8,388,608-word x 40-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE
| MSC23840D | MSC23840D-60BS20 | MSC23840D-60DS20 | MSC23840D-XXBS20 | MSC23840D-70BS20 | MSC23840D-70DS20 | MSC23840D-XXDS20 | |
|---|---|---|---|---|---|---|---|
| 描述 | 8,388,608-word x 40-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 8,388,608-word x 40-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 8,388,608-word x 40-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 8,388,608-word x 40-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 8,388,608-word x 40-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 8,388,608-word x 40-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE | 8,388,608-word x 40-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE |
| 厂商名称 | - | OKI | OKI | - | OKI | OKI | - |
| 零件包装代码 | - | SIMM | SIMM | - | SIMM | SIMM | - |
| 针数 | - | 72 | 72 | - | 72 | 72 | - |
| Reach Compliance Code | - | unknown | unknow | - | unknow | unknow | - |
| ECCN代码 | - | EAR99 | EAR99 | - | EAR99 | EAR99 | - |
| 访问模式 | - | FAST PAGE | FAST PAGE | - | FAST PAGE | FAST PAGE | - |
| 最长访问时间 | - | 60 ns | 60 ns | - | 70 ns | 70 ns | - |
| 其他特性 | - | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | - | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | - |
| JESD-30 代码 | - | R-XSMA-N72 | R-XSMA-N72 | - | R-XSMA-N72 | R-XSMA-N72 | - |
| 内存密度 | - | 335544320 bit | 335544320 bi | - | 335544320 bi | 335544320 bi | - |
| 内存集成电路类型 | - | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | - | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | - |
| 内存宽度 | - | 40 | 40 | - | 40 | 40 | - |
| 功能数量 | - | 1 | 1 | - | 1 | 1 | - |
| 端口数量 | - | 1 | 1 | - | 1 | 1 | - |
| 端子数量 | - | 72 | 72 | - | 72 | 72 | - |
| 字数 | - | 8388608 words | 8388608 words | - | 8388608 words | 8388608 words | - |
| 字数代码 | - | 8000000 | 8000000 | - | 8000000 | 8000000 | - |
| 工作模式 | - | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | - |
| 最高工作温度 | - | 70 °C | 70 °C | - | 70 °C | 70 °C | - |
| 组织 | - | 8MX40 | 8MX40 | - | 8MX40 | 8MX40 | - |
| 封装主体材料 | - | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | - |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - |
| 认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | - | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | - |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | - | 5 V | 5 V | - |
| 表面贴装 | - | NO | NO | - | NO | NO | - |
| 技术 | - | CMOS | CMOS | - | CMOS | CMOS | - |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | - |
| 端子形式 | - | NO LEAD | NO LEAD | - | NO LEAD | NO LEAD | - |
| 端子位置 | - | SINGLE | SINGLE | - | SINGLE | SINGLE | - |
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