1.Open Circuit Inductance (OCL) Test Parameters: 300kHz, 0.10V
rms
, 0.0Adc @ 25°C.
2. Full Load Inductance (FLL) Test Parameters: 300kHz, 0.10V
rms
, I
sat
1 @ 25°C.
3. I
rms
: DC current for an approximate temperature rise of 20°C without core loss. Derating is necessary for AC currents.
PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the
temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating
conditions verified in the end application.
4. I
sat
1: Peak current for approximately 20% rolloff at +25°C.
5. I
sat
2: Peak current for approximately 20% rolloff at +125°C.
6. Part Number Definition: CTX01-18738-R
- CTX01-18738 = Product code and size
- “-R” suffix = RoHS compliant
Dimensions (mm)
±
±
±
6.70
typ.
Part marking: CTX01-18738, wwllyy = Date Code, R = Revision Level
All soldering surfaces must be coplanar within 0.102 millimeters.
Tolerances are ±0.1 millimeters unless stated otherwise.
The DCR is measured from point “a” to point “b”
Packaging information (mm)
Temperature rise vs. total loss
60
50
40
30
20
10
0
0.0
0.5
1.0
1.5
2.0
2.5
Temperature Rise (°C)
Total Loss (W)
2
www.eaton.com/elx
Technical Data
4410
Effective November 2015
CTX01-18738-R
High current, high frequency power inductors
Core loss
Core Loss vs. Ip-p
10
500kHz
1MHz
300kHz
200kHz
100kHz
1
Core Loss (W)
0.1
0.01
0.001
0.0001
0.00001
1
10
100
I
p-p
(Amps)
Inductance characteristics
% of OCL vs. I
sat
1
100.0%
90.0%
80.0%
70.0%
60.0%
% of OCL
50.0%
40.0%
30.0%
20.0%
10.0%
0.0%
0
10
20
30
+125°C
+25°C
-40°C
I
sat
1 (Amps)
40
50
60
70
80
3
www.eaton.com/elx
CTX01-18738-R
High current, high frequency power inductors
Solder reflow profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
Technical Data
4410
Effective November 2015
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm)
≥2.5mm
T
smax
235°C
220°C
220°C
220°C
Temperature
Table 2 - Lead (Pb) Free Solder (Tc)
T
smin
t
s
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
l
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
