Features
NT
CO
Applications
■
DC/DC converters for:
■
Wirewound construction
■
Iron powder core
■
Magnetically shielded construction
M
PL
IA
provides low radiation
■
Low DC resistance
■
Low profile
■
RoHS compliant*
-
-
-
-
-
Smart phones
DVC/DSCs
Tablets
HDD/SSDs
Mobile electronic devices
*R
oH
S
SRP2010 Series - SMD Power Inductors
Electrical Specifications @ 25 °C
Bourns
Part Number
Inductance
@ 1 MHz / 1 V
L (µH)
Tol. (%)
DCR
(mΩ) Max.
Irms
(A)
Isat
(A)
General Specifications
Inductance Test Frequency/
Voltage ............................... 1 MHz/1 V
Operating Temperature
................................-40 °C to +125 °C
(Temperature rise included)
Storage Temperature
................................-50 °C to +125 °C
Rated Current
............ Inductance drops 30 % at Isat
Temperature Rise .....40 °C at rated Irms
Resistance to Soldering Heat ....+260 °C
Materials
SRP2010-R24M
SRP2010-R33M
SRP2010-R47M
SRP2010-R68M
SRP2010-1R0M
SRP2010-1R5M
SRP2010-2R2M
0.24
0.33
0.47
0.68
1.0
1.5
2.2
20
20
20
20
20
20
20
21
29
40
49
69
137
150
4.5
3.8
3.3
3.1
2.6
1.9
1.7
5.6
5.0
4.4
3.7
2.9
2.5
1.9
How to Order
Electrical Schematic
SRP2010 - 1R0M
Model
Value Code (see table)
Core .....................................Iron powder
Terminal ......................................... Ni/Sn
Packaging ....... 3000 pcs. per 7-inch reel
Product Dimensions
1.0
MAX.
(.039)
Soldering Profile
Tp
RAMP-UP
tp
CRITICAL
ZONE
TL to TP
0.5 ± 0.3
(.020 + .012)
tL
Temperature (°C)
TL
Tsmax
2.0 ± 0.2
(.079 ± .008)
0.5 ± 0.3
(.020 + .012)
Tsmin
ts
Preheat
RAMP-DOWN
1.6 ± 0.2
(.063 ± .008)
25
t
25 °C to Peak
Recommended Layout
Time (Seconds)
Profile Feature
Pb Free Assembly
0.9
(.035)
Average Ramp Rate (TSmax to TP)
Preheat
- Temperature Min. (TSmin)
- Temperature Max. (TSmax)
- Time (tsmin to tsmax)
Time Maintained Above
- Temperature (TL)
- Time (tL)
Peak Temperature (Tp)
Time within 5 °C of Actual Peak Temperature
(Tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
3 °C/second max.
150 °C
200 °C
60-180 seconds
217 °C
60-150 seconds
260 °C +0/-5 °C
DIMENSIONS:
2.0
(.079)
1.6
(.063)
20-40 seconds
6 °C/second max.
8 minutes max.
MM
(INCHES)
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SRP2010
Series - Line Filter
SRF0504
Series - SMD Power Inductors
L vs. I Charts
SRP2010-R24M
100
90
80
70
0.25
0.20
1.2
1.0
0.8
SRP2010-1R0M
100
90
Temperature Rise (°C)
80
70
60
Inductance (μH)
Inductance (μH)
0.15
60
50
0.6
0.4
0.2
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
50
40
30
20
10
0
4.0
0.10
0.05
0
0
1
2
3
4
5
6
40
30
20
10
0
DC Bias(A)
DC Bias(A)
0.40
0.35
SRP2010-R33M
80
70
1.6
1.4
SRP2010-1R5M
70
60
Inductance (μH)
0.25
0.20
0.15
0.10
0.05
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
50
40
30
20
10
0
5.5
Temperature Rise (°C)
1.0
40
30
20
10
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
Inductance (μH)
0.8
0.6
0.4
0.2
0
DC Bias(A)
DC Bias(A)
0.5
0.4
SRP2010-R47M
100
90
80
70
2.5
SRP2010-2R2M
100
90
80
70
Temperature Rise (°C)
Inductance (μH)
50
0.2
0.1
0
0
1
2
3
4
5
40
30
20
10
0
Inductance (μH)
0.3
60
1.5
60
50
1.0
0.5
0
0
0.5
1.0
1.5
2.0
2.5
40
30
20
10
0
3.0
DC Bias(A)
DC Bias(A)
0.7
0.6
0.5
SRP2010-R68M
100
90
70
60
50
Inductance (μH)
0.4
0.3
0.2
0.1
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
40
30
20
10
0
4.0
DC Bias(A)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Temperature Rise (°C)
80
Temperature Rise (°C)
2.0
Temperature Rise (°C)
0.30
60
1.2
50
Temperature Rise (°C)
SRP2010 Series - SMD Power Inductors
Packaging Specifications
110 ± 0.5
(4.331 ± .020)
13.0 ± 0.2
DIA.
(.512 ± .008)
2.2 ± 0.5
(.087 ± .020)
178 ± 1.0
(7.008 ± .040)
DIA.
4.0 ± 0.5
(.157 ± .020)
5.0 ± 0.5
(.197 ± .020)
60 +0.5/-0.0
(2.362 +.020/-.000)
DIA.
3.0 ± 0.5
(.118 ± .020)
9.0 ± 0.5
(.354 ± .020)
DIA.
1.55 ± 0.05
(.061 ± .002)
4.0 ± 0.1
(.157 ± .004)
2.0 ± 0.05
(.079 ± .002)
12.0 ± 0.15
(.472 ± .006)
1.75 ± 0.1
(.069 ± .004)
0.22 ± 0.05
(.009 ± .002)
3.0 ± 0.1
(.118 ± .004)
3.5 ± 0.1
(.138 ± .004)
8.0 ± 0.3
(.315 ± .012)
1.15 ± 0.10
(.045 ± .004)
1.8 ± 0.1
(.071 ± .004)
4.0 ± 0.1
(.157 ± .004)
USER DIRECTION OF FEED
DIMENSIONS:
QTY: 3,000 PCS. PER REEL
MM
(INCHES)
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
EMEA:
Tel: +36 88 520 390 • Fax: +36 88 520 211
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
REV. 01/16
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
NXP MCU
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