IC 24-BIT, 24.576 MHz, OTHER DSP, CPGA100, CERAMIC, PGA-100, Digital Signal Processor
参数名称 | 属性值 |
厂商名称 | ADI(亚德诺半导体) |
零件包装代码 | PGA |
包装说明 | PGA, |
针数 | 100 |
Reach Compliance Code | unknown |
ECCN代码 | 3A001.A.2.C |
地址总线宽度 | 15 |
桶式移位器 | YES |
边界扫描 | NO |
最大时钟频率 | 24.576 MHz |
外部数据总线宽度 | 24 |
格式 | FIXED POINT |
内部总线架构 | MULTIPLE |
JESD-30 代码 | S-CPGA-P100 |
低功率模式 | YES |
端子数量 | 100 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | PGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY |
认证状态 | Not Qualified |
筛选级别 | MIL-STD-883 |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | PIN/PEG |
端子位置 | PERPENDICULAR |
uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
Base Number Matches | 1 |
5962-8773501XX | 5962-8773501XC | 5962-8773504XC | 5962-8773503XC | 5962-8773504XX | 5962-8773503XX | |
---|---|---|---|---|---|---|
描述 | IC 24-BIT, 24.576 MHz, OTHER DSP, CPGA100, CERAMIC, PGA-100, Digital Signal Processor | IC 24-BIT, 24.7 MHz, OTHER DSP, CPGA100, PGA-100, Digital Signal Processor | IC 24-BIT, 40.983 MHz, OTHER DSP, CPGA100, PGA-100, Digital Signal Processor | IC 24-BIT, 32.786 MHz, OTHER DSP, CPGA100, PGA-100, Digital Signal Processor | IC 24-BIT, 40.96 MHz, OTHER DSP, CPGA100, CERAMIC, PGA-100, Digital Signal Processor | IC 24-BIT, 32.768 MHz, OTHER DSP, CPGA100, CERAMIC, PGA-100, Digital Signal Processor |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
零件包装代码 | PGA | PGA | PGA | PGA | PGA | PGA |
包装说明 | PGA, | PGA-100 | PGA-100 | PGA-100 | PGA, | PGA, |
针数 | 100 | 100 | 100 | 100 | 100 | 100 |
Reach Compliance Code | unknown | compliant | compliant | compliant | unknown | unknown |
ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
地址总线宽度 | 15 | 14 | 14 | 14 | 15 | 15 |
桶式移位器 | YES | YES | YES | YES | YES | YES |
边界扫描 | NO | NO | NO | NO | NO | NO |
最大时钟频率 | 24.576 MHz | 24.7 MHz | 40.983 MHz | 32.786 MHz | 40.96 MHz | 32.768 MHz |
外部数据总线宽度 | 24 | 24 | 24 | 24 | 24 | 24 |
格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
JESD-30 代码 | S-CPGA-P100 | S-CPGA-P100 | S-CPGA-P100 | S-CPGA-P100 | S-CPGA-P100 | S-CPGA-P100 |
低功率模式 | YES | YES | YES | YES | YES | YES |
端子数量 | 100 | 100 | 100 | 100 | 100 | 100 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | PGA | PGA | PGA | PGA | PGA | PGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
筛选级别 | MIL-STD-883 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | MIL-STD-883 | MIL-STD-883 |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
端子位置 | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
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