D Flip-Flop, 4000/14000/40000 Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, CMOS, CDIP16
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Harris |
Reach Compliance Code | unknown |
其他特性 | RADIATION HARDENED; INPUT AC PARAMETRIC VALUES NOT FROM POST RADIATION MEASUREMENT |
系列 | 4000/14000/40000 |
JESD-30 代码 | R-CDIP-T16 |
JESD-609代码 | e0 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP |
最大频率@ Nom-Sup | 2000000 Hz |
最大I(ol) | 0.00036 A |
位数 | 4 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | COMPLEMENTARY |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5/15 V |
Prop。Delay @ Nom-Sup | 675 ns |
传播延迟(tpd) | 540 ns |
认证状态 | Not Qualified |
筛选级别 | 38535V;38534K;883S |
最大供电电压 (Vsup) | 18 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
总剂量 | 1M Rad(Si) V |
触发器类型 | POSITIVE EDGE |
最小 fmax | 1.48 MHz |
Base Number Matches | 1 |
CD40175BDMSH | 5962R9660601VEC | CD40175BDMSR | 5962R9660601VXC | 5962R9660601VEX | CD40175BKMSH | CD40175BKMSR | |
---|---|---|---|---|---|---|---|
描述 | D Flip-Flop, 4000/14000/40000 Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, CMOS, CDIP16 | D Flip-Flop, 4000/14000/40000 Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, CMOS, CDIP16 | D Flip-Flop, 4000/14000/40000 Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, CMOS, CDIP16 | D Flip-Flop, 4000/14000/40000 Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, CMOS, CDFP16 | D Flip-Flop, 4000/14000/40000 Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, CMOS, CDIP16 | D Flip-Flop, 4000/14000/40000 Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, CMOS, CDFP16 | D Flip-Flop, 4000/14000/40000 Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, CMOS, CDFP16 |
厂商名称 | Harris | Harris | Harris | Harris | Harris | Harris | Harris |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
系列 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
JESD-30 代码 | R-CDIP-T16 | R-CDIP-T16 | R-CDIP-T16 | R-CDFP-F16 | R-CDIP-T16 | R-CDFP-F16 | R-CDFP-F16 |
逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
位数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | DIP | DIP | DFP | DIP | DFP | DFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | FLATPACK | IN-LINE | FLATPACK | FLATPACK |
传播延迟(tpd) | 540 ns | 540 ns | 540 ns | 540 ns | 540 ns | 540 ns | 540 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | YES | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | FLAT |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
总剂量 | 1M Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 1M Rad(Si) V | 100k Rad(Si) V |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
最小 fmax | 1.48 MHz | 1.48 MHz | 1.48 MHz | 1.48 MHz | 1.48 MHz | 1.48 MHz | 1.48 MHz |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
是否Rohs认证 | 不符合 | - | 不符合 | - | - | 不符合 | 不符合 |
其他特性 | RADIATION HARDENED; INPUT AC PARAMETRIC VALUES NOT FROM POST RADIATION MEASUREMENT | - | RADIATION HARDENED; INPUT AC PARAMETRIC VALUES NOT FROM POST RADIATION MEASUREMENT | - | - | RADIATION HARDENED; INPUT AC PARAMETRIC VALUES NOT FROM POST RADIATION MEASUREMENT | RADIATION HARDENED; INPUT AC PARAMETRIC VALUES NOT FROM POST RADIATION MEASUREMENT |
JESD-609代码 | e0 | e4 | e0 | e4 | - | e0 | e0 |
负载电容(CL) | 50 pF | - | 50 pF | - | - | 50 pF | 50 pF |
最大频率@ Nom-Sup | 2000000 Hz | - | 2000000 Hz | - | - | 2000000 Hz | 2000000 Hz |
最大I(ol) | 0.00036 A | - | 0.00036 A | - | - | 0.00036 A | 0.00036 A |
封装等效代码 | DIP16,.3 | - | DIP16,.3 | - | - | FL16,.3 | FL16,.3 |
电源 | 5/15 V | - | 5/15 V | - | - | 5/15 V | 5/15 V |
Prop。Delay @ Nom-Sup | 675 ns | - | 675 ns | - | - | 675 ns | 675 ns |
筛选级别 | 38535V;38534K;883S | - | 38535V;38534K;883S | - | - | 38535V;38534K;883S | 38535V;38534K;883S |
端子面层 | Tin/Lead (Sn/Pb) | GOLD | Tin/Lead (Sn/Pb) | GOLD | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子节距 | 2.54 mm | - | 2.54 mm | - | - | 1.27 mm | 1.27 mm |
包装说明 | - | DIP, | DIP, DIP16,.3 | DFP, | DIP, | - | DFP, FL16,.3 |
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