It is recommended that the temperature of the component does not exceed +125°C under worst
case conditions
2,5 ±0,2
Ambient Temperature (refering to
I
R
)
Operating Temperature
Storage Temperature (in original
packaging)
Scale - 10:1
-40 °C up to +85 °C
-40 °C up to +125 °C
-20 °C up to +40 °C
Test conditions of Electrical Properties: +20°C, 33% RH if not specified differently
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
GENERAL TOLERANCE
PROJECTION
METHOD
KaS
DESCRIPTION
DDe
DIN ISO 2768-1m
WE-PMCI Power Molded Chip
Inductor
SIZE
REVISION
STATUS
ORDER CODE
74479299147
DATE (YYYY-MM-DD)
BUSINESS UNIT
PAGE
1210
002.000
Valid
2017-09-29
eiSos
1/7
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Typical Inductance vs. Frequency Characteristics:
100
Typical Inductance vs. Current Characteristics:
10,000
10
Inductance [µH]
Inductance [µH]
1
1,000
0,1
1
10
100
1000
0,100
1
Frequency [MHz]
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
10
100
Current [mA]
1000
10000
GENERAL TOLERANCE
PROJECTION
METHOD
KaS
DESCRIPTION
DDe
DIN ISO 2768-1m
WE-PMCI Power Molded Chip
Inductor
SIZE
REVISION
STATUS
ORDER CODE
74479299147
DATE (YYYY-MM-DD)
BUSINESS UNIT
PAGE
1210
002.000
Valid
2017-09-29
eiSos
2/7
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Typical Temperature Rise vs. Current Characteristics:
80,0
70,0
60,0
50,0
Temperature Rise [K]
40,0
30,0
20,0
10,0
0,0
0
1.000
2.000
3.000
Current [A]
4.000
5.000
6.000
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
GENERAL TOLERANCE
PROJECTION
METHOD
KaS
DESCRIPTION
DDe
DIN ISO 2768-1m
WE-PMCI Power Molded Chip
Inductor
SIZE
REVISION
STATUS
ORDER CODE
74479299147
DATE (YYYY-MM-DD)
BUSINESS UNIT
PAGE
1210
002.000
Valid
2017-09-29
eiSos
3/7
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Packaging Specification - Tape and Reel: [mm]
P0
K0
T
E1
W3
A
D0
P2
B
W1
close to center
D
F
W
B0
E2
C
Top Cover
Tape
A
D1
A0
P1
T2
T1
W2
End
Feeding direction
Start
Carrier Tape
Cover Tape
No Component
min.160mm
Components
No Component
min.100mm
Cover Tape
min. 400mm
tolerance
Tape width
A
±2,0
178,00
B
min.
1,50
C
±0,8
13
D
min.
20.2
N
±2,0
50
W1
+1,5
8.4
W2
max.
14.4
W3
min.
7.9
W3
max.
10.9
packaging is reffered to the international standard IEC 60286-3:2013
tolerance
size
A0
typ.
1210 2,8
B0
typ.
3,5
W
+0,3/ -0,1
8
T
T1
T2
max. max. typ.
0,3 0,10 1,7
K0
typ.
1,3
P0
P1
P2
±0,1 ±0,1 ±0,05
4,00 4
2,00
D0
+0,1/ -0,0
1,50
D1 E1
E2
F
min. ±0,1 min. ±0,05
0,3 1.75 6,25 3,5
Tape Type 2a
Polystyrene
VPE / packaging unit
pcs.
3000
8 mm
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
CREATED
CHECKED
GENERAL TOLERANCE
N
PROJECTION
METHOD
KaS
DESCRIPTION
DDe
DIN ISO 2768-1m
165° - 180°
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
WE-PMCI Power Molded Chip
Inductor
SIZE
REVISION
STATUS
ORDER CODE
74479299147
DATE (YYYY-MM-DD)
BUSINESS UNIT
PAGE
Pull-of force
Tape width
8 mm
0,1 N - 1,0 N
1210
002.000
Valid
2017-09-29
A
eiSos
4/7
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Classification Reflow Profile for SMT components:
Classification Reflow Soldering Profile:
Profile Feature
Preheat Temperature Min
Preheat Temperature Max
Value
T
s min
150 °C
T
s max
200 °C
t
s
T
L
t
L
T
p
t
p
60 - 120 seconds
3 °C/ second max.
217 °C
60 - 150 seconds
see table below
20 - 30 seconds
6 °C/ second max.
8 minutes max.
T
p
Max. Ramp Up Rate
Max. Ramp Down Rate
T
L
T
s max
t
L
t
p
T
C
–5°C
Preheat Time t
s
from T
s min
to T
s max
Ramp-up Rate (T
L
to T
P
)
Liquidous Temperature
Time t
L
maintained above T
L
Peak package body temperature
Time within 5°C of actual peak temperaure
Ramp-down Rate (T
L
to T
P
)
Time 25°C to peak temperature
refer to IPC/ JEDEC J-STD-020E
Temperature
Preheat Area
T
s min
t
S
Package Classification Reflow Temperature:
Properties
Volume mm³
<350
260 °C
250 °C
Volume mm³
350-2000
260 °C
250 °C
245 °C
Volume mm³
>2000
260 °C
245 °C
245 °C
25
Time 25°C to Peak
PB-Free Assembly | Package Thickness < 1.6 mm
PB-Free Assembly | Package Thickness ≥ 2.5 mm
refer to IPC/ JEDEC J-STD-020E
PB-Free Assembly | Package Thickness 1.6 mm - 2.5 mm
260 °C
Time
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
GENERAL TOLERANCE
PROJECTION
METHOD
KaS
DESCRIPTION
DDe
DIN ISO 2768-1m
WE-PMCI Power Molded Chip
Inductor
SIZE
REVISION
STATUS
ORDER CODE
74479299147
DATE (YYYY-MM-DD)
BUSINESS UNIT
PAGE
1210
002.000
Valid
2017-09-29
eiSos
5/7
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
在全球半导体产业因景气不佳而纷传并购、整合之际，两大IT巨头三星、IBM日前却双双宣布，将强化半导体产业投资。 三星电子本周一宣布，已向韩国证券交易所提交一份申请文件，打算2008年投下10.5亿美元，用于升级内存芯片生产线、改进技术工艺，从而提高产能并降低成本。无独有偶。本周二IBM公司宣布，未来3年将投资10亿美元，用于扩充位于纽约州 East Fishkill 的半导体工厂，以消...[详细]
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