L0
≦±5%
There shall be no
mechanical damage.
AEC-Q200-006
17.7N / 60sec
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4
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