Bus interface latches
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | DIP, DIP24,.3 |
Reach Compliance Code | unknow |
JESD-30 代码 | R-PDIP-T24 |
JESD-609代码 | e0 |
逻辑集成电路类型 | D LATCH |
最大I(ol) | 0.048 A |
位数 | 8 |
功能数量 | 1 |
端子数量 | 24 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP24,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5 V |
最大电源电流(ICC) | 95 mA |
Prop。Delay @ Nom-Su | 10.5 ns |
认证状态 | Not Qualified |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | TTL |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
N74F846N | 74F843 | 74F845 | 74F846 | N74F846D | N74F845D | N74F843N | N74F843D | |
---|---|---|---|---|---|---|---|---|
描述 | Bus interface latches | Bus interface latches | Bus interface latches | Bus interface latches | Bus interface latches | Bus interface latches | Bus interface latches | Bus interface latches |
是否Rohs认证 | 不符合 | - | - | - | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | - | - | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | DIP, DIP24,.3 | - | - | - | SOP, SOP24,.4 | SOP, SOP24,.4 | DIP, DIP24,.3 | SOP, SOP24,.4 |
Reach Compliance Code | unknow | - | - | - | unknow | unknow | unknow | unknown |
JESD-30 代码 | R-PDIP-T24 | - | - | - | R-PDSO-G24 | R-PDSO-G24 | R-PDIP-T24 | R-PDSO-G24 |
JESD-609代码 | e0 | - | - | - | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | D LATCH | - | - | - | D LATCH | D LATCH | D LATCH | D LATCH |
最大I(ol) | 0.048 A | - | - | - | 0.048 A | 0.048 A | 0.048 A | 0.048 A |
位数 | 8 | - | - | - | 8 | 8 | 9 | 9 |
功能数量 | 1 | - | - | - | 1 | 1 | 1 | 1 |
端子数量 | 24 | - | - | - | 24 | 24 | 24 | 24 |
最高工作温度 | 70 °C | - | - | - | 70 °C | 70 °C | 70 °C | 70 °C |
输出特性 | 3-STATE | - | - | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | - | - | - | SOP | SOP | DIP | SOP |
封装等效代码 | DIP24,.3 | - | - | - | SOP24,.4 | SOP24,.4 | DIP24,.3 | SOP24,.4 |
封装形状 | RECTANGULAR | - | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | - | - | - | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
电源 | 5 V | - | - | - | 5 V | 5 V | 5 V | 5 V |
最大电源电流(ICC) | 95 mA | - | - | - | 95 mA | 115 mA | 115 mA | 115 mA |
认证状态 | Not Qualified | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 (Vsup) | 5 V | - | - | - | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | - | - | - | YES | YES | NO | YES |
技术 | TTL | - | - | - | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | - | - | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | - | - | - | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
端子节距 | 2.54 mm | - | - | - | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | - | - | - | DUAL | DUAL | DUAL | DUAL |
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