Operating Temperature Range ........................ -40NC to +105NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial
.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
BATT
= 5V to 28V, V
AA
= V
DD
, T
A
= -40NC to +105NC. Typical values are at V
BATT
= 14V, f
EX
= 300kHz, T
A
= +25NC, unless oth-
erwise noted.) (Note 2)
PARAMETER
Average Power-Supply Current
CAPACITANCE-TO-DIGITAL CONVERTER
Bit Resolution
CRNG_[1:0] = 10
Input Capacitance Range
CRNG_[1:0] = 01
CRNG_[1:0] = 00
Input Capacitance LSB
Resolution
Integral Nonlinearity
Differential Nonlinearity
Sampling Time
Number of Effective Bits
DC Input Current of SINPUT1,
SINPUT2
INPUT CAPACITANCE EXCITATION SOURCE
Source Peak-to-Peak Voltage
Minimum Excitation Frequency
f
EXMIN
300kHz excitation frequency
Frequency Control register = 0x0A (Note 3)
0.96
1.0
100
1.21
V
P-P
kHz
INL
DNL
f
EX
= 300kHz (Note 3)
584
20pF capacitance range
10pF capacitance range
5pF capacitance range
12
20
10
5
4.8
2.4
1.2
1
0.5
600
11
300
624
%FS
LSB
Fs
Bits
nA
fF
pF
Bits
SYMBOL
CONDITIONS
16ms capacitance-to-digital (C2D) con-
version time, two active channels; CPU in
sleep mode
MIN
TYP
100
MAX
120
UNITS
FA
2
Automotive, Two-Channel Proximity and
Touch Sensor
ELECTRICAL CHARACTERISTICS (continued)
(V
BATT
= 5V to 28V, V
AA
= V
DD
, T
A
= -40NC to +105NC. Typical values are at V
BATT
= 14V, f
EX
= 300kHz, T
A
= +25NC, unless oth-
erwise noted.) (Note 2)
Maximum Excitation Frequency
PARAMETER
CAPACITIVE OFFSET DACS
Offset Adjustment Range
Offset Adjustment Resolution
LOGIC INPUTS/OUTPUTS (P0._,
RESET)
Output Logic Low
V
OL
Output Logic High
Input Logic Low
Input Logic High
Leakage Current
Port 0 Interrupt Minimum Pulse
Width
Output Logic Low
Leakage Current
MICROCONTROLLER
Flash Program Memory Size
Program Memory Clear Time
Page Write Time
Maximum Flash Erase/Write
Cycles
SRAM Size
CPU Clock Frequency
INTERNAL OSCILLATOR
Oscillator Frequency
VOLTAGE REGULATOR
Input Voltage
Maximum Dropout Voltage
Quiescent Current
Output Voltage
V
BATT
V
DROP
I
Q
V
AA
5V < V
BATT
< 28V, 0 < I
AA
< 10mA
3.2
I
AA
= 10mA
5
14
0.6
8
3.4
3.6
28
V
V
FA
V
Master oscillator
RC oscillator
19.8
31.7
20.48
32
21.2
32.2
MHz
kHz
f
CPU
t
CPM
t
W
n
CYC
16 bits wide
2k
38
10
100k
128
1.25
Words
ms
ms
Cycles
Bytes
MHz
V
OL2
I
L
V
OH
V
IL
V
IH
I
L
I
SINK
= 2mA
I
SOURCE
= 2mA
3.0V < V
DD
< 3.6V
3.0V < V
DD
< 3.6V
I/O = high impedance
3.0V < V
DD
< 3.6V
2.4
0.01
20
1
V
DD
- 0.5
0.8
6 bits
63
1
0.4
pF
pF
V
V
V
V
FA
ns
f
EXMAX
SYMBOL
Frequency Control register = 0x32 (Note 3)
CONDITIONS
MIN
500
TYP
MAX
kHz
UNITS
MAX1441
HIGH-VOLTAGE OPEN-DRAIN OUTPUTS (OUT1, OUT2)
I
SINK
= 2mA
V
OUT1
= V
OUT2
= 25V
0.5
1
V
FA
Note 2:
All units are production tested at T
A
= +25NC and T
A
= +105NC. Limits over the operating temperature range are guaran-
teed by design and characterization.
Note 3:
Measured indirectly by testing the excitation signal frequency. The excitation signal frequency is determined by the master
oscillator frequency, which in turn determines the sample time.
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