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BCM384P120T1K5AC1

产品描述Multilayer Ceramic Capacitors MLCC - SMD/SMT 1210 47uF 16volts X5R 20%
产品类别半导体    电源管理   
文件大小3MB,共24页
制造商VICOR
官网地址http://www.vicorpower.com/
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BCM384P120T1K5AC1概述

Multilayer Ceramic Capacitors MLCC - SMD/SMT 1210 47uF 16volts X5R 20%

BCM384P120T1K5AC1规格参数

参数名称属性值
产品种类
Product Category
Isolated DC/DC Converters
制造商
Manufacturer
VICOR
RoHSDetails
Number of Outputs1 Output
Output Power1500 W
Input Voltage384 VDC
Output Voltage-Channel 112 V
Isolation Voltage4.242 kVDC
安装风格
Mounting Style
Through Hole
长度
Length
61 mm
宽度
Width
25.14 mm
高度
Height
7.26 mm
Dimensions61 mm x 25.14 mm x 7.26 mm
工作温度范围
Operating Temperature Range
- 40 C to + 125 C
系列
Packaging
Tray
产品
Product
Isolated
工厂包装数量
Factory Pack Quantity
1
单位重量
Unit Weight
1.446232 oz

文档预览

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BCM
®
Bus Converter
BCM384y120x1K5AC1
®
S
C
US
C
NRTL
US
Fixed Ratio DC-DC Converter
Features
Up to 1500 W continuous output power
2208 W/in
3
power density
97.4% peak efficiency
4242 Vdc isolation
Parallel operation for multi-kW arrays
OV, OC, UV, short circuit and thermal protection
2361 through-hole ChiP package
Product Ratings
V
IN
= 384 V (260 – 410 V)
V
OUT
= 12 V (8.1 – 12.8 V)
(
NO LOAD
)
P
OUT
= up to 1500 W
K = 1/32
Product Description
The VI Chip
®
Bus Converter (BCM) is a high efficiency Sine
Amplitude Converter (SAC), operating from a 260 to 410 VDC
primary bus to deliver an isolated ratiometric output from
8.1 to 12.8 VDC.
The BCM384y120x1K5AC1 offers low noise, fast transient
response, and industry leading efficiency and power density. In
addition, it provides an AC impedance beyond the bandwidth
of most downstream regulators, allowing input capacitance
normally located at the input of a POL regulator to be located at
the input of the BCM module. With a K factor of 1/32, that
capacitance value can be reduced by a factor of 1024x, resulting
in savings of board area, material and total system cost.
The BCM384y120x1K5AC1, combined with the D44TL1A0
Digital Supervisor and I13TL1A0 Digital Isolator, provide a
secondary referenced PMBus™ compatible telemetry and
control interface. This interface provides access to the BCM’s
internal controller configuration, fault monitoring, and other
telemetry functions.
Leveraging the thermal and density benefits of Vicor’s ChiP
packaging technology, the BCM module offers flexible thermal
management options with very low top and bottom side
thermal impedances. Thermally-adept ChiP-based power
components, enable customers to achieve low cost power
system solutions with previously unattainable system size,
weight and efficiency attributes, quickly and predictably.
n
2.402” x 0.990” x 0.286”
(61.00 mm x 25.14 mm x 7.26 mm)
PMBus
TM
management interface*
Typical Applications
380 DC Power Distribution
High End Computing Systems
Automated Test Equipment
Industrial Systems
High Density Power Supplies
Communications Systems
Transportation
*When
used with D44TL1A0 and I13TL1A0 chipset
BCM
®
Bus Converter
Page 1 of 23
Rev 1.4
05/2015
vicorpower.com
800 927.9474
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