Under any conditions, the voltage of V1 will always be greater or equal to that of V2.
Output voltage (Note 1)
Over all conditions of I/P voltage,
load and temperature)
3.3 Vout (V2)
5.0 Vout (V1)
Output Voltage Setpoint
(Vi=48, Io
2
=9A, Io
3
=6A, Tc=25°C)
3.3 (V2)
5.0 (V1)
Output Ripple and Noise Voltage
(peak-to-peak, 100 MHz BW)
3.3 (V2)
5.0 (V1)
Output Current
(Total module O/P power should
not exceed 60 Watts)
3.3 (V2)
5.0 (V1)
Output Current Limit Inception
(Vo=95% of Vo nom)
3.3 (V2)
5.0 (V1)
Output Short Ckt Current
(Max impedance across short circuit = 65m:)
3.3 Vo
5.0 Vo
Efficiency (Vi=48V, Io
3
=9A,Io
5
=6A, Tc=70°C)
Dynamic Response
('Io/'t=0.2A/Psec.Vi=48V, Tc=25°C, either O/P)
Load change of 50% Io max; at any operating
load up to Iomax or Pomax Peak Deviation
outside settling point
K
Io
2
Io
1
_
_
_
_
15
12
A
A
3.3 Vo,set
5.0 Vo,set
2.450
3.310
2.510
3.390
Vdc
Vdc
3.3 Vo
5.0 Vo
2.375
3.225
_
_
2.555
3.450
Vdc
Vdc
_
_
_
_
_
_
60
80
mv p-p
mv p-p
Io
2
cli
Io
1
cli
19.0
12.5
16
16
11
90
21.0
13.5
19
19
14
90
23.0
15.0
22
22
17
_
A
A
A
A
A
%
–
–
2
_
%Vo nom
NOTE: 1. Worst case voltage conditions occur with full load drawn from one output only, zero being drawn from the other.
For worst case voltages at less extreme loading conditions, consult the factory.
www.murata-ps.com
Technical inquiries
-
email:
sales@murata-ps.com,
tel:
508 339 3000
TDC_VSX60XD35C.B02 Page 2 of 4
VSX60XD35C
60 Watt Dual Output Quarter Brick DC/DC Converter
PARAMETER
Isolation Specifications
Isolation Capacitance
Isolation Resistance
Feature Specifications
Remote On/Off (open collector equivalent,
signal referenced to -Vin terminal)
VSX60MD35C Preferred Logic (negative)
Logic Low - Module On
Logic High - Module Off
VSX60MD35-1C - Optional Logic (positive)
Logic Low - Module Off
Logic High - Module On
Logic Low: At Von/off = 0V
Turn On Time (Vo within 1% of steady state)
From Application of Vin
From Remote On/Off Activation)
SYMBOL
_
_
MIN
_
10
TYP
1000
_
MAX
_
_
UNITS
pF
M:
Von/off
Ion/off
_
_
0
_
_
50
200
10
4
Vdc
PA
mSecs
mSecs
_
_
7
3
GENERAL
Input Undervoltage Lockout
(Turn Off & Turn On Voltages Track)
Turn On
Turn Off
Input Overvoltage Lockout
(Turn Off & Turn On Voltages Track)
Turn Off
Turn On
Output Overvoltage Set Point
(Non-latching independent control loop)
2.5 Vo
3.3 Vo
Overtemperature
Weight
VSX60MD35C, VSX60MD35-1C
VSX60MD35-UC, VSX60MD35-1UC
Output Trim
Tie Trim to +2.5 Vo for trim down
Tie Trim to O/P RTN for trim up
2.5 V2
3.3 V1
2.5 V2
3.3 V1
Shutdown
Hysteresis
Tc
_
_
30
27
33
30
36
33
Vdc
Vdc
_
_
76
74.5
80
78.5
84
82.5
Vdc
Vdc
2.7
3.6
105
2.9
3.9
115
10
67
3.2
4.2
125
Vdc
Vdc
°C
°C
Grams
_
_
_
_
-10
-10
10
10
_
_
_
_
%
%
%
%
THROUGH-HOLE SOLDERING INFORMATION
These devices are intended for wave soldering or manual soldering.
They are not intended to be subject to surface mount processes under any circumstances.
The normal wave soldering process can be used with these devices where the device is subjected to a maximum wave temperature of 260°C for a period of
no more than 10 seconds. Within this time and temperature range, the integrity of the device’s plastic body will not be compromised and internal temperatures
within the converter will not exceed 175°C. Care should be taken to control manual soldering limits identical to that of wave soldering.
www.murata-ps.com
Technical inquiries
-
email:
sales@murata-ps.com,
tel:
508 339 3000
TDC_VSX60XD35C.B02 Page 3 of 4
VSX60XD35C
60 Watt Dual Output Quarter Brick DC/DC Converter
MECHANICAL
Dimensions are in inches (millimeters).
Tolerances: x.xx in. + 0.02 in.
x.xxx in. +0.01 in.
2.30
(58.42)
CASE OUTLINE
0.144 (3.66)
4 PLACES
1.50
(38.10)
.600
(15.24) .350
(8.89)
.000
.350
(8.89)
.750
(19.05)
1
2
3
7
6
5
4
.375 (9.53)
.125 (3.18)
.125 (3.18)
.375 (9.53)
0.051 (1.30)
7 PLACES
.600
(15.24)
.50
(12.70)
.145
(3.68)
.150
(3.81)
0.040 (1.02) 7 PLACES
2.000
(50.80)
RECOMMENDED PCB HOLE PATTERN
(VIEW OF PCB, THROUGH UNIT)
NOTES:
Pinout Key
1
2
3
4
5
6
7
+Vin
On/Off
-Vin
+2.5 Vout
O/P RTN
Trim
+3.3 Vout
1.
Marked with: specific model ordered, date code, job
code.
2.
MATERIAL: Units are encapsulated in a low thermal
resistance molding compound which has excellent
chemical resistance and electrical properties in high
humidity environments and over a wide operating
temperature range. The encapsulant and outer shell of
the unit have UL94V-0 ratings. Lead material is solder
plated to allow ease of solderability.
3. IMPORTANT:
When utilizing the PEM nuts for
board mounting, it is required to follow guidelines in
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