MAX32625/MAX32626
Ultra-Low Power, High-Performance
ARM Cortex-M4 with FPU-Based
Microcontroller for Wearables
Benefits and Features
General Description
The MAX32625/MAX32626 are ARM
®
Cortex
®
-M4
with FPU-based microcontrollers, ideal for the emerg-
ing category of wearable medical and fitness appli-
cations. The architecture combines ultra-low power,
high-efficiency signal processing functionality and ease
of use. An internal 96MHz oscillator provides high-
performance capability, and the internal 4MHz oscillator
supports minimal power consumption for applications
requiring always-on monitoring. The device provides
512kB of flash and 160kB of SRAM.
The device features four powerful and flexible power
modes. A peripheral management unit (PMU) enables
intelligent peripheral control with up to six channels to
significantly reduce power consumption. Built-in dynamic
clock gating and firmware-controlled power gating allows
the user to optimize power for the specific application.
Multiple SPI, UART, and I
2
C serial interfaces are pro-
vided, as well as a 1-Wire
®
master and USB, allowing
for interconnection to a wide variety of external sensors.
A four-input, 10-bit delta-sigma ADC monitors analog
input from external sensors.
The MAX32625L is a lower-cost version of the MAX32625,
providing 256kB of flash and 128kB of SRAM.
The MAX32626 is a secure version of the MAX32625.
It incorporates a trust protection unit (TPU) with encryption
and advanced security features. These features include
a modular arithmetic accelerator (MAA) for ECDSA, a
hardware TRNG entropy generator, and a secure boot
loader. Both the MAX32626 and the MAX32625 provide
a hardware AES engine.
●
High-Efficiency Microcontroller for Wearable Devices
• Internal Oscillator Operates Up to 96MHz
• Low Power 4MHz Oscillator System Clock Option
for Always-On Monitoring Applications
• 512KB Flash Memory (256KB “L” Version)
• 160KB SRAM (128KB “L” Version)
• 8KB Instruction Cache
• 1.2V Core Supply Voltage
• 1.8V to 3.3V I/O
• Optional 3.3V ±5% USB Supply Voltage
• Wide Operating Temperature: -30°C to +85°C
●
Power Management Maximizes Uptime for Battery
Applications
•
106μA/MHz Active Current Executing from Cache
•
49μA/MHz Active Current Executing from Flash
• Wake-Up to 96MHz Clock or 4MHz Clock
• 600nA Low Power Mode (LP0) Current with RTC
Enabled
•
2.56μW Ultra-Low Power Data Retention Sleep
Mode (LP1) with Fast 5μs Wake-Up on 96MHz
Clock Source
•
27μA/MHz Low Power Mode (LP2) Current
●
Optimal Peripheral Mix Provides Platform Scalability
• SPI Execute in Place (SPIX) Engine for Memory
Expansion with Minimal Footprint
• Three SPI Masters, One SPI Slave
• Three UARTs
• Up to Two I
2
C Masters, One I
2
C Slave
• 1-Wire Master
• Full-Speed USB 2.0 Device with Internal Transceiver
• Sixteen Pulse Train (PWM) Engines
• Six 32-Bit Timers and 3 Watchdog Timers
• Up to 40 General-Purpose I/O Pins
• 10-Bit Delta-Sigma ADC Operating at 7.8ksps
• AES -128, -192, -256
• CMOS-Level 32kHz RTC Output Available in All
Power Modes
●
Secure Valuable IP and Data with Robust Internal
Hardware Security (MAX32626 Only)
• Trust Protection Unit (TPU) Provides ECDSA and
Modular Arithmetic Acceleration Support
• True Random Number Generator
• Secure Boot Loader
Applications
●
●
●
●
●
Sports Watches
Fitness Monitors
Wearable Medical Patches
Portable Medical Devices
Sensor Hubs
Ordering Information
appears at end of data sheet.
ARM and Cortex are registered trademarks of ARM Limited (or its
subsidiaries) in the EU and/or elsewhere. All rights reserved.
1-Wire is a registered trademark of Maxim Integrated Products, Inc.
19-8596; Rev 3; 10/17
MAX32625/MAX32626
Ultra-Low Power, High-Performance
ARM Cortex-M4 with FPU-Based
Microcontroller for Wearables
TABLE OF CONTENTS
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Benefits and Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Simplified Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
63 WLP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
68 TQFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Electrical Characteristics—ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Electrical Characteristics—USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Electrical Characteristics—SPI Master / SPIX Master . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Electrical Characteristics—SPI Slave . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Electrical Characteristics—I
2
C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Detailed Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
MAX32625/MAX32626 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
ARM Cortex-M4 with FPU Processor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Power Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Low Power Mode 0 (LP0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Low Power Mode 1 (LP1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Low Power Mode 2 (LP2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Low Power Mode 3 (LP3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Analog-to-Digital Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Pulse Train Engine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Clocking Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Interrupt Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Real-Time Clock and Wake-Up Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
General-Purpose I/O and Special Function Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
CRC Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Watchdog Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Programmable Timers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Serial Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
I
2
C Master and Slave. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
SPI (Master) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
www.maximintegrated.com
Maxim Integrated
│
2
MAX32625/MAX32626
Ultra-Low Power, High-Performance
ARM Cortex-M4 with FPU-Based
Microcontroller for Wearables
TABLE OF CONTENTS (CONTINUED)
SPI (Slave) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
SPI (Execute in Place (SPIX) Master) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
1-Wire Master. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Peripheral Management Unit (PMU). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Additional Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Development and Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Trust Protection Unit (TPU) (MAX32626 Only). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Applications Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
General-Purpose I/O Matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Typical Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
LIST OF FIGURES
Figure 1. SPI Master and SPI XIP Master Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 2. MAX32625/MAX32626 Clock Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 3. 32-Bit Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
LIST OF TABLES
Table 1. General-Purpose I/O Matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
www.maximintegrated.com
Maxim Integrated
│
3
MAX32625/MAX32626
Ultra-Low Power, High-Performance
ARM Cortex-M4 with FPU-Based
Microcontroller for Wearables
Simplified Block Diagram
MAX32625/MAX32626
96 MHz
4 MHz
SRSTN
TCK / SWCLK
TMS / SWDIO
TDO
TDI
ARM CORTEX-M4
WITH FPU
NVIC
JTAG SWD (Serial
Wire Debug)
MEMORY
512KB FLASH
RSTN
POR,
BROWNOUT
MONITOR,
SUPPLY VOLTAGE
MONITORS
GPIO WITH
INTERRUPTS
6 × 32 BIT TIMERS
16 × PULSE TRAIN
ENGINE
32B FIFOS
3 × SPI MASTER
GPIO AND
SHARED PAD
FUNCTIONS
TIMERS/PWM
CAPTURE/COMPARE
UP TO 40
GPIO/
SPECIAL
FUNCTION
160KB SRAM
8KB CACHE
BUS MATRIX – AHB, APB, IBUS, DBUS…
1 × SPI SLAVE
1 × SPI XIP
2 × I
2
C MASTER
1 × I
2
C SLAVE
(MAX. 2 PORTS)
32B FIFOS
V
DDIOH
V
DDIO
V
DD12
V
DD18
V
RTC
V
SS
16B FIFOS
VOLTAGE
REGULATION &
POWER CONTROL
PERIPHERAL
MANAGEMENT UNIT
SPI
SPI XIP
I
2
C
UART
1-Wire
EXTERNAL
INTERRUPTS
2 × WINDOWED
WATCHDOG TIMER
RECOVERY
WATCHDOG TIMER
3 × UART
32KHz OUTPUT
32KHz
CRYSTAL
DP
DM
V
DDB
REAL-TIME
CLOCK
WAKE UP TIMER
USB 2.0 FULL
SPEED
CONTROLLER
1-WIRE MASTER
AES-128,-192,-256
CRC 16/32
INDIVIDUALLY
SELECTABLE
V
DDIO
OR V
DDIOH
SUPPLY
FOR EACH PIN
UNIQUE ID
V
DDIO
V
DDIOH
TRUST PROTECTION UNIT (TPU)
MAA
SECURE NV KEY
TRNG
MAX32626 ONLY
10-BIT
ΣΔ
ADC
÷5
AIN0
AIN1
AIN2
AIN3
÷5
÷4
÷2
V
DDB
V
DD18
V
DD12
V
RTC
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Maxim Integrated
│
4
MAX32625/MAX32626
Ultra-Low Power, High-Performance
ARM Cortex-M4 with FPU-Based
Microcontroller for Wearables
Total Current into All V
DDIO
and V
DDIOH
Power Pins Combined (Sink) .......................................100mA
Total Current into V
SS
......................................................100mA
Output Current (Sink) by Any I/O Pin .................................25mA
Output Current (Source) by Any I/O Pin............................-25mA
Continuous Package Power Dissipation TQFN (multilayer board)
T
A
= +70°C (derate 49.5mW/°C above +70°C)......3960.4mW
Operating Temperature Range ........................... -30°C to +85°C
Storage Temperature Range ............................ -65°C to +150°C
Soldering Temperature (reflow) .......................................+260°C
Absolute Maximum Ratings
V
DD18
.................................................................-0.3V to +1.89V
V
DD12
.................................................................-0.3V to +1.32V
V
RTC
...................................................................-0.3V to +1.89V
V
DDB
....................................................................-0.3V to +3.6V
V
DDIO
...................................................................-0.3V to +3.6V
V
DDIOH
.................................................................-0.3V to +3.6V
32KIN, 32KOUT....................................................-0.3V to +3.6V
RSTN, SRSTN, DP, DM, GPIO, JTAG .................-0.3V to +3.6V
AIN[1:0].................................................................-0.3V to +5.5V
AIN[3:2].................................................................-0.3V to +3.6V
(All voltages with respect to V
SS
, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Information
63 WLP
PACKAGE CODE
Outline Number
Land Pattern Number
Thermal Resistance, Single Layer Board:
Junction-to-Ambient (θ
JA
)
Junction-to-Case Thermal Resistance (θ
JC
)
Thermal Resistance, Four Layer Board:
Junction-to-Ambient (θ
JA
)
Junction-to-Case Thermal Resistance (θ
JC
)
35.87ºC/W
N/A
N/A
N/A
21-100084
Refer to
Application Note 1891
W6333B+1
68 TQFN
PACKAGE CODE
Outline Number
Land Pattern Number
Thermal Resistance, Single Layer Board:
Junction-to-Ambient (θ
JA
)
Junction-to-Case Thermal Resistance (θ
JC
)
Thermal Resistance, Four Layer Board:
Junction-to-Ambient (θ
JA
)
Junction-to-Case Thermal Resistance (θ
JC
)
20.20ºC/W
1ºC/W
N/A
N/A
21-0510
90-0354
T6888+1
For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packaging.
Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
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Maxim Integrated
│
5
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