电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

84817-504001LF

产品描述High Speed / Modular Connectors 120P 5R VRT SGNL HDR PRESS-FIT STRAIGHT
产品类别连接器   
文件大小135KB,共18页
制造商FCI [First Components International]
下载文档 详细参数 全文预览

84817-504001LF在线购买

供应商 器件名称 价格 最低购买 库存  
84817-504001LF - - 点击查看 点击购买

84817-504001LF概述

High Speed / Modular Connectors 120P 5R VRT SGNL HDR PRESS-FIT STRAIGHT

84817-504001LF规格参数

参数名称属性值
产品种类
Product Category
High Speed / Modular Connectors
制造商
Manufacturer
FCI [First Components International]
RoHSDetails
产品
Product
Headers
位置数量
Number of Positions
120 Position
排数
Number of Rows
5 Row
节距
Pitch
2 mm
端接类型
Termination Style
Through Hole
触点材料
Contact Material
Copper Alloy
外壳材料
Housing Material
Liquid Crystal Polymer (LCP)
安装角
Mounting Angle
Straight
系列
Packaging
Bulk
工厂包装数量
Factory Pack Quantity
24

文档预览

下载PDF文档
NUMBER
TYPE
GS-12-110
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
Metral™ 1000 Series – 5 Row
Metral™ 2000 Series – 5 Row
1 of 18
AUTHORIZED BY
DATE
K
10 JUN 14
S ALOSIUS
STATUS
UNRESTRICTED
TABLE OF CONTENTS
1.
2.
3.
OBJECTIVE............................................................................................................................................... 3
SCOPE ...................................................................................................................................................... 3
GENERAL ................................................................................................................................................. 3
3.1.
Usage ................................................................................................................................................. 3
3.2.
Visual ................................................................................................................................................. 4
3.3.
Banned/Restricted Substances ......................................................................................................... 4
3.4.
Manufacturing Processability ............................................................................................................. 4
APPLICABLE DOCUMENTS ................................................................................................................... 4
4.1.
Standards and Specifications ............................................................................................................ 4
4.2.
FCI Documents .................................................................................................................................. 5
4.2.1.
Process Specifications ................................................................................................................... 5
4.2.2.
Standards and Test Specifications ................................................................................................ 5
4.3.
Lab Reports - Supporting Data .......................................................................................................... 5
REQUIREMENTS ...................................................................................................................................... 5
5.1.
Qualification ....................................................................................................................................... 5
5.2.
Material .............................................................................................................................................. 6
5.2.1.
Metallic Parts .................................................................................................................................. 6
5.2.2.
Plastic Parts ................................................................................................................................... 6
5.3.
Finish ................................................................................................................................................. 6
ELECTRICAL CHARACTERISTICS ........................................................................................................ 7
6.1.
Low Level Contact Resistance .......................................................................................................... 7
6.2.
Insulation Resistance......................................................................................................................... 7
6.3.
Dielectric Withstanding Voltage ......................................................................................................... 7
6.4.
Current Rating.................................................................................................................................... 7
6.5.
Capacitance ....................................................................................................................................... 8
6.6.
Inductance ......................................................................................................................................... 8
6.7.
Propagation Delay ............................................................................................................................. 8
6.8.
Characteristic Impedance .................................................................................................................. 8
6.9.
Crosstalk ............................................................................................................................................ 9
MECHANICAL CHARACTERISTICS ..................................................................................................... 10
7.1.
Mating/Unmating Force ................................................................................................................... 10
7.2.
Header Signal Compliant Pin Insertion/Retention Force ................................................................. 10
7.3.
Receptacle Signal Compliant Contact Insertion/Retention Force ................................................... 10
7.4.
PCB Hole Deformation Radius ........................................................................................................ 10
7.5.
PCB Hole Wall Damage .................................................................................................................. 10
ENVIRONMENTAL CONDITIONS.......................................................................................................... 11
8.1.
Thermal Shock ................................................................................................................................. 11
8.2.
Humidity ........................................................................................................................................... 11
8.3.
High Temperature Life ..................................................................................................................... 11
8.4.
Mixed Flowing Gas (4-Gas) ............................................................................................................. 12
8.5.
Vibration Sinusoidal ......................................................................................................................... 12
8.6.
Mechanical Shock ............................................................................................................................ 12
GS-01-001
4.
5.
6.
7.
8.
Copyright FCI
Form E-3334
Rev F
PDS: Rev :K
STATUS:Released
Printed: Jun 16, 2014
modelsim 仿真2分频的问题?
testbench: reg inclk0;reg rst; wire c0;//wire c1; // assign statements (if any) din10 i1 (// port map - connection between master ports and signals/registers .c0(c0),//.c1(c1), ......
maxcio FPGA/CPLD
Wince中为什么文件内存映射读写时会占用程序内存空间
hFile = CreateFileForMapping(); hMap = CreateFileMapping(hFile,); pHead = MapViewOfFile(hMap); BYTE * pData = new BYTE; memcpy(pData,pHead,nSize ......
RAINORSHINE 嵌入式系统
微软研发神奇臂带让胳膊变成触摸屏
38987 Skinput能够解决MP3等小玩意儿触摸屏越来越小的问题 38988 Skinput能够识别在手上敲打出来的电话号码 38989 研究人员表示,我们的皮肤是一个完美的显示面,能够永远伴随着我 ......
fish001 创意市集
为啥我老是搞没水平的制作呢?为啥没水平还敢上来发呢?为啥还是“骰子”呢?
没水平~~~ 20个月零5天前无聊也制作了一个“骰子”,一如既往的没水平,链接在这里:http://hi.baidu.com/haorongwu/item/8f6e72e77565f3aecf2d4f9a 不过之前的是用单片机做的,叫做“摇摇骰子 ......
5号 51单片机
谁有CXA1019M最简单的FM部分电路图
谁有CXA1019M最简单的FM部分电路图...
maliang365 无线连接
【科学防疫】红外体温快速筛查仪如何筑起第一道防线?
自武汉爆发新型冠状病毒感染的肺炎疫情以来,多家民企奋不顾身的投入到这场众志成城的疫情攻坚战中。作为国内红外测温设备的领军企业,高德红外公司上下齐心协力,关键岗位员工春节假期无休,生 ......
eric_wang 测试/测量

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2871  1281  909  2678  2205  45  52  41  10  33 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved