NJL6163R
HIGH SPEED PIN PHOTO DIODE
s
GENERAL DESCRIPTION
The NJL6163R is the PIN photo diode, which
attain high speed (fc : 200MHz) and high
sensitivity (S : 0.65A/W).
It shrinks the outline by COBP(Chip on Board
volume compared with lead frame type.
2 .5
s
OUTLINE (typ.)
Unit : mm
x
0.5
0.3
0 .7
4 .9
2.5
1.16
1.0
0.3
Package), and attain under half package
•
High speed, high sensitivity
•
Super miniature, super thin type
(2.5mmX4.9mmX1.16mm)
y
1.0
(2x)R0.3
s
APPLICATIONS
•
Laser monitor for CD-R/RW etc.
•
Reading the signal for optical communication
etc.
x
anode
y
cathode
s
ABSOLUTE MAXIMUM RATINGS
(Ta=25°C)
PARAMETER
Reverse Voltage
Operating Temperature
Storage Temperature
Soldering Temperature
SYMBOL
V
R
T
opr
T
stg
T
sol
RATINGS
35
-30
~
+85
-40
~
+100
260 (10sec.)
UNIT
V
°C
°C
°C
s
ELECTRO-OPTICAL CHARACTERISTICS
(Ta=25°C)
PARAMETER
Dark Current
Forward Voltage
Capacitance
Peak Wavelength
Sensitivity
Cut off Frequency
SYMBOL
I
D
V
F
C
t
λ
P
S
fc
(-3dB)
TEST CONDITION
V
R
=10V
I
F
=1mA
V
R
=2.0V, f=1MHz
MIN
—
V
R
=2.0V,
λ=780nm
V
R
=0.7V,
λ=780nm,
RL=50Ω
V
R
=2.0V,
λ=780nm,
RL=50Ω
—
—
—
—
0.50
—
—
TYP
0.1
—
10
800
0.65
150
200
MAX
2.0
1.0
—
—
—
—
—
UNIT
nA
V
pF
nm
A/W
MHz
MHz
-1-
1 .35
s
FEATURES
1.3 5
NJL6163R
s
TYPICAL CHARACTERISTICS
Relative Sensitivity vs. Illuminance (Ta=25°C)
1.00E-02
VR=2.0V,
λ
=780nm
1.00E-03
Relative Sensitivity (%)
80%
100%
Spectral Response (Ta=25°C)
Light Current IL (A)
1.00E-04
1.00E-05
1.00E-06
60%
40%
1.00E-07
1.00E-08
0.01
20%
0.1
1
10
Illuninance (mW/cm
2
)
100
0%
500
600
700 800 900 1000 1100
Wavelength
λ
(nm)
Dark Current vs. Temperature
1.0E-08
VR=2.0V
1.0E-09
Relative Sensitivity (%)
Dark Current D (A)
I
Relative Sensitivity vs. Temperature
110%
108%
106%
104%
102%
100%
98%
96%
94%
92%
VR=2.0V,
λ
=780nm
1.0E-10
1.0E-11
1.0E-12
1.0E-13
-40 -20
90%
0
20
40
60
80 100
-40 -20
0
20
40
60
80 100
Ambient Temperature Ta (°C)
Ambient Temperature Ta (°C)
Rise Time vs. Reverse Voltage (Ta=25°C)
20
λ
=780nm, RL=50
Ω
15
Rise Time tr (ns)
Fall Time vs. Reverse Voltage (Ta=25°C)
20
λ
=780nm, RL=50
Ω
15
Fall Time tf (ns)
10
10
5
5
0
0
1
2
3
4
Reverse Voltage VR (V)
5
0
0
1
2
3
4
Reverse Voltage VR (V)
5
-2-
NJL6163R
Relative Sensitivity vs. Frequency (Ta=25°C)
0
-1
Relative Sensitivity (dB)
-2
-3
-4
-5
-6
1
10
100
1000
Frequency f (MHz)
VR=2.0V,
λ
=780nm,
RL=50
Ω
Capasitance Cj (pF)
Capacitance vs. Reverse Voltage (Ta=25°C)
15
14
13
12
11
10
9
8
0
1
2
3
4
Reverse Voltage VR (V)
5
s
MEASURING CIRCUIT FOR RESPONSE TIME
OSC
P.G.
Input
Laser
50Ω
NJL6163R
Output
tr
tf
90%
10%
-3-
NJL6163R
PRECAUTION FOR HANDLING
1. Soldering to actual circuit board
Soldering condition
- Heated condition of plastic package.
Lower than 240°C of maximum surface temperature, less than 30 seconds of time kept higher than 200°C.
Soldering Method
1) Reflow Method
Recommended temperature profile of its method.
x
Preparatory heating condition
: 120
~
150°C about 60 sec.
y
Recommended soldering temperature : 230
~
240°C about 3
~
5 sec.
z
Slowly cool down right after soldering.
{
Soldering to be done within twice under this condition.
(°C)
250
200
150
100
50
0
Time
2) Reflow Method
(In
case of infrared heating)
- Temperature profile : Same to the above
- Avoid direct irradiation to the plastic package because it is mold resin, absorbs the Infrared Radiation and its surface
temperature will be higher than lead itself.
3) The other method
Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method
(VPS).
If the device is heated to high temperature and kept in its condition for longer time, it would affect to its reliability.
It is necessary to solder in short time as soon as possible.
Preparatory heating
60
~
120 sec.
Less than
30 sec.
3
~
5 sec.
240°C max.
2. Cleaning
Avoid washing of the device after soldering by reflow method.
3. Attention in handling
1) Treat not to touch the lens surface.
2) Avoid dust and any other foreign materials (paint, bonding material, etc.) on the lens surface.
3) When mounting, special care has to be taken on the mounting position and tilting of the device because it is very
important to place the device to the optimum position to the object.
4. Storage
In order to prevent from degradation of this device in moisturing at reflow method, so that this device is contained in
dampproof packaging. So that mount the device as short as possible after opening the envelope.
-4-
NJL6163R
NJL6163R Taping Specification
1. Taping Size
1) Carrier tape is used with Styrene type Carbonated Plastic.
2) Cover tape is used with electro statistically prevention treated Polyester type tape.
3) Product taping direction is to place the index mark against the pull out direction of the tape as in the drawing.
Pull out direction of tape
2.0
4.0
φ
1.5
(TE1)
5.5
1.75
0.3
5.4
2.9
4.0
Carrier tape
Cover tape
1.5
2. Taping Strength
Pullup the cover tape from the carrier tape, and when the opening angle comes around 10
~
15°, and the peeling-off
strength is to be within the power of 20
~
70g.
3. Packaging
1) The taped products are to be rolled up on the taping reel as on the drawing.
2) Rolling up specification
x
Start Rolling : Carrier tape open space more than 20 Pieces.
y
End of Rolling : Carrier tape open space more than 20 Pieces, and 2 round of reel space at the cover tape only.
3) Taping quantity : 2,000 Pieces
4) Seal off after putting each reels in a dampproof bag with silica gel (3 bags).
13
Label
φ
13
12.0
φ
180
φ
60
-5-
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