Data sheet MTi 1-series
3D AHRS/VRU/IMU module
Document MT0512P, Revision D, 5 Dec 2016
Features
Description
The MTi 1-series is a module outputting 3D orientation,
3D rate of turn, 3D accelerations, and 3D magnetic
field, depending on the product configuration. It is
available as an Inertial Measurement Unit (IMU),
Vertical Reference Unit (VRU) or Attitude and Heading
Reference System (AHRS).
This fully-functional self-contained module is easy to
design in with limited hardware components to be
added. The fully documented, industry-standard
communication protocol allows for customization of the
data message in terms of data, frequency and output
format. Signals are fully processed onboard, requiring
very little resources from the host and is well suited for
applications in simple MCU-operated environments.
The host can read-out the data over SPI, I
2
C or UART.
With a roll/pitch accuracy of 1.0º RMS and yaw
accuracy of 2º RMS under dynamic conditions, the
output is excellent for control and stabilization of any
object and navigation of e.g. unmanned vehicles.
Product
Output
Motion data
Magnetic field
Roll/pitch
Heading tracking
Referenced yaw
MTi-1
IMU
●
●
MTi-2
VRU
●
●
●
●
MTi-3
AHRS
●
●
●
●
●
Full-featured AHRS on 12.1 x 12.1 mm module
Roll/pitch accuracy (dynamic) 1.0 deg
Heading accuracy 2.0 deg
Minimal requirements on host processor
Uniform interface over product lifetime
o
No hardware/software interface changes
o
No EOL
Always best-in-class inertial sensors incorporated
Industry-leading signal processing pipeline
(AttitudeEngine
TM
) with vibration-rejection
Robust and accurate orientation algorithm
(XKF3
TM
)
API-compatible with all Xsens’ Motion Trackers
o
Drivers and examples on ARM
®
mbed
TM
Low power (45 mW @ 3.0V)
PLCC28-compatible PCB (12.1 x 12.1 x 2.6 mm)
Applications
Miniature aerial vehicles
Heavy machinery/agriculture
Robotics, pedestrian dead-reckoning
Industrial grade VR/AR, HMD’s and handheld
devices
Related Resources
www.xsens.com/MTi-1-series
MTi 1-series DK User Manual (MT0513P)
MT Low Level Communication Protocol
Documentation (MT0101P)
MTi White Paper: Next generation Xsens Motion
Trackers for Industrial applications
12.1 mm
Figure 1: MTi 1-series
www.xsens.com
© Xsens Technologies B.V.
Document MT0512P.D
Data sheet MTi 1-series
1
2
Table of Contents
GENERAL INFORMATION
.................................................................................................................................. 3
O
RDERING
I
NFORMATION
.................................................................................................................................... 3
B
LOCK
D
IAGRAM
.............................................................................................................................................. 3
T
YPICAL
A
PPLICATION
......................................................................................................................................... 4
P
IN
C
ONFIGURATION
.......................................................................................................................................... 4
P
IN MAP
........................................................................................................................................................ 5
P
IN
D
ESCRIPTIONS
............................................................................................................................................. 6
P
ERIPHERAL INTERFACE SELECTION
.......................................................................................................................... 6
2.7.1
Peripheral Interface Architecture
.......................................................................................................... 7
2.7.2
Xbus Protocol
..................................................................................................................................... 7
2.7.3
MTSSP Synchronous Serial Protocol
...................................................................................................... 7
2.7.4
I
2
C
................................................................................................................................................... 11
2.7.5
SPI
................................................................................................................................................... 13
2.7.6
UART half duplex
.............................................................................................................................. 15
2.7.7
UART full duplex with RTS/CTS flow control
......................................................................................... 16
2.8 R
ECOMMENDED EXTERNAL COMPONENTS
................................................................................................................ 17
2.1
2.2
2.3
2.4
2.5
2.6
2.7
3
3.1
MTI 1-SERIES ARCHITECTURE...........................................................................................................................
18
MT
I
1-
SERIES CONFIGURATIONS
........................................................................................................................... 18
3.1.1
MTi-1 IMU
....................................................................................................................................... 18
3.1.2
MTi-2 VRU
....................................................................................................................................... 18
3.1.3
MTi-3 AHRS
...................................................................................................................................... 18
3.2 S
IGNAL PROCESSING PIPELINE
.............................................................................................................................. 19
3.2.1
Strapdown integration
...................................................................................................................... 19
3.2.2
XKF3
TM
Sensor Fusion Algorithm
......................................................................................................... 19
3.2.3
Frames of reference used in MTi 1-series
............................................................................................. 20
4
4.1
4.2
5
6
6.1
6.2
6.3
6.4
6.5
7
7.1
7.2
7.3
7.4
8
8.1
8.2
9
9.1
9.2
9.3
3D ORIENTATION AND PERFORMANCE SPECIFICATIONS
................................................................................... 21
3D O
RIENTATION SPECIFICATIONS
......................................................................................................................... 21
S
ENSORS SPECIFICATIONS
................................................................................................................................... 21
SENSOR CALIBRATION
.................................................................................................................................... 23
SYSTEM AND ELECTRICAL SPECIFICATIONS
....................................................................................................... 24
I
NTERFACE SPECIFICATIONS
................................................................................................................................. 24
S
YSTEM SPECIFICATIONS
.................................................................................................................................... 24
E
LECTRICAL SPECIFICATIONS
................................................................................................................................ 25
A
BSOLUTE MAXIMUM RATINGS
............................................................................................................................ 25
C
OMPLIANCE
................................................................................................................................................. 25
MTI 1-SERIES SETTINGS AND OUTPUTS
............................................................................................................ 26
M
ESSAGE STRUCTURE
....................................................................................................................................... 26
O
UTPUT SETTINGS
........................................................................................................................................... 27
MTD
ATA
2
................................................................................................................................................... 28
S
YNCHRONIZATION AND TIMING
........................................................................................................................... 29
MAGNETIC INTERFERENCE
.............................................................................................................................. 30
M
AGNETIC
F
IELD
M
APPING
................................................................................................................................ 30
A
CTIVE
H
EADING
S
TABILIZATION
(AHS)..................................................................................................................
30
PACKAGE AND HANDLING
............................................................................................................................... 31
P
ACKAGE DRAWING
......................................................................................................................................... 31
M
OUNTING CONSIDERATIONS
.............................................................................................................................. 31
P
ACKAGING
.................................................................................................................................................. 32
9.3.1
Tray packaging information
............................................................................................................... 32
9.3.2
Reel packaging information
............................................................................................................... 33
9.4 R
EFLOW SPECIFICATION
..................................................................................................................................... 34
10
TRADEMARKS AND REVISIONS
........................................................................................................................ 35
10.1 T
RADEMARKS
................................................................................................................................................ 35
10.2 R
EVISIONS
.................................................................................................................................................... 35
www.xsens.com
© Xsens Technologies B.V.
2
Document MT0512P.D
Data sheet MTi 1-series
2
2.1
General information
Ordering Information
Part Number
Output
IMU; inertial data
VRU; inertial data, roll/pitch
(referenced), yaw (unreferenced)
AHRS; inertial data, roll/pitch/yaw
IMU; inertial data
VRU; inertial data, roll/pitch
(referenced), yaw (unreferenced)
AHRS; inertial data, roll/pitch/yaw
Development kit for MTi 1-series,
including MTi-3-8A7G6
Package
PCB, JEDEC-PLCC-28 compatible
PCB, JEDEC-PLCC-28 compatible
PCB, JEDEC-PLCC-28 compatible
PCB, JEDEC-PLCC-28 compatible
PCB, JEDEC-PLCC-28 compatible
PCB, JEDEC-PLCC-28 compatible
Packing
Method
Tray of 20
Tray of 20
Tray of 20
Reel of 250
Reel of 250
Reel of 250
MTI-1-8A7G6T
MTI-2-8A7G6T
MTI-3-8A7G6T
MTI-1-8A7G6R
MTI-2-8A7G6R
MTI-3-8A7G6R
MTi-3-8A7G6-DK
Single unit
2.2
Block Diagram
Figure 2: MTi 1-series module block diagram
www.xsens.com
© Xsens Technologies B.V.
3
Document MT0512P.D
Data sheet MTi 1-series
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